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TW200601400A - Ion implantation apparatus and method - Google Patents

Ion implantation apparatus and method

Info

Publication number
TW200601400A
TW200601400A TW094111407A TW94111407A TW200601400A TW 200601400 A TW200601400 A TW 200601400A TW 094111407 A TW094111407 A TW 094111407A TW 94111407 A TW94111407 A TW 94111407A TW 200601400 A TW200601400 A TW 200601400A
Authority
TW
Taiwan
Prior art keywords
process condition
regions
substrate
ion emission
unit
Prior art date
Application number
TW094111407A
Other languages
English (en)
Other versions
TWI281692B (en
Inventor
Takeshi Shibata
Kazuhiko Tonari
Original Assignee
Toshiba Kk
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk, Ulvac Inc filed Critical Toshiba Kk
Publication of TW200601400A publication Critical patent/TW200601400A/zh
Application granted granted Critical
Publication of TWI281692B publication Critical patent/TWI281692B/zh

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H10P30/204
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00Television systems
    • H04N7/18Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0223Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
    • H10D30/0227Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
    • H10D62/235Channel regions of field-effect devices of FETs of IGFETs
    • H10P30/212
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/304Controlling tubes
    • H01J2237/30405Details
    • H01J2237/30411Details using digital signal processors [DSP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
TW094111407A 2004-04-23 2005-04-11 Ion implantation apparatus and method TWI281692B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004128057A JP2005310634A (ja) 2004-04-23 2004-04-23 イオン注入装置およびイオン注入方法

Publications (2)

Publication Number Publication Date
TW200601400A true TW200601400A (en) 2006-01-01
TWI281692B TWI281692B (en) 2007-05-21

Family

ID=35187623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094111407A TWI281692B (en) 2004-04-23 2005-04-11 Ion implantation apparatus and method

Country Status (5)

Country Link
US (1) US20050244989A1 (zh)
JP (1) JP2005310634A (zh)
KR (1) KR100659645B1 (zh)
CN (1) CN100405526C (zh)
TW (1) TWI281692B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009099857A (ja) 2007-10-18 2009-05-07 Toshiba Corp 半導体装置の製造システムと製造方法
US20090227096A1 (en) * 2008-03-07 2009-09-10 Varian Semiconductor Equipment Associates, Inc. Method Of Forming A Retrograde Material Profile Using Ion Implantation
US8669539B2 (en) * 2010-03-29 2014-03-11 Advanced Ion Beam Technology, Inc. Implant method and implanter by using a variable aperture
JP5211328B2 (ja) * 2011-02-02 2013-06-12 日新イオン機器株式会社 イオン注入方法およびイオン注入装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6055460A (en) * 1997-08-06 2000-04-25 Advanced Micro Devices, Inc. Semiconductor process compensation utilizing non-uniform ion implantation methodology
JP4363694B2 (ja) * 1998-04-17 2009-11-11 株式会社東芝 イオン注入装置および半導体装置の製造方法
JP3408762B2 (ja) * 1998-12-03 2003-05-19 シャープ株式会社 Soi構造の半導体装置及びその製造方法
JP2002203806A (ja) * 2000-10-31 2002-07-19 Toshiba Corp 半導体装置の製造方法、ステンシルマスク及びその製造方法

Also Published As

Publication number Publication date
CN1691270A (zh) 2005-11-02
US20050244989A1 (en) 2005-11-03
CN100405526C (zh) 2008-07-23
JP2005310634A (ja) 2005-11-04
KR100659645B1 (ko) 2006-12-21
TWI281692B (en) 2007-05-21
KR20060047311A (ko) 2006-05-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees