TW200601400A - Ion implantation apparatus and method - Google Patents
Ion implantation apparatus and methodInfo
- Publication number
- TW200601400A TW200601400A TW094111407A TW94111407A TW200601400A TW 200601400 A TW200601400 A TW 200601400A TW 094111407 A TW094111407 A TW 094111407A TW 94111407 A TW94111407 A TW 94111407A TW 200601400 A TW200601400 A TW 200601400A
- Authority
- TW
- Taiwan
- Prior art keywords
- process condition
- regions
- substrate
- ion emission
- unit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H10P30/204—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
- H10D30/0227—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
- H10D62/235—Channel regions of field-effect devices of FETs of IGFETs
-
- H10P30/212—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
- H01J2237/30405—Details
- H01J2237/30411—Details using digital signal processors [DSP]
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004128057A JP2005310634A (ja) | 2004-04-23 | 2004-04-23 | イオン注入装置およびイオン注入方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200601400A true TW200601400A (en) | 2006-01-01 |
| TWI281692B TWI281692B (en) | 2007-05-21 |
Family
ID=35187623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094111407A TWI281692B (en) | 2004-04-23 | 2005-04-11 | Ion implantation apparatus and method |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20050244989A1 (zh) |
| JP (1) | JP2005310634A (zh) |
| KR (1) | KR100659645B1 (zh) |
| CN (1) | CN100405526C (zh) |
| TW (1) | TWI281692B (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009099857A (ja) | 2007-10-18 | 2009-05-07 | Toshiba Corp | 半導体装置の製造システムと製造方法 |
| US20090227096A1 (en) * | 2008-03-07 | 2009-09-10 | Varian Semiconductor Equipment Associates, Inc. | Method Of Forming A Retrograde Material Profile Using Ion Implantation |
| US8669539B2 (en) * | 2010-03-29 | 2014-03-11 | Advanced Ion Beam Technology, Inc. | Implant method and implanter by using a variable aperture |
| JP5211328B2 (ja) * | 2011-02-02 | 2013-06-12 | 日新イオン機器株式会社 | イオン注入方法およびイオン注入装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6055460A (en) * | 1997-08-06 | 2000-04-25 | Advanced Micro Devices, Inc. | Semiconductor process compensation utilizing non-uniform ion implantation methodology |
| JP4363694B2 (ja) * | 1998-04-17 | 2009-11-11 | 株式会社東芝 | イオン注入装置および半導体装置の製造方法 |
| JP3408762B2 (ja) * | 1998-12-03 | 2003-05-19 | シャープ株式会社 | Soi構造の半導体装置及びその製造方法 |
| JP2002203806A (ja) * | 2000-10-31 | 2002-07-19 | Toshiba Corp | 半導体装置の製造方法、ステンシルマスク及びその製造方法 |
-
2004
- 2004-04-23 JP JP2004128057A patent/JP2005310634A/ja active Pending
-
2005
- 2005-04-11 TW TW094111407A patent/TWI281692B/zh not_active IP Right Cessation
- 2005-04-21 KR KR1020050033017A patent/KR100659645B1/ko not_active Expired - Fee Related
- 2005-04-21 US US11/110,814 patent/US20050244989A1/en not_active Abandoned
- 2005-04-22 CN CNB2005100663496A patent/CN100405526C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1691270A (zh) | 2005-11-02 |
| US20050244989A1 (en) | 2005-11-03 |
| CN100405526C (zh) | 2008-07-23 |
| JP2005310634A (ja) | 2005-11-04 |
| KR100659645B1 (ko) | 2006-12-21 |
| TWI281692B (en) | 2007-05-21 |
| KR20060047311A (ko) | 2006-05-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |