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TW200511408A - Apparatus for laser beam machining, machining mask, method for laser beam machining, method for manufacturing a semiconductor device and semiconductor device - Google Patents

Apparatus for laser beam machining, machining mask, method for laser beam machining, method for manufacturing a semiconductor device and semiconductor device

Info

Publication number
TW200511408A
TW200511408A TW093119083A TW93119083A TW200511408A TW 200511408 A TW200511408 A TW 200511408A TW 093119083 A TW093119083 A TW 093119083A TW 93119083 A TW93119083 A TW 93119083A TW 200511408 A TW200511408 A TW 200511408A
Authority
TW
Taiwan
Prior art keywords
laser beam
machining
semiconductor device
beam machining
manufacturing
Prior art date
Application number
TW093119083A
Other languages
English (en)
Other versions
TWI240319B (en
Inventor
Hiroshi Ikegami
Makoto Sekine
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200511408A publication Critical patent/TW200511408A/zh
Application granted granted Critical
Publication of TWI240319B publication Critical patent/TWI240319B/zh

Links

Classifications

    • H10P50/282—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • H10P52/00—
    • H10P54/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Drying Of Semiconductors (AREA)
TW093119083A 2003-09-01 2004-06-29 Apparatus for laser beam machining, machining mask, method for laser beam machining, method for manufacturing a semiconductor device and semiconductor device TWI240319B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003309338A JP3842769B2 (ja) 2003-09-01 2003-09-01 レーザ加工装置、レーザ加工方法、及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW200511408A true TW200511408A (en) 2005-03-16
TWI240319B TWI240319B (en) 2005-09-21

Family

ID=31884833

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119083A TWI240319B (en) 2003-09-01 2004-06-29 Apparatus for laser beam machining, machining mask, method for laser beam machining, method for manufacturing a semiconductor device and semiconductor device

Country Status (5)

Country Link
US (1) US20050045090A1 (zh)
JP (1) JP3842769B2 (zh)
CN (1) CN100339175C (zh)
GB (1) GB2405369B (zh)
TW (1) TWI240319B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI759044B (zh) * 2020-12-30 2022-03-21 環球晶圓股份有限公司 碳化矽晶片的雷射雕刻方法

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US8153511B2 (en) 2005-05-30 2012-04-10 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
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KR102402998B1 (ko) * 2017-05-22 2022-05-30 삼성디스플레이 주식회사 증착 마스크 제조방법 및 제조장치
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JP6953876B2 (ja) * 2017-08-04 2021-10-27 富士電機株式会社 炭化珪素半導体装置および炭化珪素半導体装置の製造方法
JP6896344B2 (ja) * 2017-09-22 2021-06-30 株式会社ディスコ チップの製造方法
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WO2019082313A1 (ja) * 2017-10-25 2019-05-02 株式会社ニコン 加工装置、及び、移動体の製造方法
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Also Published As

Publication number Publication date
GB0400800D0 (en) 2004-02-18
TWI240319B (en) 2005-09-21
GB2405369B (en) 2005-12-14
GB2405369A (en) 2005-03-02
CN1590007A (zh) 2005-03-09
CN100339175C (zh) 2007-09-26
US20050045090A1 (en) 2005-03-03
JP2005074485A (ja) 2005-03-24
JP3842769B2 (ja) 2006-11-08

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