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TW200801508A - Method and apparatus for detection of mechanical defects in an ingot piece composed of semiconductor material - Google Patents

Method and apparatus for detection of mechanical defects in an ingot piece composed of semiconductor material

Info

Publication number
TW200801508A
TW200801508A TW96121736A TW96121736A TW200801508A TW 200801508 A TW200801508 A TW 200801508A TW 96121736 A TW96121736 A TW 96121736A TW 96121736 A TW96121736 A TW 96121736A TW 200801508 A TW200801508 A TW 200801508A
Authority
TW
Taiwan
Prior art keywords
ingot piece
planar surface
ingot
mechanical defects
detection
Prior art date
Application number
TW96121736A
Other languages
English (en)
Other versions
TWI356165B (en
Inventor
Ludwig Koester
Peter Czurratis
Klaus Kraemer
Original Assignee
Siltronic Ag
Sam Tec Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag, Sam Tec Gmbh filed Critical Siltronic Ag
Publication of TW200801508A publication Critical patent/TW200801508A/zh
Application granted granted Critical
Publication of TWI356165B publication Critical patent/TWI356165B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/11—Analysing solids by measuring attenuation of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/07—Analysing solids by measuring propagation velocity or propagation time of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/225—Supports, positioning or alignment in moving situation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
    • G01N29/265—Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the sensor relative to a stationary material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/044—Internal reflections (echoes), e.g. on walls or defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/262—Linear objects
    • G01N2291/2626—Wires, bars, rods

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW96121736A 2006-06-22 2007-06-15 Method for the production of a multiplicity of sem TWI356165B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006028650 2006-06-22
DE102006032431A DE102006032431B4 (de) 2006-06-22 2006-07-13 Verfahren und Vorrichtung zur Detektion von mechanischen Defekten in einem aus Halbleitermaterial bestehenden Stabstück

Publications (2)

Publication Number Publication Date
TW200801508A true TW200801508A (en) 2008-01-01
TWI356165B TWI356165B (en) 2012-01-11

Family

ID=38721275

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96121736A TWI356165B (en) 2006-06-22 2007-06-15 Method for the production of a multiplicity of sem

Country Status (4)

Country Link
JP (1) JP5331745B2 (zh)
CN (1) CN101093212B (zh)
DE (1) DE102006032431B4 (zh)
TW (1) TWI356165B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492318B (zh) * 2008-03-31 2015-07-11 通用電機股份有限公司 用於形成晶圓級封裝的系統與方法
TWI789480B (zh) * 2018-01-11 2023-01-11 日商迪思科股份有限公司 晶圓的評價方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008002832B4 (de) 2008-04-24 2010-12-09 Institut für Akustomikroskopie Dr. Krämer GmbH Verfahren und Vorrichtung zur zerstörungsfreien Detektion von Defekten im Inneren von Halbleitermaterial
US8508239B2 (en) * 2009-05-05 2013-08-13 Lam Research Corporation Non-destructive signal propagation system and method to determine substrate integrity
DE202009018526U1 (de) 2009-10-15 2011-12-09 Institut für Akustomikroskopie Dr. Krämer GmbH Vorrichtung zur zerstörungsfreien Inspektion des Inneren von Bauteilen und Transducer hierfür
DE102009044254A1 (de) 2009-10-15 2011-05-05 Institut für Akustomikroskopie Dr. Krämer GmbH Vorrichtung zur zerstörungsfreien Inspektion des Inneren von Bauteilen und Transducer hierfür
WO2012117088A1 (de) 2011-03-03 2012-09-07 Institut für Akustomikroskopie Dr. Krämer GmbH Vorrichtung zur zerstörungsfreien inspektion des inneren von bauteilen
CN102928280A (zh) * 2012-11-15 2013-02-13 苏州华碧微科检测技术有限公司 一种超声波扫描器件处理方法
CN104022182A (zh) * 2014-05-29 2014-09-03 浙江矽盛电子有限公司 一种硅片的生产控制、分选方法
JP5931263B1 (ja) * 2015-10-14 2016-06-08 株式会社日立パワーソリューションズ 超音波映像装置
DE102019208670A1 (de) 2019-06-14 2020-12-17 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben aus Silizium
EP3940124B1 (de) 2020-07-14 2024-01-03 Siltronic AG Kristallstück aus monokristallinem silizium
TWI870884B (zh) * 2022-06-03 2025-01-21 美商應用材料股份有限公司 監控基板上的聲學事件

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DE2504988C2 (de) * 1974-02-15 1984-08-23 The Board Of Trustees Of The Leland Stanford Junior University, Stanford, Calif. Akustisches Mikroskop
DE2936882C2 (de) * 1979-09-12 1985-03-21 Kraftwerk Union AG, 4330 Mülheim Prüfeinrichtung zur Feststellung und Analyse von Materialfehlern
JPS5917154A (ja) * 1982-07-20 1984-01-28 Kobe Steel Ltd 超音波法による欠陥の検出方法
JPS5960354A (ja) * 1982-09-30 1984-04-06 Toshiba Corp 超音波探傷装置
JPS61241659A (ja) * 1985-04-19 1986-10-27 Hitachi Micro Comput Eng Ltd 検査装置
JPS63121748A (ja) * 1986-11-10 1988-05-25 Hitachi Constr Mach Co Ltd 超音波探傷装置
JP2600076B2 (ja) * 1988-03-23 1997-04-16 科学技術庁無機材質研究所長 ビスマス系超電導セラミック厚膜の形成方法
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JP3861833B2 (ja) * 2003-03-14 2006-12-27 株式会社日立製作所 超音波検査方法及び装置
CN100372059C (zh) * 2003-12-24 2008-02-27 上海宏力半导体制造有限公司 形成半导体材料晶片的方法及其结构
KR20050078907A (ko) * 2004-02-03 2005-08-08 엘지전자 주식회사 고밀도 광디스크의 서브타이틀 재생방법과 기록재생장치
DE202006020868U1 (de) * 2005-04-11 2010-07-29 Pva Tepla Analytical Systems Gmbh Akustisches Rastermikroskop

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492318B (zh) * 2008-03-31 2015-07-11 通用電機股份有限公司 用於形成晶圓級封裝的系統與方法
TWI789480B (zh) * 2018-01-11 2023-01-11 日商迪思科股份有限公司 晶圓的評價方法

Also Published As

Publication number Publication date
TWI356165B (en) 2012-01-11
CN101093212B (zh) 2011-02-16
DE102006032431B4 (de) 2011-12-01
CN101093212A (zh) 2007-12-26
DE102006032431A1 (de) 2007-12-27
JP5331745B2 (ja) 2013-10-30
JP2010175560A (ja) 2010-08-12

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