TW200513803A - Lithographic antireflective hardmask compositions and uses thereof - Google Patents
Lithographic antireflective hardmask compositions and uses thereofInfo
- Publication number
- TW200513803A TW200513803A TW093123125A TW93123125A TW200513803A TW 200513803 A TW200513803 A TW 200513803A TW 093123125 A TW093123125 A TW 093123125A TW 93123125 A TW93123125 A TW 93123125A TW 200513803 A TW200513803 A TW 200513803A
- Authority
- TW
- Taiwan
- Prior art keywords
- antireflective hardmask
- lithographic
- moiety
- hardmask compositions
- equals
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- H10P50/71—
-
- H10P76/2041—
-
- H10P76/2043—
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/634,667 US7223517B2 (en) | 2003-08-05 | 2003-08-05 | Lithographic antireflective hardmask compositions and uses thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200513803A true TW200513803A (en) | 2005-04-16 |
| TWI290265B TWI290265B (en) | 2007-11-21 |
Family
ID=34116083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093123125A TWI290265B (en) | 2003-08-05 | 2004-08-02 | Lithographic antireflective hardmask compositions and uses thereof |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7223517B2 (zh) |
| JP (1) | JP4042981B2 (zh) |
| KR (1) | KR100628824B1 (zh) |
| CN (1) | CN1321352C (zh) |
| TW (1) | TWI290265B (zh) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7507783B2 (en) * | 2003-02-24 | 2009-03-24 | Brewer Science Inc. | Thermally curable middle layer comprising polyhedral oligomeric silsesouioxanes for 193-nm trilayer resist process |
| JP4540327B2 (ja) * | 2003-11-06 | 2010-09-08 | ルネサスエレクトロニクス株式会社 | フォトマスクのパターン形成方法 |
| US7915369B2 (en) * | 2004-12-07 | 2011-03-29 | Panasonic Electric Works Co., Ltd. | Ultraviolet transmissive polyhedral silsesquioxane polymers |
| US7691275B2 (en) * | 2005-02-28 | 2010-04-06 | Board Of Regents, The University Of Texas System | Use of step and flash imprint lithography for direct imprinting of dielectric materials for dual damascene processing |
| US8163460B2 (en) * | 2005-05-24 | 2012-04-24 | Nissan Chemical Industries, Ltd. | Underlayer coating forming composition for lithography containing polysilane compound |
| US20070015082A1 (en) * | 2005-07-14 | 2007-01-18 | International Business Machines Corporation | Process of making a lithographic structure using antireflective materials |
| JP4692136B2 (ja) * | 2005-08-08 | 2011-06-01 | 東レ株式会社 | 感光性ペースト組成物およびそれを用いたフィールドエミッションディスプレイ部材 |
| US7544750B2 (en) * | 2005-10-13 | 2009-06-09 | International Business Machines Corporation | Top antireflective coating composition with low refractive index at 193nm radiation wavelength |
| JP4723992B2 (ja) * | 2005-12-12 | 2011-07-13 | 積水化学工業株式会社 | 樹脂組成物、絶縁基板、成型体、及び電子機器 |
| US7449538B2 (en) * | 2005-12-30 | 2008-11-11 | Hynix Semiconductor Inc. | Hard mask composition and method for manufacturing semiconductor device |
| JP2007272168A (ja) * | 2006-03-10 | 2007-10-18 | Tokyo Ohka Kogyo Co Ltd | レジスト下層膜用組成物及びこれを用いたレジスト下層膜 |
| US7468330B2 (en) | 2006-04-05 | 2008-12-23 | International Business Machines Corporation | Imprint process using polyhedral oligomeric silsesquioxane based imprint materials |
| US7704670B2 (en) * | 2006-06-22 | 2010-04-27 | Az Electronic Materials Usa Corp. | High silicon-content thin film thermosets |
| US20070298349A1 (en) * | 2006-06-22 | 2007-12-27 | Ruzhi Zhang | Antireflective Coating Compositions Comprising Siloxane Polymer |
| JP2008026500A (ja) * | 2006-07-20 | 2008-02-07 | Dainippon Printing Co Ltd | 高ドライエッチング耐性ポリマー層を付加したフォトマスクブランクスおよびそれを用いたフォトマスクの製造方法 |
| US7927664B2 (en) * | 2006-08-28 | 2011-04-19 | International Business Machines Corporation | Method of step-and-flash imprint lithography |
| US8168372B2 (en) * | 2006-09-25 | 2012-05-01 | Brewer Science Inc. | Method of creating photolithographic structures with developer-trimmed hard mask |
| US7842620B2 (en) | 2006-10-12 | 2010-11-30 | Nissan Chemical Industries, Ltd. | Method for manufacturing semiconductor device using quadruple-layer laminate |
| KR100802226B1 (ko) * | 2006-12-21 | 2008-02-11 | 주식회사 하이닉스반도체 | 듀얼 다마신 패턴 형성 방법 |
| KR101416030B1 (ko) * | 2006-12-22 | 2014-07-08 | 주식회사 동진쎄미켐 | 유기반사방지막 형성용 폴리머 및 이를 포함하는 조성물 |
| US8026040B2 (en) * | 2007-02-20 | 2011-09-27 | Az Electronic Materials Usa Corp. | Silicone coating composition |
| WO2008104874A1 (en) * | 2007-02-26 | 2008-09-04 | Az Electronic Materials Usa Corp. | Process for making siloxane polymers |
| JP2010519398A (ja) | 2007-02-27 | 2010-06-03 | エイゼット・エレクトロニック・マテリアルズ・ユーエスエイ・コーポレイション | ケイ素に基づく反射防止膜用組成物 |
| CN101641390B (zh) * | 2007-04-02 | 2013-05-01 | 第一毛织株式会社 | 具有抗反射性能的硬掩模组合物及用其图案化材料的方法 |
| WO2009084775A1 (en) * | 2007-12-28 | 2009-07-09 | Seoul National University Industry Foundation | Resist for e-beam lithography |
| WO2009132023A2 (en) * | 2008-04-23 | 2009-10-29 | Brewer Science Inc. | Photosensitive hardmask for microlithography |
| JP5611544B2 (ja) * | 2008-06-20 | 2014-10-22 | 昭和電工株式会社 | (メタ)アクリロイルオキシ基含有篭状シルセスキオキサン化合物およびその製造方法 |
| US8377631B2 (en) * | 2009-10-06 | 2013-02-19 | International Business Machines Corporation | Planarization over topography with molecular glass materials |
| WO2011054731A1 (en) * | 2009-11-05 | 2011-05-12 | Basf Se | Fluorescent materials |
| US8623447B2 (en) * | 2010-12-01 | 2014-01-07 | Xerox Corporation | Method for coating dielectric composition for fabricating thin-film transistors |
| US9011591B2 (en) | 2011-09-21 | 2015-04-21 | Dow Global Technologies Llc | Compositions and antireflective coatings for photolithography |
| US9068086B2 (en) | 2011-12-21 | 2015-06-30 | Dow Global Technologies Llc | Compositions for antireflective coatings |
| JP5700003B2 (ja) * | 2012-08-31 | 2015-04-15 | 大日本印刷株式会社 | 高ドライエッチング耐性ポリマー層を付加したフォトマスクブランクスを用いたフォトマスクの製造方法 |
| US9348228B2 (en) * | 2013-01-03 | 2016-05-24 | Globalfoundries Inc. | Acid-strippable silicon-containing antireflective coating |
| US8999625B2 (en) * | 2013-02-14 | 2015-04-07 | International Business Machines Corporation | Silicon-containing antireflective coatings including non-polymeric silsesquioxanes |
| US8999623B2 (en) | 2013-03-14 | 2015-04-07 | Wiscousin Alumni Research Foundation | Degradable neutral layers for block copolymer lithography applications |
| JP5742903B2 (ja) * | 2013-09-24 | 2015-07-01 | 大日本印刷株式会社 | フォトマスクブランクス |
| JP5979268B2 (ja) * | 2015-03-06 | 2016-08-24 | 大日本印刷株式会社 | フォトマスクブランクス |
| JP6252623B2 (ja) * | 2016-05-20 | 2017-12-27 | 大日本印刷株式会社 | フォトマスクブランクス |
| US9671694B1 (en) * | 2016-09-30 | 2017-06-06 | International Business Machines Corporation | Wet strippable gap fill materials |
| KR102512186B1 (ko) * | 2016-12-22 | 2023-03-20 | 일루미나, 인코포레이티드 | 수지 필름 및 패턴화된 중합체층을 포함하는 어레이 |
| KR200488601Y1 (ko) | 2017-04-17 | 2019-02-27 | 조경환 | 케이크 상자 |
| CN115586705A (zh) * | 2021-07-05 | 2023-01-10 | 上海微电子装备(集团)股份有限公司 | 一种曝光方法及显示面板 |
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| US4221688A (en) * | 1978-04-28 | 1980-09-09 | Dow Corning Corporation | Silicone emulsion which provides an elastomeric product and methods for preparation |
| US4371605A (en) | 1980-12-09 | 1983-02-01 | E. I. Du Pont De Nemours And Company | Photopolymerizable compositions containing N-hydroxyamide and N-hydroxyimide sulfonates |
| DE3278567D1 (en) * | 1981-10-03 | 1988-07-07 | Japan Synthetic Rubber Co Ltd | Solvent-soluble organopolysilsesquioxanes, processes for producing the same, and compositions and semiconductor devices using the same |
| US5085893A (en) * | 1989-07-28 | 1992-02-04 | Dow Corning Corporation | Process for forming a coating on a substrate using a silsesquioxane resin |
| US5674937A (en) * | 1995-04-27 | 1997-10-07 | Dow Corning Corporation | Elastomers from silicone emulsions having self-catalytic crosslinkers |
| JPH09219448A (ja) * | 1996-02-09 | 1997-08-19 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| US6521699B2 (en) * | 1996-09-26 | 2003-02-18 | Rhodia Chimie | Aqueous silicone dispersion |
| US6660823B1 (en) * | 1998-03-03 | 2003-12-09 | The United States Of America As Represented By The Secretary Of The Air Force | Modifying POSS compounds |
| US6087064A (en) * | 1998-09-03 | 2000-07-11 | International Business Machines Corporation | Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method |
| US6187505B1 (en) * | 1999-02-02 | 2001-02-13 | International Business Machines Corporation | Radiation sensitive silicon-containing resists |
| US6268457B1 (en) | 1999-06-10 | 2001-07-31 | Allied Signal, Inc. | Spin-on glass anti-reflective coatings for photolithography |
| US6890448B2 (en) * | 1999-06-11 | 2005-05-10 | Shipley Company, L.L.C. | Antireflective hard mask compositions |
| US6100417A (en) * | 1999-08-31 | 2000-08-08 | The United States Of America As Represented By The Secretary Of The Air Force | Functionalizing olefin bearing silsesquioxanes |
| US6420088B1 (en) * | 2000-06-23 | 2002-07-16 | International Business Machines Corporation | Antireflective silicon-containing compositions as hardmask layer |
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| US6517958B1 (en) * | 2000-07-14 | 2003-02-11 | Canon Kabushiki Kaisha | Organic-inorganic hybrid light emitting devices (HLED) |
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| US6759460B2 (en) * | 2001-03-08 | 2004-07-06 | Asahi Kasei Kabushiki Kaisha | Resin composition |
| US7008749B2 (en) * | 2001-03-12 | 2006-03-07 | The University Of North Carolina At Charlotte | High resolution resists for next generation lithographies |
| DE60204502T2 (de) * | 2001-03-27 | 2006-05-18 | Samsung Electronics Co., Ltd., Suwon | Polysiloxanharz und Verfahren zur Herstellung einer Zwischenschicht daraus für Wafer |
| TW594416B (en) * | 2001-05-08 | 2004-06-21 | Shipley Co Llc | Photoimageable composition |
| US6936537B2 (en) | 2001-06-19 | 2005-08-30 | The Boc Group, Inc. | Methods for forming low-k dielectric films |
| US6569932B2 (en) * | 2001-07-06 | 2003-05-27 | Benjamin S. Hsiao | Blends of organic silicon compounds with ethylene-based polymers |
| US6767930B1 (en) * | 2001-09-07 | 2004-07-27 | Steven A. Svejda | Polyhedral oligomeric silsesquioxane polyimide composites |
| US6730454B2 (en) * | 2002-04-16 | 2004-05-04 | International Business Machines Corporation | Antireflective SiO-containing compositions for hardmask layer |
| US6818555B2 (en) * | 2002-10-07 | 2004-11-16 | Taiwan Semiconductor Manufacturing Co., Ltd | Method for metal etchback with self aligned etching mask |
| TW200413417A (en) * | 2002-10-31 | 2004-08-01 | Arch Spec Chem Inc | Novel copolymer, photoresist compositions thereof and deep UV bilayer system thereof |
| US7507783B2 (en) * | 2003-02-24 | 2009-03-24 | Brewer Science Inc. | Thermally curable middle layer comprising polyhedral oligomeric silsesouioxanes for 193-nm trilayer resist process |
| US7232864B2 (en) * | 2003-10-30 | 2007-06-19 | Bening Robert C | Coupled radial anionic polymers |
-
2003
- 2003-08-05 US US10/634,667 patent/US7223517B2/en not_active Expired - Fee Related
-
2004
- 2004-07-05 KR KR1020040052049A patent/KR100628824B1/ko not_active Expired - Lifetime
- 2004-07-30 JP JP2004223337A patent/JP4042981B2/ja not_active Expired - Fee Related
- 2004-07-30 CN CNB2004100588147A patent/CN1321352C/zh not_active Expired - Lifetime
- 2004-08-02 TW TW093123125A patent/TWI290265B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100628824B1 (ko) | 2006-09-27 |
| TWI290265B (en) | 2007-11-21 |
| KR20050015992A (ko) | 2005-02-21 |
| JP4042981B2 (ja) | 2008-02-06 |
| US20050031964A1 (en) | 2005-02-10 |
| CN1321352C (zh) | 2007-06-13 |
| CN1595296A (zh) | 2005-03-16 |
| US7223517B2 (en) | 2007-05-29 |
| JP2005055893A (ja) | 2005-03-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |