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TW200703636A - Micro lens and its manufacturing method - Google Patents

Micro lens and its manufacturing method

Info

Publication number
TW200703636A
TW200703636A TW094122900A TW94122900A TW200703636A TW 200703636 A TW200703636 A TW 200703636A TW 094122900 A TW094122900 A TW 094122900A TW 94122900 A TW94122900 A TW 94122900A TW 200703636 A TW200703636 A TW 200703636A
Authority
TW
Taiwan
Prior art keywords
substrate
lens substrate
image
lens
manufacturing
Prior art date
Application number
TW094122900A
Other languages
English (en)
Other versions
TWI289352B (en
Inventor
Kuen-Chr Wang
Original Assignee
Asia Optical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Optical Co Inc filed Critical Asia Optical Co Inc
Priority to TW094122900A priority Critical patent/TWI289352B/zh
Priority to US11/439,117 priority patent/US20070010122A1/en
Priority to JP2006184424A priority patent/JP4226617B2/ja
Publication of TW200703636A publication Critical patent/TW200703636A/zh
Application granted granted Critical
Publication of TWI289352B publication Critical patent/TWI289352B/zh
Priority to US12/947,873 priority patent/US20110061799A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0073—Optical laminates

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Lens Barrels (AREA)
TW094122900A 2005-07-06 2005-07-06 Micro lens and its manufacturing method TWI289352B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW094122900A TWI289352B (en) 2005-07-06 2005-07-06 Micro lens and its manufacturing method
US11/439,117 US20070010122A1 (en) 2005-07-06 2006-05-24 Miniaturized lens assembly and method for making the same
JP2006184424A JP4226617B2 (ja) 2005-07-06 2006-07-04 マイクロ撮影装置及びその製造方法
US12/947,873 US20110061799A1 (en) 2005-07-06 2010-11-17 Miniaturized Lens Assembly and Method for Making the Same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094122900A TWI289352B (en) 2005-07-06 2005-07-06 Micro lens and its manufacturing method

Publications (2)

Publication Number Publication Date
TW200703636A true TW200703636A (en) 2007-01-16
TWI289352B TWI289352B (en) 2007-11-01

Family

ID=37618828

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094122900A TWI289352B (en) 2005-07-06 2005-07-06 Micro lens and its manufacturing method

Country Status (3)

Country Link
US (2) US20070010122A1 (zh)
JP (1) JP4226617B2 (zh)
TW (1) TWI289352B (zh)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102129116A (zh) * 2010-01-14 2011-07-20 夏普株式会社 摄像镜头、摄像模块以及便携式信息设备
US8373936B2 (en) 2010-04-12 2013-02-12 Sharp Kabushiki Kaisha Image sensing lens and image sensing module
US8400718B2 (en) 2009-07-14 2013-03-19 Sharp Kabushiki Kaisha Image pickup lens and image pickup module
US8422147B2 (en) 2011-04-05 2013-04-16 Sharp Kabushiki Kaisha Image pickup lens and image pickup module
US8462448B2 (en) 2009-08-07 2013-06-11 Sharp Kabushiki Kaisha Image sensing module, imaging lens and code reading method
US8520127B2 (en) 2009-10-08 2013-08-27 Sharp Kabushiki Kaisha Image pickup lens comprising aperture stop and single lens, image pickup module comprising image pickup lens including aperture stop and single lens, method for manufacturing image pickup lens comprising aperture stop and single lens, and method for manufacturing image pickup module comprising image pickup lens including aperture stop and single lens
TWI412808B (zh) * 2008-04-25 2013-10-21 Hon Hai Prec Ind Co Ltd 鏡頭模組之製造方法
TWI468652B (zh) * 2007-06-08 2015-01-11 Hamamatsu Photonics Kk Spectrometer and its manufacturing method
TWI470296B (zh) * 2012-05-25 2015-01-21 Himax Tech Ltd 晶圓級鏡頭及其製造方法
TWI503614B (zh) * 2013-11-13 2015-10-11 光學式影像擷取模組及其製作方法、及光學輔助單元
TWI571667B (zh) * 2015-06-17 2017-02-21 玉晶光電股份有限公司 具有背膠型遮光元件的鏡頭
TWI584361B (zh) * 2011-11-10 2017-05-21 豪威科技股份有限公司 晶圓級相機、用於晶圓級相機的晶圓間隔層及其製造方法
US10677964B2 (en) 2017-10-23 2020-06-09 Omnivision Technologies, Inc. Lens wafer assembly and associated method for manufacturing a stepped spacer wafer

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CA2685080A1 (en) 2007-04-24 2008-11-06 Flextronics Ap Llc Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly
WO2008133946A1 (en) * 2007-04-24 2008-11-06 Flextronics Ap Llc Auto focus/ zoom modules using wafer level optics
US20100214458A1 (en) * 2007-08-02 2010-08-26 Masashi Saito Method for Manufacturing Imaging Device, Imaging Device and Portable Terminal
JP2009047949A (ja) * 2007-08-21 2009-03-05 Alps Electric Co Ltd 光学素子の製造方法
US20090159200A1 (en) * 2007-12-19 2009-06-25 Heptagon Oy Spacer element and method for manufacturing a spacer element
JP2011508914A (ja) * 2008-01-08 2011-03-17 エルジー イノテック カンパニー，リミティド レンズユニット、レンズアセンブリ、カメラモジュール、カメラモジュール及びレンズアセンブリの製造方法、光学部材の製造方法及び光学部材の製造装置
US9118825B2 (en) * 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
WO2010020062A1 (en) * 2008-08-20 2010-02-25 Heptagon Oy Method of manufacturing a pluralty of optical devices
JP2009253427A (ja) * 2008-08-25 2009-10-29 Cheng Uei Precision Industry Co Ltd カメラモジュールとその製造方法
JP5165524B2 (ja) * 2008-10-10 2013-03-21 シャープ株式会社 ウエハスケールレンズ、ウエハスケールモジュール、および、電子機器
TWI417594B (zh) * 2008-10-31 2013-12-01 Hon Hai Prec Ind Co Ltd 晶圓級鏡頭模組及其製造方法
CN101872033B (zh) * 2009-04-24 2014-04-30 鸿富锦精密工业（深圳）有限公司 遮光片阵列、遮光片阵列制造方法及镜头模组阵列
WO2010134376A1 (ja) * 2009-05-18 2010-11-25 コニカミノルタオプト株式会社 撮像レンズ、撮像装置及び携帯端末
US9419032B2 (en) 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
TW201109164A (en) * 2009-09-11 2011-03-16 E Pin Optical Industry Co Ltd Stacked disk-shaped optical lens array, stacked lens module and their method of manufacturing thereof
JP2011090018A (ja) * 2009-09-24 2011-05-06 Sharp Corp 撮像レンズ、撮像モジュール、撮像レンズの製造方法、および、撮像モジュールの製造方法
JP2013015545A (ja) * 2009-10-27 2013-01-24 Sanyo Electric Co Ltd レンズモジュール、撮影装置、レンズモジュールの製造方法
TWI741988B (zh) * 2015-07-31 2021-10-11 日商新力股份有限公司 堆疊式透鏡結構及其製造方法，以及電子裝置
CN205210390U (zh) * 2015-11-17 2016-05-04 瑞声声学科技(苏州)有限公司 镜头模组
TWI672537B (zh) * 2018-11-21 2019-09-21 大立光電股份有限公司 塑膠透鏡組、成像鏡頭模組及電子裝置

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JPH0227878A (ja) * 1988-07-18 1990-01-30 Hitachi Ltd 半導体装置及びそれを用いたビデオ・カメラ・ユニット並びにその製造方法
JP2723686B2 (ja) * 1991-04-01 1998-03-09 松下電子工業株式会社 固体撮像装置およびその製造方法
JP2000147215A (ja) * 1998-11-09 2000-05-26 Dainippon Printing Co Ltd レンチキュラーレンズシートおよびその製造方法
US6324010B1 (en) * 1999-07-19 2001-11-27 Eastman Kodak Company Optical assembly and a method for manufacturing lens systems
US6285064B1 (en) * 2000-03-28 2001-09-04 Omnivision Technologies, Inc. Chip scale packaging technique for optical image sensing integrated circuits
JP3809047B2 (ja) * 2000-05-10 2006-08-16 シャープ株式会社 対物レンズ鏡筒駆動装置及び光情報記録再生装置
JP2002290842A (ja) * 2001-03-23 2002-10-04 Sanyo Electric Co Ltd 固体撮像素子の製造方法
US20030115907A1 (en) * 2001-09-07 2003-06-26 Patton Edward K. Multiple lens molding system and method
US20030207212A1 (en) * 2002-05-02 2003-11-06 Law Benjamin Pain-Fong Micro-optics device and method for fabricating
JP2004029554A (ja) * 2002-06-27 2004-01-29 Olympus Corp 撮像レンズユニットおよび撮像装置
KR20070089889A (ko) * 2002-09-17 2007-09-03 앤터온 비.브이. 카메라 디바이스, 카메라 디바이스 제조 방법, 웨이퍼스케일 패키지 및 광학 어셈블리
TWI267208B (en) * 2006-01-18 2006-11-21 Visera Technologies Co Ltd Image sensor module
EP2087518A2 (en) * 2006-11-17 2009-08-12 Tessera North America Internal noise reducing structures in camera systems employing an optics stack and associated methods

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI468652B (zh) * 2007-06-08 2015-01-11 Hamamatsu Photonics Kk Spectrometer and its manufacturing method
TWI484144B (zh) * 2007-06-08 2015-05-11 Hamamatsu Photonics Kk Spectrometer and its manufacturing method
TWI412808B (zh) * 2008-04-25 2013-10-21 Hon Hai Prec Ind Co Ltd 鏡頭模組之製造方法
US8400718B2 (en) 2009-07-14 2013-03-19 Sharp Kabushiki Kaisha Image pickup lens and image pickup module
US8462448B2 (en) 2009-08-07 2013-06-11 Sharp Kabushiki Kaisha Image sensing module, imaging lens and code reading method
US8520127B2 (en) 2009-10-08 2013-08-27 Sharp Kabushiki Kaisha Image pickup lens comprising aperture stop and single lens, image pickup module comprising image pickup lens including aperture stop and single lens, method for manufacturing image pickup lens comprising aperture stop and single lens, and method for manufacturing image pickup module comprising image pickup lens including aperture stop and single lens
CN102129116A (zh) * 2010-01-14 2011-07-20 夏普株式会社 摄像镜头、摄像模块以及便携式信息设备
US8373936B2 (en) 2010-04-12 2013-02-12 Sharp Kabushiki Kaisha Image sensing lens and image sensing module
US8422147B2 (en) 2011-04-05 2013-04-16 Sharp Kabushiki Kaisha Image pickup lens and image pickup module
TWI584361B (zh) * 2011-11-10 2017-05-21 豪威科技股份有限公司 晶圓級相機、用於晶圓級相機的晶圓間隔層及其製造方法
TWI470296B (zh) * 2012-05-25 2015-01-21 Himax Tech Ltd 晶圓級鏡頭及其製造方法
TWI503614B (zh) * 2013-11-13 2015-10-11 光學式影像擷取模組及其製作方法、及光學輔助單元
TWI571667B (zh) * 2015-06-17 2017-02-21 玉晶光電股份有限公司 具有背膠型遮光元件的鏡頭
US10677964B2 (en) 2017-10-23 2020-06-09 Omnivision Technologies, Inc. Lens wafer assembly and associated method for manufacturing a stepped spacer wafer

Also Published As

Publication number Publication date
JP4226617B2 (ja) 2009-02-18
JP2007017974A (ja) 2007-01-25
TWI289352B (en) 2007-11-01
US20110061799A1 (en) 2011-03-17
US20070010122A1 (en) 2007-01-11

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees