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TW200627085A - Lithographic apparatus with multiple alignment arrangements and alignment measurement method - Google Patents

Lithographic apparatus with multiple alignment arrangements and alignment measurement method

Info

Publication number
TW200627085A
TW200627085A TW094144279A TW94144279A TW200627085A TW 200627085 A TW200627085 A TW 200627085A TW 094144279 A TW094144279 A TW 094144279A TW 94144279 A TW94144279 A TW 94144279A TW 200627085 A TW200627085 A TW 200627085A
Authority
TW
Taiwan
Prior art keywords
alignment
lithographic apparatus
detector
measurement method
arrangements
Prior art date
Application number
TW094144279A
Other languages
English (en)
Other versions
TWI314672B (en
Inventor
Bilsen Franciscus Bernardus Maria Van
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW200627085A publication Critical patent/TW200627085A/zh
Application granted granted Critical
Publication of TWI314672B publication Critical patent/TWI314672B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW094144279A 2004-12-27 2005-12-14 Lithographic apparatus with multiple alignment arrangemetns and alignment measurement method TWI314672B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/020,644 US7626701B2 (en) 2004-12-27 2004-12-27 Lithographic apparatus with multiple alignment arrangements and alignment measuring method

Publications (2)

Publication Number Publication Date
TW200627085A true TW200627085A (en) 2006-08-01
TWI314672B TWI314672B (en) 2009-09-11

Family

ID=35788688

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094144279A TWI314672B (en) 2004-12-27 2005-12-14 Lithographic apparatus with multiple alignment arrangemetns and alignment measurement method

Country Status (7)

Country Link
US (3) US7626701B2 (zh)
EP (1) EP1674938B1 (zh)
JP (3) JP4611886B2 (zh)
KR (1) KR100718741B1 (zh)
CN (1) CN100549832C (zh)
SG (2) SG158187A1 (zh)
TW (1) TWI314672B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9841299B2 (en) 2014-11-28 2017-12-12 Canon Kabushiki Kaisha Position determining device, position determining method, lithographic apparatus, and method for manufacturing object
TWI620039B (zh) * 2014-11-28 2018-04-01 佳能股份有限公司 位置判斷裝置、位置判斷方法、微影設備及用於製造物件的方法

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US7626701B2 (en) 2004-12-27 2009-12-01 Asml Netherlands B.V. Lithographic apparatus with multiple alignment arrangements and alignment measuring method
US8411271B2 (en) * 2005-12-28 2013-04-02 Nikon Corporation Pattern forming method, pattern forming apparatus, and device manufacturing method
JP2007208081A (ja) * 2006-02-02 2007-08-16 Oki Electric Ind Co Ltd アラインメントマーク、合わせマーク及び半導体装置の製造方法
NL2003414A (en) * 2008-10-07 2010-04-08 Asml Netherlands Bv Substrate measurement method and apparatus.
NL2008110A (en) * 2011-02-18 2012-08-21 Asml Netherlands Bv Measuring method, measuring apparatus, lithographic apparatus and device manufacturing method.
CN103048885B (zh) * 2011-10-11 2015-02-25 中山新诺科技股份有限公司 无掩膜曝光系统及方法
KR101326107B1 (ko) * 2011-12-20 2013-11-06 삼성디스플레이 주식회사 레이저 가공장치 및 그 제어방법
CN103365107B (zh) * 2012-04-11 2015-05-13 上海微电子装备有限公司 一种多离轴对准系统匹配测校方法
WO2014064290A1 (en) * 2012-10-26 2014-05-01 Mapper Lithography Ip B.V. Determining a position of a substrate in lithography
US9304403B2 (en) * 2013-01-02 2016-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for lithography alignment
CN104111594B (zh) * 2013-04-16 2016-09-28 上海微电子装备有限公司 基于信号频率的二维自参考干涉对准系统及对准方法
JP2014220263A (ja) * 2013-04-30 2014-11-20 キヤノン株式会社 リソグラフィ装置、及び物品の製造方法
NL2012694A (en) 2013-05-07 2014-11-10 Asml Netherlands Bv Alignment sensor, lithographic apparatus and alignment method.
WO2015110210A1 (en) * 2014-01-24 2015-07-30 Asml Netherlands B.V. Apparatus operable to perform a measurement operation on a substrate, lithographic apparatus, and method of performing a measurement operation on a substrate
KR101901770B1 (ko) 2014-05-13 2018-09-27 에이에스엠엘 네델란즈 비.브이. 계측에 사용하기 위한 기판 및 패터닝 디바이스, 계측 방법, 및 디바이스 제조 방법
JP6470528B2 (ja) * 2014-09-05 2019-02-13 キヤノン株式会社 検出装置、計測装置、露光装置、物品の製造方法、および計測方法
TWI579662B (zh) * 2015-10-05 2017-04-21 A multi-channel alignment system based on spectrum processing, an alignment signal processing method and a photolithography apparatus
US10585357B2 (en) 2015-12-28 2020-03-10 Asml Netherlands B.V. Alternative target design for metrology using modulation techniques
KR102738803B1 (ko) * 2016-02-24 2024-12-04 케이엘에이 코포레이션 광학 계측의 정확도 개선
CN110308620A (zh) * 2019-06-20 2019-10-08 合肥芯碁微电子装备有限公司 一种激光直接成像设备对准相机位置关系自动标定方法
CN114846412A (zh) * 2019-12-05 2022-08-02 Asml荷兰有限公司 对准方法和相关联的对准和光刻设备
US12033951B2 (en) * 2021-05-07 2024-07-09 Taiwan Semiconductor Manufacturing Company, Ltd. Alignment mark structure and method for making
JP2023124596A (ja) * 2022-02-25 2023-09-06 キヤノン株式会社 検出方法、検出装置、リソグラフィ装置、および物品の製造方法

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US6525805B2 (en) * 2001-05-14 2003-02-25 Ultratech Stepper, Inc. Backside alignment system and method
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JP4222927B2 (ja) * 2002-09-20 2009-02-12 エーエスエムエル ネザーランズ ビー．ブイ． 少なくとも２波長を使用するリソグラフィ装置用アライメント・システム
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US7626701B2 (en) 2004-12-27 2009-12-01 Asml Netherlands B.V. Lithographic apparatus with multiple alignment arrangements and alignment measuring method
US7414722B2 (en) * 2005-08-16 2008-08-19 Asml Netherlands B.V. Alignment measurement arrangement and alignment measurement method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9841299B2 (en) 2014-11-28 2017-12-12 Canon Kabushiki Kaisha Position determining device, position determining method, lithographic apparatus, and method for manufacturing object
TWI620039B (zh) * 2014-11-28 2018-04-01 佳能股份有限公司 位置判斷裝置、位置判斷方法、微影設備及用於製造物件的方法

Also Published As

Publication number Publication date
JP2009147370A (ja) 2009-07-02
US8018594B2 (en) 2011-09-13
US7626701B2 (en) 2009-12-01
US20120008126A1 (en) 2012-01-12
TWI314672B (en) 2009-09-11
JP2006186374A (ja) 2006-07-13
US20100091297A1 (en) 2010-04-15
EP1674938A1 (en) 2006-06-28
US8345245B2 (en) 2013-01-01
JP5571316B2 (ja) 2014-08-13
JP4611886B2 (ja) 2011-01-12
CN1797204A (zh) 2006-07-05
JP2009182335A (ja) 2009-08-13
EP1674938B1 (en) 2012-02-01
KR20060074873A (ko) 2006-07-03
SG123765A1 (en) 2006-07-26
CN100549832C (zh) 2009-10-14
KR100718741B1 (ko) 2007-05-15
US20060141374A1 (en) 2006-06-29
SG158187A1 (en) 2010-01-29

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees