TW200801434A - Loop type heat dissipating apparatus with spray cooling device - Google Patents
Loop type heat dissipating apparatus with spray cooling deviceInfo
- Publication number
- TW200801434A TW200801434A TW095120789A TW95120789A TW200801434A TW 200801434 A TW200801434 A TW 200801434A TW 095120789 A TW095120789 A TW 095120789A TW 95120789 A TW95120789 A TW 95120789A TW 200801434 A TW200801434 A TW 200801434A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- chamber
- spray device
- loop type
- cooling device
- Prior art date
Links
Classifications
-
- H10W40/73—
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- H10W40/475—
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S165/00—Heat exchange
- Y10S165/908—Fluid jets
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Special Spraying Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095120789A TWI279518B (en) | 2006-06-12 | 2006-06-12 | Loop type heat dissipating apparatus with spray cooling device |
| CN200610092299.3A CN101090625B (zh) | 2006-06-12 | 2006-06-16 | 具有雾化器的主动式环路型散热装置 |
| US11/594,149 US7882889B2 (en) | 2006-06-12 | 2006-11-08 | Loop type heat dissipating apparatus with sprayer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095120789A TWI279518B (en) | 2006-06-12 | 2006-06-12 | Loop type heat dissipating apparatus with spray cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI279518B TWI279518B (en) | 2007-04-21 |
| TW200801434A true TW200801434A (en) | 2008-01-01 |
Family
ID=38645435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095120789A TWI279518B (en) | 2006-06-12 | 2006-06-12 | Loop type heat dissipating apparatus with spray cooling device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7882889B2 (zh) |
| CN (1) | CN101090625B (zh) |
| TW (1) | TWI279518B (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11318212B2 (en) | 2017-08-31 | 2022-05-03 | Daiichi Sankyo Company, Limited | Method for producing antibody-drug conjugate |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101668404B (zh) * | 2008-09-01 | 2012-09-05 | 研能科技股份有限公司 | 微流体输送及雾化装置 |
| CN101478868B (zh) * | 2009-01-23 | 2012-06-13 | 北京奇宏科技研发中心有限公司 | 散热装置 |
| CN102235615A (zh) * | 2010-04-21 | 2011-11-09 | 中国科学院工程热物理研究所 | 一种腔式发光二极管灯 |
| CN102514733B (zh) * | 2011-12-28 | 2014-04-09 | 北京航空航天大学 | 一种基于微重力环境的喷雾冷却回路装置 |
| US9500413B1 (en) * | 2012-06-14 | 2016-11-22 | Google Inc. | Thermosiphon systems with nested tubes |
| US9099295B2 (en) * | 2012-11-21 | 2015-08-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses having sloped vapor outlet channels |
| AU2013201383B2 (en) * | 2013-03-01 | 2015-07-02 | Royal Melbourne Institute Of Technology | Atomisation apparatus using surface acoustic wave generaton |
| TWI558303B (zh) * | 2013-11-21 | 2016-11-11 | 旭德科技股份有限公司 | 散熱裝置 |
| EP3113590B1 (en) * | 2015-06-30 | 2020-11-18 | ABB Schweiz AG | Cooling apparatus |
| US10934936B2 (en) | 2017-07-10 | 2021-03-02 | Rolls-Royce North American Technologies, Inc. | Cooling system in a hybrid electric propulsion gas turbine engine for cooling electrical components therein |
| US10842044B2 (en) | 2017-07-10 | 2020-11-17 | Rolls-Royce North American Technologies, Inc. | Cooling system in hybrid electric propulsion gas turbine engine |
| TW201945680A (zh) * | 2018-04-26 | 2019-12-01 | 泰碩電子股份有限公司 | 具不同管徑的迴路熱管 |
| US10968830B2 (en) | 2018-06-22 | 2021-04-06 | Rolls-Royce North American Technologies, Inc. | Systems and methods for cooling electronics and electrical machinery in a hybrid electric aircraft |
| CN109210640A (zh) * | 2018-09-11 | 2019-01-15 | 珠海格力电器股份有限公司 | 一种散热装置和使用该散热装置的空调器 |
| JP7190654B2 (ja) * | 2018-09-21 | 2022-12-16 | パナソニックIpマネジメント株式会社 | 冷却装置、プロジェクタ、および、受熱ユニット |
| CN109298762A (zh) * | 2018-10-24 | 2019-02-01 | Oppo广东移动通信有限公司 | 电子装置、显示屏组件、显示面板以及热源温度检测方法 |
| US11181323B2 (en) | 2019-02-21 | 2021-11-23 | Qualcomm Incorporated | Heat-dissipating device with interfacial enhancements |
| WO2020223017A1 (en) * | 2019-04-29 | 2020-11-05 | Qualcomm Incorporated | Multi-phase heat dissipating device comprising piezo structures |
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| US3344853A (en) * | 1965-11-02 | 1967-10-03 | Ralph M Singer | Apparatus for condensing and controlling the rate of condensation of an electricallyconducting liquid |
| US3444419A (en) * | 1967-02-21 | 1969-05-13 | Hughes Aircraft Co | Evaporatively cooled traveling-wave tube |
| US3792293A (en) * | 1971-11-22 | 1974-02-12 | A Marks | Electrostatic generator with charging and collecting arrays |
| US4523112A (en) * | 1981-02-23 | 1985-06-11 | Marks Alvin M | Electrothermodynamic (ETD) power converter with conical jet |
| US4572285A (en) * | 1984-12-10 | 1986-02-25 | The United States Of America As Represented By The Department Of Energy | Magnetically focused liquid drop radiator |
| US6629646B1 (en) * | 1991-04-24 | 2003-10-07 | Aerogen, Inc. | Droplet ejector with oscillating tapered aperture |
| GB9301811D0 (en) | 1993-01-29 | 1993-03-17 | Unilever Plc | Fabric softener composition |
| JP3233808B2 (ja) * | 1995-03-17 | 2001-12-04 | 富士通株式会社 | 電子パッケージの冷却システム |
| US5943211A (en) * | 1997-04-18 | 1999-08-24 | Raytheon Company | Heat spreader system for cooling heat generating components |
| US5768103A (en) * | 1996-08-30 | 1998-06-16 | Motorola, Inc. | Circuit board apparatus and apparatus and method for spray-cooling an electronic component |
| US6427453B1 (en) * | 1998-07-31 | 2002-08-06 | The Texas A&M University System | Vapor-compression evaporative air conditioning systems and components |
| US6708515B2 (en) * | 2001-02-22 | 2004-03-23 | Hewlett-Packard Development Company, L.P. | Passive spray coolant pump |
| TW508487B (en) | 2001-06-11 | 2002-11-01 | Jia-Hau Li | Thermal exchange structure of annular-looped hot tube |
| TW502101B (en) | 2001-08-17 | 2002-09-11 | Jia-Hau Li | plate-type annular loop heat pipe |
| US7108056B1 (en) * | 2002-10-18 | 2006-09-19 | Atec Advanced Thermal And Environmental Concepts | Slit-type restrictor for controlling flow delivery to electrohydrodynamic thin film evaporator |
| US6888721B1 (en) * | 2002-10-18 | 2005-05-03 | Atec Corporation | Electrohydrodynamic (EHD) thin film evaporator with splayed electrodes |
| TW557124U (en) * | 2003-02-20 | 2003-10-01 | Delta Electronics Inc | Circulative cooler apparatus |
| TWI225584B (en) | 2003-05-05 | 2004-12-21 | Liang-Hua Wang | CPU convection heat dissipation method |
| US7369469B2 (en) * | 2003-09-02 | 2008-05-06 | Matsushita Electric Industrial Co., Ltd. | Laser power control apparatus and method, an optical disk apparatus and a recording method |
| TWI241156B (en) | 2003-12-05 | 2005-10-01 | Hon Hai Prec Ind Co Ltd | Method of combining fins with heat duct |
| TWI236337B (en) | 2004-02-06 | 2005-07-11 | Cpumate Inc | Forming method of heat pipe and dissipation fin |
| JP2005229033A (ja) * | 2004-02-16 | 2005-08-25 | Hitachi Ltd | 液冷システムおよびそれを備えた電子機器 |
| JP2005291645A (ja) * | 2004-04-01 | 2005-10-20 | Calsonic Kansei Corp | ループ状ヒートパイプ及びその製造方法 |
| TWM260724U (en) | 2004-07-02 | 2005-04-01 | Yeh Chiang Technology Corp | Improved structure of micro heating plate |
| TWM270407U (en) | 2004-10-12 | 2005-07-11 | Jen-Shian Chen | Flat light-emitting source structure with heat sink device |
| TWI251656B (en) | 2004-12-03 | 2006-03-21 | Hon Hai Prec Ind Co Ltd | Boiling chamber cooling device |
| CN100491888C (zh) * | 2005-06-17 | 2009-05-27 | 富准精密工业(深圳)有限公司 | 环路式热交换装置 |
-
2006
- 2006-06-12 TW TW095120789A patent/TWI279518B/zh not_active IP Right Cessation
- 2006-06-16 CN CN200610092299.3A patent/CN101090625B/zh not_active Expired - Fee Related
- 2006-11-08 US US11/594,149 patent/US7882889B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11318212B2 (en) | 2017-08-31 | 2022-05-03 | Daiichi Sankyo Company, Limited | Method for producing antibody-drug conjugate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101090625A (zh) | 2007-12-19 |
| US20070284090A1 (en) | 2007-12-13 |
| US7882889B2 (en) | 2011-02-08 |
| CN101090625B (zh) | 2010-06-09 |
| TWI279518B (en) | 2007-04-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |