TW200703537A - Substrate processing apparatus and substrate housing method - Google Patents

Substrate processing apparatus and substrate housing method

Info

Publication number: TW200703537A
Authority: TW; Taiwan
Prior art keywords: substrate; processing apparatus; substrate processing; housing method; transport means
Prior art date: 2005-03-22

Application number

TW095109170A

Other languages

English (en)

Other versions

TWI417977B (zh

Inventor

Katsuyuki Hashimoto

Original Assignee

Olympus Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-03-22

Filing date

2006-03-17

Publication date

2007-01-16

2006-03-17 Application filed by Olympus Corp filed Critical Olympus Corp

2007-01-16 Publication of TW200703537A publication Critical patent/TW200703537A/zh

2013-12-01 Application granted granted Critical

2013-12-01 Publication of TWI417977B publication Critical patent/TWI417977B/zh

Classifications

- H10P72/53—
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling

Landscapes

Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)
Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

TW095109170A 2005-03-22 2006-03-17 基材處理裝置與基材收納方法 TWI417977B (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2005081607A JP2006269497A (ja)	2005-03-22	2005-03-22	基板処理装置及び基板収納方法

Publications (2)

Publication Number	Publication Date
TW200703537A true TW200703537A (en)	2007-01-16
TWI417977B TWI417977B (zh)	2013-12-01

Family

ID=37015718

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW095109170A TWI417977B (zh)	2005-03-22	2006-03-17	基材處理裝置與基材收納方法

Country Status (4)

Country	Link
US (1)	US7747343B2 (zh)
JP (1)	JP2006269497A (zh)
CN (1)	CN100533704C (zh)
TW (1)	TWI417977B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US8600150B2 (en) *	2006-02-13	2013-12-03	Samsung Electronics Co., Ltd.	Wafer aligning apparatus and related method
JP4914761B2 (ja) *	2007-05-16	2012-04-11	オリンパス株式会社	外観検査装置
JP5303254B2 (ja) *	2008-12-15	2013-10-02	東京エレクトロン株式会社	異物除去方法及び記憶媒体
KR102238649B1 (ko) *	2014-09-16	2021-04-09	삼성전자주식회사	반도체 칩 본딩 장치
JP6985815B2 (ja) *	2017-05-09	2021-12-22	キヤノン株式会社	搬送装置、システム、および物品の製造方法
CN114235684A (zh) *	2020-09-09	2022-03-25	旺矽科技股份有限公司	巨观及微观检测设备及检测方法
KR102624577B1 (ko) *	2020-10-28	2024-01-15	세메스 주식회사	기판 처리 장치 및 기판 처리 방법
TW202238803A (zh) *	2021-02-26	2022-10-01	日商東京威力科創股份有限公司	搬運系統、搬運裝置及搬運方法
JP7609676B2 (ja) *	2021-03-29	2025-01-07	東京エレクトロン株式会社	基板処理装置及び基板搬送位置調整方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH07263518A (ja)	1994-03-18	1995-10-13	Fujitsu Ltd	半導体ウェハの搬送装置及び搬送方法並びに半導体ウェハ処理装置
JPH09102257A (ja)	1995-07-28	1997-04-15	Matsushita Electric Works Ltd	封止接点装置
US5822213A (en) *	1996-03-29	1998-10-13	Lam Research Corporation	Method and apparatus for determining the center and orientation of a wafer-like object
US5980194A (en) *	1996-07-15	1999-11-09	Applied Materials, Inc.	Wafer position error detection and correction system
TW350115B (en) *	1996-12-02	1999-01-11	Toyota Automatic Loom Co Ltd	Misregistration detection device and method thereof
KR20020031347A (ko) *	2000-04-27	2002-05-01	와다 다다시	반도체웨이퍼 및 반도체디바이스 제작프로세스용 장치
US6327517B1 (en) *	2000-07-27	2001-12-04	Applied Materials, Inc.	Apparatus for on-the-fly center finding and notch aligning for wafer handling robots
TW559855B (en)	2000-09-06	2003-11-01	Olympus Optical Co	Wafer transfer apparatus
US6678055B2 (en) *	2001-11-26	2004-01-13	Tevet Process Control Technologies Ltd.	Method and apparatus for measuring stress in semiconductor wafers
US6900877B2 (en) *	2002-06-12	2005-05-31	Asm American, Inc.	Semiconductor wafer position shift measurement and correction
US20050151947A1 (en) *	2002-07-31	2005-07-14	Nikon Corporation	Position measuring method, position control method, exposure method and exposure apparatus, and device manufacturing method
US7379785B2 (en) *	2002-11-28	2008-05-27	Tokyo Electron Limited	Substrate processing system, coating/developing apparatus, and substrate processing apparatus
JP3880589B2 (ja) *	2004-03-31	2007-02-14	キヤノン株式会社	位置計測装置、露光装置及びデバイス製造方法

2005
- 2005-03-22 JP JP2005081607A patent/JP2006269497A/ja not_active Withdrawn
2006
- 2006-03-16 US US11/377,509 patent/US7747343B2/en not_active Expired - Fee Related
- 2006-03-17 CN CNB2006100570585A patent/CN100533704C/zh not_active Expired - Fee Related
- 2006-03-17 TW TW095109170A patent/TWI417977B/zh not_active IP Right Cessation

Also Published As

Publication number	Publication date
US7747343B2 (en)	2010-06-29
US20060215152A1 (en)	2006-09-28
TWI417977B (zh)	2013-12-01
CN1838398A (zh)	2006-09-27
JP2006269497A (ja)	2006-10-05
CN100533704C (zh)	2009-08-26

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Legal Events

Date	Code	Title	Description
2021-09-01	MM4A	Annulment or lapse of patent due to non-payment of fees