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TW200801906A - Cooler module and heat pipe for cooler module - Google Patents

Cooler module and heat pipe for cooler module

Info

Publication number
TW200801906A
TW200801906A TW095120336A TW95120336A TW200801906A TW 200801906 A TW200801906 A TW 200801906A TW 095120336 A TW095120336 A TW 095120336A TW 95120336 A TW95120336 A TW 95120336A TW 200801906 A TW200801906 A TW 200801906A
Authority
TW
Taiwan
Prior art keywords
heat pipe
cooler module
heat
cpu
wall thickness
Prior art date
Application number
TW095120336A
Other languages
English (en)
Other versions
TWI315815B (en
Inventor
Chi-Wei Tien
Jenq-Haur Pan
Chang-Yuan Wu
Original Assignee
Compal Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compal Electronics Inc filed Critical Compal Electronics Inc
Priority to TW095120336A priority Critical patent/TWI315815B/zh
Priority to US11/717,840 priority patent/US20070284096A1/en
Publication of TW200801906A publication Critical patent/TW200801906A/zh
Application granted granted Critical
Publication of TWI315815B publication Critical patent/TWI315815B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW095120336A 2006-06-08 2006-06-08 Cooler module and heat pipe for cooler module TWI315815B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095120336A TWI315815B (en) 2006-06-08 2006-06-08 Cooler module and heat pipe for cooler module
US11/717,840 US20070284096A1 (en) 2006-06-08 2007-03-14 Cooler module and heat pipe for cooler module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095120336A TWI315815B (en) 2006-06-08 2006-06-08 Cooler module and heat pipe for cooler module

Publications (2)

Publication Number Publication Date
TW200801906A true TW200801906A (en) 2008-01-01
TWI315815B TWI315815B (en) 2009-10-11

Family

ID=38820708

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120336A TWI315815B (en) 2006-06-08 2006-06-08 Cooler module and heat pipe for cooler module

Country Status (2)

Country Link
US (1) US20070284096A1 (zh)
TW (1) TWI315815B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9689623B2 (en) * 2015-11-05 2017-06-27 Chaun-Choung Technology Corp. Composite structure of flat heat pipe and heat conduction device thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
JPH05243441A (ja) * 1992-03-03 1993-09-21 Ito Gijutsu Kenkiyuushitsu:Kk 放熱装置
JPH08264694A (ja) * 1995-03-20 1996-10-11 Calsonic Corp 電子部品用冷却装置
US7152667B2 (en) * 2001-10-10 2006-12-26 Fujikura Ltd. Tower type finned heat pipe type heat sink
US6973964B2 (en) * 2004-03-30 2005-12-13 Hsu Hul-Chun End surface structure of heat pipe for contact with a heat source
US7324341B2 (en) * 2005-09-22 2008-01-29 Delphi Technologies, Inc. Electronics assembly and heat pipe device

Also Published As

Publication number Publication date
TWI315815B (en) 2009-10-11
US20070284096A1 (en) 2007-12-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees