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TW200504801A - Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device - Google Patents

Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device

Info

Publication number
TW200504801A
TW200504801A TW093114973A TW93114973A TW200504801A TW 200504801 A TW200504801 A TW 200504801A TW 093114973 A TW093114973 A TW 093114973A TW 93114973 A TW93114973 A TW 93114973A TW 200504801 A TW200504801 A TW 200504801A
Authority
TW
Taiwan
Prior art keywords
slurry
organic film
functional group
chemical mechanical
mechanical polishing
Prior art date
Application number
TW093114973A
Other languages
English (en)
Other versions
TWI241626B (en
Inventor
Hiroyuki Yano
Yukiteru Matsui
Gaku Minamihaba
Atsushi Shigeta
Yoshikuni Tateyama
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003157154A external-priority patent/JP4202826B2/ja
Priority claimed from JP2004076408A external-priority patent/JP4202955B2/ja
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200504801A publication Critical patent/TW200504801A/zh
Application granted granted Critical
Publication of TWI241626B publication Critical patent/TWI241626B/zh

Links

Classifications

    • H10W20/085—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H10P50/73—
    • H10P95/08—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
    • H10B12/0385—Making a connection between the transistor and the capacitor, e.g. buried strap

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW093114973A 2003-06-02 2004-05-26 Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device TWI241626B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003157154A JP4202826B2 (ja) 2003-06-02 2003-06-02 有機膜の化学的機械的研磨方法および半導体装置の製造方法
JP2004076408A JP4202955B2 (ja) 2004-03-17 2004-03-17 有機膜の化学的機械的研磨方法

Publications (2)

Publication Number Publication Date
TW200504801A true TW200504801A (en) 2005-02-01
TWI241626B TWI241626B (en) 2005-10-11

Family

ID=33513362

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093114973A TWI241626B (en) 2003-06-02 2004-05-26 Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device

Country Status (3)

Country Link
US (2) US7452819B2 (zh)
CN (1) CN100346451C (zh)
TW (1) TWI241626B (zh)

Cited By (1)

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TWI730970B (zh) * 2015-06-25 2021-06-21 日商福吉米股份有限公司 研磨方法及雜質去除用組成物以及基板及其製造方法

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CN114683162B (zh) * 2020-12-29 2023-09-12 中芯集成电路（宁波）有限公司 一种平坦化工艺方法
CN114291784B (zh) * 2021-07-19 2025-05-13 中北大学 一种基于大马士革工艺的mems开关牺牲层的制备方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI730970B (zh) * 2015-06-25 2021-06-21 日商福吉米股份有限公司 研磨方法及雜質去除用組成物以及基板及其製造方法

Also Published As

Publication number Publication date
CN100346451C (zh) 2007-10-31
TWI241626B (en) 2005-10-11
US8685857B2 (en) 2014-04-01
CN1574205A (zh) 2005-02-02
US7452819B2 (en) 2008-11-18
US20040253822A1 (en) 2004-12-16
US20090068841A1 (en) 2009-03-12

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