RU2587999C2 - Led light source and method of making same - Google Patents

Abstract

FIELD: lighting.

SUBSTANCE: invention relates to lighting engineering. LED light source includes one or more LED light source arrangements (100), wherein each of LED light source arrangements includes LED member (10) having first light emitting surface (11) and second light emitting surface (12) opposite first, and two fluorescent members (20, 30) located on top of first and second light emitting surfaces of LED member respectively. Fixing element (5) is connected with two fluorescent elements, holding LED in such a position that illumination, generated by light-emitting diode, is able to pass through said two fluorescent elements of light-emitting surfaces.

EFFECT: technical result is generating lighting at an angle greater than 180° and providing direct effective heat dissipation on all sides of LED.

13 cl, 36 dwg

Description

BACKGROUND OF THE INVENTION

Technical field

This invention relates to a light emitting diode, and more specifically to a LED light source and a method for manufacturing it, the LED light source having a structure that allows heat to be dissipated, and it can be implemented in the form of a lamp with a bulb containing an LED that creates a high light effect intensity, and the method of its manufacture is optimized with respect to cost reduction.

Description of the prior art

Traditional LED light sources for their efficient operation require a device for efficient heat dissipation. Typically, a mechanism or device for heat dissipation includes, in addition to natural convective heat transfer, the use of a cooling fan, a heat pipe, the creation of a heat sink using a radiator, etc. Using a cooling fan is difficult with relatively low reliability. The heat pipe has a relatively low heat dissipation rate. The heat sink using a radiator is limited by the surface area of its ribs. All these traditional constructive solutions cannot satisfactorily solve the problem of heat dissipation.

A traditional LED light source is a sealed structure including a substrate serving as a base and an LED in which one side is connected to the substrate and the other side emits light. In addition, resin is typically used to seal the LED so that it is attached to the substrate.

Recently, the problem of heat dissipation in LEDs has become one of the main obstacles to the implementation of LEDs in modern light sources. The design and structure of the device for heat dissipation in LEDs directly and to a large extent determine the durability and functionality of the LED light source. In addition, the traditional LED light source has only one light emitting surface, and the other attached surface is limited by the substrate and cannot be used, which leads to a relatively low light intensity and light output. Moreover, the emission of light rays by the attached surface is blocked by the substrate, and thus they are converted into thermal energy that accumulates around the attached surface and the substrate, creating a working environment with a relatively high temperature for the LED light source, while it is well known that higher temperature the working environment reduces the light output of the LED light source. Thus, the problem of heat dissipation in the LED is a vicious cycle associated with light output and the functioning of the LED light source.

Summary of the invention

This invention has significant advantages because it proposes an LED light source that significantly increases light output, reduces design complexity and reduces production costs.

Another advantage of the present invention is that an LED is provided that can emit light in both directions, which eliminates the accumulation of heat on the attached surface and the substrate, as is the case with conventional LED light sources.

Another advantage of this invention is that it proposes an LED that is placed between two fluorescent elements in the form of a sandwich structure such that one or more channel openings are formed through which direct heat transfer from the LED is effected.

Another advantage of this invention is that it proposes a two-layer LED that is directly connected to two fluorescent elements, forming a sandwich-like structure, and in which one or more than one channel opening is formed, through which direct heat transfer from the LED is carried out .

Another advantage of this invention is that it proposes a three-layer structure of the LED, which is placed between two fluorescent elements in which one or more than one hole of the channel is formed, through which direct heat transfer from the LED is carried out.

Another advantage of this invention is that it proposes an LED that is placed between two fluorescent elements and connected to them in such a way that a camera is formed to accommodate the LED, in which there is one, or more than one hole in the channel, and a gas such as an inert gas is used to fill the chamber to further increase heat dissipation.

Another advantage of the present invention is that an LED light source in the form of an incandescent lamp is provided, including a bulb body that defines a bulb cavity filled with an inert gas, into which at least one LED or LED matrix communicates therewith, that it becomes possible heat dissipation through the whole body of the bulb.

Another advantage of this invention is that it provides an LED light source in the form of an incandescent lamp, comprising a bulb body that defines a bulb cavity filled with an inert gas, into which at least one LED or LED matrix communicates with it, in this case, each LED or LED matrix is connected to the head in the body of the bulb or is held by it through a connecting element creating a light effect design, so that the lighting created vetodiodom or LED array within the cavity of the flask may reach across the illuminating surface heat flasks.

Additional advantages and distinguishing characteristics of the present invention will become apparent from the following description, and they can be realized through constructive solutions and their combinations, which will be noted in the attached claims.

According to this invention, the above and other objectives and advantages are achieved by an LED light source in the form of an incandescent lamp, which includes the body of the bulb, bounding the cavity of the bulb, which contains the gas filling it, and containing a luminous surface, and also includes:

LED matrix mounted inside the cavity of the bulb, held by means of the head in the bulb and designed to create lighting, while the LED matrix includes:

at least one LED, wherein each LED contains first and second light emitting surfaces intended to create lighting by electroluminescence;

two fluorescent elements, between which the LED is placed so that one of the light emitting surfaces faces directly to one of the fluorescent elements, relies on it and receives a direct heat transfer mechanism, and the lighting created by the LED is able to pass through two surfaces emitting light to two fluorescent elements, respectively;

an electrode comprising two ends electrically connected to two opposite ends of the LED, respectively, and intended to be connected to a power source through a head in the body of the bulb; and

a connecting element connecting the two fluorescent elements and setting them in such a position that a camera is formed in which the LED is placed, and the distance between the two fluorescent elements is set so that the LED occupies a position between two fluorescent elements in the camera for the LED, and the two ends of the electrode go out and connect with the head in the body of the flask, while in the connecting element, in addition, one or more than one hole of the channel between the two fluorescents is formed elements so that the LED communicates with the bulb cavity outside the chamber in which it is located, and the filler gas serves as a medium for direct heat transfer from the LED through the channel openings to the bulb cavity, and then to the whole bulb body for effective dispersion heat.

In accordance with another aspect of the present invention, the present invention provides an LED array comprising:

at least one LED, wherein each LED contains first and second light emitting surfaces intended to create lighting by electroluminescence;

two fluorescent elements located on both sides of the LED, respectively, so that the illumination created by the LED is able to pass through two surface emitting light to two fluorescent elements, respectively;

an electrode comprising two ends electrically connected to elements doped with an acceptor impurity and a donor impurity, respectively, in an LED, and intended to be connected to a power source; and

a connecting element connecting the two fluorescent elements and setting them in such a position that a camera is formed in which the LED is placed, and the distance between the two fluorescent elements is set so that the LED occupies a position between two fluorescent elements in the camera for the LED, and the two ends of the electrode go out of the camera for the LED, while the connecting element includes:

a pair of positioning elements, clamping two fluorescent elements from two ends, respectively, so that the distance between the two fluorescent elements when connected exceeds the thickness of the LED so as to provide surface heat transfer between each light-emitting surface and the corresponding fluorescent element due to the difference between the distance between the fluorescent elements and the thickness of the LED; and

two holders for the LED connected to the two sides of the LED, respectively, so that the LED remains suspended between two fluorescent elements inside the camera for the LED, thereby achieving direct heat transfer from the LED through the two sides of the LED and two fluorescent elements.

According to another aspect of the present invention, this image includes a method of manufacturing an LED light source for creating lighting, the method comprising the following steps:

(a) horizontally stacking the first current scattering layer and the second lighting layer;

(c) the formation of a laminated LED element in which two light-studying surfaces are formed by doping a laminated LED element to form an element doped with an acceptor impurity on a current scattering layer and doped with a donor impurity on an illumination layer such that between two these layers create a pn junction at which electroluminescence occurs;

(c) placing a plurality of laminated LED elements between two fluorescent elements so that the two light emitting surfaces of the laminated LED element face the two fluorescent elements and lean directly on them, providing direct heat transfer;

(d) installing an electrode connected to each laminated LED element and intended to connect the laminated LED element to a power source;

(e) forming an LED array by sealing two fluorescent elements with a connecting element to form a camera for the LED, in which one or more complex LED elements are placed in such a way that one or more is formed between the camera for the LED and the external environment outside the camera for the LED more than one channel opening, and thus direct heat transfer from the laminated LED element through the channel openings is effected;

(f) the formation of the LED light source in the form of a storage lamp by connecting the electrode to the head in the body of the flask and creating support for the LED matrix using the head in the body of the flask so that the LED matrix is placed inside the cavity of the flask filled with filler gas, while gas - the filler serves as a medium for heat transfer, due to which the heat created by the LED matrix is removed and reaches the bulb; and

(g) creating a design that creates a lighting effect, which includes one or more connecting elements, each of which is designed to connect one of the LED arrays to the head in the body of the bulb so that the LED matrices are located in an optimal position inside the cavity of the bulb so so that the lighting created by the LED matrix can reach the entire illuminating surface of the bulb.

In step (a), the manufacturing method further includes, as an option, the step of connecting the third substrate layer to the illumination layer.

In step (c), the manufacturing method further includes the step of forming a plurality of laminated LED elements by repeating the above steps.

In step (e), the manufacturing method further includes, as an option, the step of forming a plurality of LED arrays by repeating the above steps, after step (e).

According to the manufacturing method described above, step (f) can be replaced by a step of forming an LED light source in the form of an incandescent lamp by connecting a plurality of LED arrays with a head in the body of the bulb, in which the electrode of each LED matrix is connected to the head in the body of the bulb, whereby these LED matrices, and these LED arrays are located inside the cavity of the flask, which is filled with filler gas, while the filler gas serves as a medium for heat transfer, due to which heat Oh, created by the LED matrix is diverted and reaches the bulb.

Further objectives and advantages will become apparent upon consideration of the following description and drawings.

These and other objectives, features and advantages of the present invention will become apparent from the following detailed description with the accompanying drawings, and the attached claims.

Brief Description of the Drawings

Figure 1 is a cross section illustrating an LED light source and a method for manufacturing it, according to a preferred embodiment of the present invention.

FIG. 2 is a plan view illustrating an alternative embodiment of an LED light source according to the aforementioned preferred embodiment of the present invention.

FIG. 3 is a cross-section along line AA illustrating an alternative embodiment of the LED light source shown in FIG. 2 according to the above preferred embodiment of the present invention.

4 is a cross section illustrating an LED in an LED light source according to the above preferred embodiment of the present invention.

5 is a perspective view with a partial spatial separation of the parts, illustrating the structural relationship between the LED and two fluorescent elements in the LED light source, according to the above preferred embodiment of the present invention.

6 is a side view illustrating another alternative embodiment of an LED light source according to the above preferred embodiment of the present invention.

6A is a side view illustrating another alternative embodiment of the LED light source shown in FIG. 6, according to the above preferred embodiment of the present invention.

7 is a side view illustrating another alternative embodiment of an LED light source according to the above preferred embodiment of the present invention.

FIG. 8 is a side view illustrating another alternative embodiment of an LED light source according to the above preferred embodiment of the present invention.

FIG. 9 is a side view illustrating another alternative embodiment of an LED light source according to the above preferred embodiment of the present invention.

10 is a side view illustrating another alternative embodiment of an LED light source according to the above preferred embodiment of the present invention.

11 is a side view illustrating another alternative embodiment of the LED light source according to the above preferred embodiment of the present invention.

12 is a plan view illustrating yet another alternative embodiment of an LED light source according to the above preferred embodiment of the present invention.

FIG. 13 is a plan view illustrating yet another alternative embodiment of an LED light source according to a preferred embodiment of the present invention indicated above.

Fig. 14 is a side view illustrating another alternative embodiment of an LED light source according to the above preferred embodiment of the present invention.

FIG. 15 is a plan view illustrating another alternative embodiment of the LED light source shown in FIG. 14, according to the above preferred embodiment of the present invention.

Fig. 16 is a cross-sectional view illustrating yet another alternative embodiment of an LED light source according to the above preferred embodiment of the present invention.

FIG. 17 is a cross-sectional view illustrating another alternative embodiment of an LED light source according to the above preferred embodiment of the present invention. FIG.

Fig. 18 is a side view illustrating yet another alternative embodiment of an LED light source according to the above preferred embodiment of the present invention.

FIG. 19 is a side view illustrating another alternative embodiment of an LED light source according to the above preferred embodiment of the present invention. FIG.

FIG. 20 is a side view illustrating another alternative embodiment of an LED light source according to the above preferred embodiment of the present invention. FIG.

FIG. 21 is a partial exploded perspective view illustrating yet another alternative embodiment of an LED light source according to the aforementioned preferred embodiment of the present invention. FIG.

FIG. 22 is a cross-sectional view illustrating yet another alternative embodiment of an LED light source according to the aforementioned preferred embodiment of the present invention.

FIG. 23 is a partial exploded perspective view illustrating another alternative embodiment of an LED light source according to the above preferred embodiment of the present invention. FIG.

FIG. 24 is a plan view illustrating an LED array in an alternative embodiment of the LED light source shown in FIG. 23 according to the above preferred embodiment of the present invention.

FIG. 25 is a cross-sectional view along line AA illustrating an LED array in an alternative embodiment of the LED light source shown in FIG. 24 according to a preferred embodiment of the present invention indicated above.

Fig. 26 is a flowchart of a method for manufacturing an LED light source according to a preferred embodiment of the present invention.

Fig. 27 is a sectional view illustrating an alternative embodiment of an LED light source according to the above preferred embodiment of the present invention.

Fig. 28 is a sectional view of an alternative LED light source according to the aforementioned preferred embodiment of the present invention.

29 is a sectional view illustrating an LED that is electrically connected to the conductive layer according to the above preferred embodiment of the present invention.

29A is a partially exploded perspective view illustrating a layer forming a printed circuit in an electrically conductive layer formed on a fluorescent element according to the above preferred embodiment of the present invention.

30 is a sectional view illustrating an element doped with an acceptor impurity and an element doped with a donor impurity in an LED according to the above preferred embodiment of the present invention.

Fig is a side view illustrating the installation of the LED on the fluorescent element in the inverted position, according to the above preferred embodiment of the present invention.

32 is a side view illustrating the arrangement of the LED on the fluorescent element in an inverted position, according to the above preferred embodiment of the present invention.

Fig. 33 is a side view illustrating a fluorescent layer according to the aforementioned preferred embodiment of the present invention.

Fig. 34 is a side view showing a first alternative embodiment of a fluorescent layer according to the aforementioned preferred embodiment of the present invention.

Fig. 35 is a side view showing a second alternative embodiment of the fluorescent layer according to the aforementioned preferred embodiment of the present invention.

Fig. 36 is a sectional view showing a third alternative embodiment of the fluorescent layer according to the aforementioned preferred embodiment of the present invention.

Detailed Description of a Preferred Embodiment

1-3 and 16, 17 illustrate an LED light source according to the above preferred embodiment of the present invention, wherein the LED light source includes one or more LED arrays 100 that can be electrically connected to a power source, and a fixing element 5 Each of the LED arrays 100 includes at least one LED having first and second light emitting surfaces 11, 12, which can be electrically connected to a power source, and the first and second fluo estsiruyuschie elements 20, 30 arranged on the first and second light emitting surfaces 11, 12, respectively, the fixing member 5 connects the two fluorescent member 20, 30, locking them in position.

In particular, as shown in FIGS. 2-5, the light emitting surfaces 11, 12 of the LEDs 10 in each LED array 100 are intended to create illumination by electroluminescence. The LED 10 is located between two fluorescent elements 20, 30. In particular, the LED 10 is located between two fluorescent elements 20, 30 in such a position that each light-emitting surface 11, 12 faces the corresponding fluorescent element 20, 30 and directly rests on it in order to control the heat sink, and the illumination created by the LED 10 is able to pass through two light emitting surfaces 11, 12 to two fluorescent elements 20, 30, respectively. Therefore, the LED 10 is electrically connected to the power source through the device for electrical connection. The device for electrical connection includes an electrode 81, in which two ends are electrically connected to the two opposite ends of the LED 10, respectively, in order to connect it to a power source.

The locking element 5 is connected to two fluorescent elements 20, 30 and is designed to fix the fluorescent elements 20, 30 in such a position that they limit the chamber 51 in which the LED is located between the inner surfaces of the fluorescent elements 20, 30, so so that the LED 10 is located inside the camera 51 for the LED. Thus, the locking element 5 is connected to the outer edges of the fluorescent elements 20, 30 so that it fixes the fluorescent elements 20, 30 in a predetermined position.

In addition, when the fluorescent elements 20, 30 are fixed by the fixing element 5, the gap between the two fluorescent elements 20, 30, i.e. the width of the chamber 51 for accommodating the LED is set such that the LED 10 is held between two fluorescent elements in the chamber 51 for accommodating the LED, and the two ends of the electrode 81 extend outside the chamber 51 for the LED.

The locking element 5, which is the holder of the outer edge, can be implemented with a cross section in the shape of the letter C with two horizontal segments and a vertical section that extends between them, while the two horizontal sections of the locking element 5 are connected with the two outer sides of the fluorescent elements 20 , 30, respectively, along their outer edges. Preferably, the locking element 5 has an E-shaped cross section with three horizontal sections and a vertical section extending between them, while two horizontal sections of the E-shaped locking element 5 are connected to the two outer sides of the fluorescent elements 20, 30, respectively, according to their the outer edges, and the middle horizontal portion of the E-shaped locking element 5 extends into the camera 51 to accommodate the LED in order to further fix the width of the camera 51 for placement with etodioda as shown in Figure 3.

In the fixing element 5, there is, in addition, one or more openings 70 of the channels located between the two fluorescent elements 20, 30 and designed so that the LED 10 communicates with the external environment outside the cavity 51 for the LED and thus provides direct heat removal from LED 10 through the outlet openings of 70 channels.

It should be noted that the LED 10 has two light emitting surfaces 11, 12, each of which is connected to one of the fluorescent elements 20, 30 so that one LED 10 creates two illuminating surfaces. Thus, the light output is increased by at least 30%. Moreover, the LED 10 is connected to a substrate, or a heat sink element, which is usually a metal substrate, which makes it possible for the LED 10 to create two open areas, instead of one, for heat dissipation by convection and radiation. Therefore, it becomes possible to simplify the design of the heat dissipation device for the LED 10. In other words, compared to a conventional LED light source in which one side of the LED is covered by a substrate or a heat sink device, the LED 10 of the present invention creates lighting in a wider angle, therefore, the LED 10 proposed in this invention is able to create lighting at an angle greater than 180 ° on each surface emitting light 11, 12.

Preferably, the first fluorescent element 20 is a fluorescent crystal, which may be a glass or crystalline element or a transparent ceramic element, and the second fluorescent element 30 is a fluorescent colloid, or vice versa. Alternatively, both the first fluorescent element 20 and the second fluorescent element 30 may be fluorescent crystals or fluorescent colloids. In other words, both the first and second fluorescent elements 20, 30 can be selected from the group consisting of a fluorescent crystal and a fluorescent colloid.

In particular, the fluorescent crystal of one of the fluorescent elements 20 (30) is mounted in such a way that it forms a substrate for the LED 10, which is also able to remove heat from the LED 10 and dissipate it. Since the fluorescent crystal of the fluorescent element 20 (30) has a thickness significantly less than the thickness of a traditional substrate in an LED light source, the heat transfer efficiency increases significantly. The fluorescent crystal may be made of fluorescent glass or crystalline material, or some kind of transparent ceramic, or it may be made in the form of a glass or crystalline element or transparent ceramic and coated with a fluorescent powder. Preferably, the fluorescent element is made of yttrium aluminum garnet doped with rare earth elements.

As shown in FIGS. 2 and 3, the LEDs 10 are located on one straight line at a distance from each other between the fluorescent elements 20, 30, while for the first fluorescent element 20, and for the second fluorescent element 30, fluorescent crystals are used. In particular, the LEDs 10 are connected electrically or in parallel or in series, located between two fluorescent elements 20 and mounted on a straight line in a horizontal plane at a distance from each other so that heat-transferring channels 40 are formed between two adjacent LEDs 10, designed to dissipate heat.

It should be noted that the fluorescent crystal, which is a rigid solid body, forms a support for the LEDs 10, which eliminates the need for a traditional substrate (usually a metal substrate, for example, brass) for the LED light source, and thus the light output increases while reducing the overall sizes. The heat transfer channel 40, which is formed between two adjacent LEDs, creates conditions for efficient and direct heat transfer from the LEDs 10. In the absence of resinous materials that seal the LEDs, and at the same time there are heat transfer channels 40, it is possible to achieve effective heat dissipation and the resulting good LEDs 10 in conditions of controlled and low temperature and increased service life.

As shown in FIGS. 2, 3 and 4, two fluorescent crystals are used for the first fluorescent element 20 and the second fluorescent element 30, respectively, while they are parallel to each other so that LEDs can be placed between them. In particular, each LED 10 is made in the form of an inverted crystal, which has six faces emitted by light, and it contains several layers superimposed on each other and arranged in a certain order, which are a rigid and transparent layer 13, forming a substrate, a light emitting layer 14 and the current dissipating layer 15, they are superposed and arranged in the sequence shown in FIG. 4, while one of the fluorescent elements 30 is connected to the substrate-forming layer 13, and the other fluorescent element 20 is connected to the current-diffusing layer 15. Thus, the design of the LED 10 in the form of an inverted crystal, which is a simple structure, is capable of creating two light-emitting light surface.

Preferably, the substrate-forming layer 13 is made of sapphire and fastened to the fixing element 20 (30) in the desired position by thermo-compression welding, and that the thermo-compression welding is preferably a molecular bond. Thus, the use of molecular bonding eliminates the need for a conductive medium, such as silica gel for heat transfer, which is limited by the maximum heat transfer capacity of the conductive medium, as a result of which the present invention significantly increases the heat transfer ability and heat dissipation efficiency of the LED 10. It should be noted that layer 13 forming the substrate can also be made of other materials, provided that the layer 13 forming the substrate can be firmly connected by thermal mpressionnoy welding fluorescent member 20 (30), for example, from ₃ LiALCO.

As shown in FIG. 3 and 5, the LEDs 10 are designed to create a light effect, while the two fluorescent elements 20, 30 form a three-layer structure with the LEDs 10 so that the LEDs 10 are located on a straight line in a certain order between the two fluorescent elements 20, 30 and form a heat transfer channel 40 between two opposite sides of two adjacent LEDs 10, respectively. The locking element 5 may alternatively be an adhesion element or a bonding element 50 forming a sealing gasket between two fluorescent elements 20, 30 along the inner perimeter of the fluorescent elements 20, 30 so that the bonding element 50 seals around the perimeter of the edge of the fluorescent elements 20 , 30 in order to fix the LEDs 10 between the fluorescent elements 20, 30. A plurality of channel openings 70 are formed along the connecting element 50 at a distance of a friend from each other, which allows heat transfer from the LEDs 10 located inside the LED chamber 51 through the heat transfer channels 40 and the channel openings 70. Several support elements 60 are regularly arranged in a certain order between each two adjacent LEDs inside the heat-conducting channels 40 and are designed to fix the relative position of each two LEDs and to maintain a certain height of the chamber 51 for placing the LED between two fluorescent elements 20, 30. It is preferable to fill the chamber volume 51 to place an LED between two fluorescent elements 20, 30 use an inert gas such as helium and nitrogen having a high thermal conductivity, in order to further increase the heat transfer to remove heat from the LEDs 10.

It should be noted that the LEDs 10 are located between two fluorescent elements 20, 30 and have a boundary formed by a connecting element 50, and that heat dissipation is effectively achieved due to the presence of open holes 70 of the heat transfer channels 40.

Preferably, the bonding member 50 is a silica gel that is reflective and includes an electrode 81, the current scattering layer 15 includes an acceptor dopant element 102, the light emitting layer 14 includes an donor dopant element 101 located on the side closest to current scattering layer 15, the LEDs 10 were electrically connected in series or in parallel, and the LEDs 10 were electrically connected to the electrode 81 by means of a connecting element 80 such as otaya wire, copper wire conductor tracks deposited on at least one fluorescent member 20, conductive material 30, etc. In particular, every two LEDs are electrically connected by means of a connecting element 80, which connects the p-type dopant element 102 and the n-type dopant element 101 of two adjacent LEDs 10, and the LED 10 located on the edge is connected to the electrode 81 .

Alternatively, the locking element 5 in the LED light source includes two positioning elements 90 located at the edges and clamping the two fluorescent elements 20, 30, fixing them in a predetermined position, as shown in FIG. 3. The use of positioning elements 90 instead of the element 50, which was described above, allows direct contact of the LEDs 10 with two fluorescent elements 20, 30, which further optimizes the heat dissipation from the LEDs 10.

It should be noted that the alternative LED has not an inverted crystal structure, but a standard design in which the p-type dopant element 102 and the n-type dopant element 101 are located on two opposite sides of the LED 10. As shown in FIG. 16 , the LED matrix 100 comprises a LED 10, which has two light emitting surfaces 11, 12, designed to create lighting by electroluminescence, and two fluorescent elements 20, 30, between which there is light diode 10 in such a way that one of the light emitting surfaces 11 (12) faces the corresponding fluorescent element 20 (30) so that the illumination created by the LED 10 can pass through two light emitting surfaces 11, 12 to two fluorescent elements 20, 30 , respectively. In other words, the p-type dopant element 102 and the n-type dopant element 101 are located respectively on the light emitting surfaces 11, 12 of the LED 10.

The electrode 81 includes two ends electrically connected to two opposite sides of the LED 10, respectively, and are intended to be connected to a power source. The locking element 5 is electrically connected to the LED 10, and two fluorescent elements 20, 30 are held in place so that a camera 51 is formed to accommodate the LED, and the distance between the two fluorescent elements 20, 30 relative to the LED 10 is set so that the LED 10 is suspended between two fluorescent elements 20, 30 in the chamber 51 to accommodate the LED, and the two ends of the electrode outwardly outside the chamber 51 to accommodate the LED, while in the fixing element In addition to that, there is one or more of one orifice 70 of the channels located between the fluorescent elements 20, 30 and designed so that the LED 10 communicates with the environment outside the chamber 51 to accommodate the LED and thus directly transfers heat from the LED 10 through the holes of the channels.

Preferably, the locking element 5 includes two positioning elements 90 at two ends, which clamp the LED 10 and two fluorescent elements 20, 30 and fix them in a predetermined position in such a way that the LED 10 is suspended between the two fluorescent elements 20, 30 and held in predetermined position by two positioning elements 90. In particular, as shown in FIGS. 16, 17, the locking element 5 includes two positioning elements 90, each of which has two grooves 91 located at the edges that extend along the two edges of the positioning element 90, and one middle groove 92 extending between these two grooves 91 located at the edges, and two LED holders 93, each of which has a first end that fits snugly into the middle groove 91 of the corresponding positioning element 90, and a second end connecting to the side of the LED 10. In other words, two electric The positioning elements 90 have two types of grooves 91, 92 on each positioning element 90, which are preferably arranged parallel to each other at a distance from each other, while the two grooves 91 located on the edges of each positioning element 90 are sized such that one end of the corresponding fluorescent element 20, 30 fits tightly, and the middle groove 92 is sized so that the LED holder 93 fits tightly into it. Thus, the two fluorescent elements 20, 30 are fixed in a predetermined position by means of the grooves 91 located at the edges of the two positioning elements 90, respectively, and form a camera 51 for accommodating the LED, and the distance between the two fluorescent elements 20, 30 is set such that the LED 10 having a thickness less than this distance is positioned in the chamber 51 and held by the holders 93 of the LEDs in a suspended position between two fluorescent elements 20, 30, and, in addition, each fluorescent element row 20, 30 and the LED 10 creates a heat transfer passage 40, intended for an effective and immediate heat transfer through a heat transfer passage 40 and fluorescent members arranged on both sides of the LED 10.

As shown in FIG. 17, when the LED array 100 includes a plurality of LEDs 10 having a standard design, the LEDs 10 are held by a plurality of LED holders 93 and connected to each other by a plurality of connecting elements 80. In other words, each LED 10 is held by two sides two holders 93 of LEDs, respectively, due to which one LED 10 is connected to another LED 10, and two LEDs 10 at opposite ends of the LED matrix 100 are connected to lementami 90 position, respectively. On the other hand, every two LEDs 10 are interconnected by means of one connecting element 80.

It should be noted that the LED light source proposed in this invention provides efficient heat dissipation from the LED 10 or LEDs 10 in a design using an inverted crystal or in a standard design (without using an inverted crystal), and it can be used in structures and installations of various assignments, for example, in lighting lamps, emergency light sources, PAR light sources (parabolic aluminized reflector), automotive light sources, street lighting, subway lighting many transitions, indoor lighting, in table lamps, pendant lights, in candle-shaped lamps, etc. When the LED light source proposed in this invention is designed in the form of an LED lamp having the form of an incandescent lamp, the design of the LED matrix using inverted crystals and the LED matrix with a standard design become interchangeable and interchangeable, which does not go beyond the essence of the present invention.

As shown in Fig.6, the LED light source proposed in this invention is made in the form of an incandescent lamp, which includes the body of the bulb 110, bounding the surface 111 of the bulb, which is filled with filler gas 112 inside the bulb ON, with one or more than one, the LED matrix 100 is mounted inside the bulb cavity 111 in the body of the bulb 110 and forms an LED lamp in the form of an incandescent lamp.

Thus, each LED 10 is designed to generate inside the cavity 11 of the bulb of light that passes through the bulb 110. In addition, the electrode 81 electrically connects the LED 10 and the adapter 82 of the LED lamp to create a power source for the LED 10 through the electrode 81. Thus, heat can be dissipated by creating holes 70 in the channels to remove heat from the LED 10 into the bulb cavity 111 in the bulb body 110.

As shown in FIG. 6, the LEDs are mounted on one straight line up against each other and form an elongated structure along the axis, while the LEDs 10 are mounted in such a way that they have the same orientation, allowing the LEDs 10 to emit light from both sides. Alternatively, as shown in FIG. 6A, the LEDs 10 are arranged so that they have a different orientation, allowing the LEDs 10 to emit light in different directions. As shown in FIG. 6A, some LEDs 10 have such an orientation that they emit light in the forward and backward directions, and some LEDs 10 have such an orientation that they emit light left and right. Thus, the LEDs 10 have an alternating orientation in order to provide light emission by the LED array 100 within 360 °.

Thus, the filling gas 112, which may be an inert gas, acts as an intermediate medium between the LED 10 and the body of the bulb 110 so that the entire surface area of the bulb 110 can be used to dissipate heat. Preferably, the filler gas 112 is polydimethylsiloxane (silicone oil). As a result of this, the surface area available for heat dissipation increases significantly, which leads to an increase in the efficiency of heat dissipation. Since the filler gas 112 is an inert gas surrounding the LED 10, and it is sealed inside the flask cavity 111 in the body of the flask 110, the LED 10 is further protected against oxidation inside the flask cavity 111 filled with inert gas, which leads to an increase in service life and increase reliability.

Preferably, the LED array 100 may further include a conductor 120 connecting the fluorescent elements 20, 30 to the adapter 82 of the LED lamp in the bulb 110, as shown in Figs. 7 and 8. It should be noted that the size and shape of the bulb 110 can be selected from the configurations shown in Fig.6-11. The bulb 110 may have an elongated shape, as shown in FIG. 6 and FIG. 10, an oval shape, as shown in FIG. 7, the shape of a conventional incandescent lamp, as shown in FIG. 8 and FIG. 11, or a bulb shape, as shown in Fig.9.

As shown in Fig. 9, the LED light source according to this invention is made in the form of a PAR incandescent lamp (with a parabolic aluminum reflector). In a particular case, the light source in the form of an incandescent lamp PAR includes a two-layer bulb in which the first layer 130 of the bulb is the outer layer, and the second layer 140 of the bulb is the inner layer, and a cavity is formed between the two layers 130, 140, and there is also an opening 150, through which the cavity between the layers communicates with the external environment.

Preferably, the LED light source according to this invention also includes a reflective element 160 extending laterally from one side of one fluorescent element 20 (30) along the LED matrix 100 at a certain distance from it so that the light emitted by the LED 10 is guided by the reflective surface of the reflective element 160 and displayed in one direction, which is used to create a light effect in one direction. In other words, the light emitted from the LED light source is collected and reflected in a predetermined direction due to the presence of the reflective element 160, as shown in FIG. 10.

Preferably, the LED light source according to this invention includes a lighting effect structure 17 that includes one or more connectors 170, with each connector 170 having one end connected to one LED array 100 and another end that attached to the body of the bulb 110 of the LED lamp in order to place the LED matrix 100 in an optimal position inside the cavity 111 of the bulb in the bulb 110.

For example, as shown in FIG. 11, the lighting effect design 17 is for attaching LED arrays 100 inside the bulb cavity 111 and includes a plurality of connecting elements 170 that diverge in the radial direction, each of which is connected at one end to one LED array 100, and they are arranged concentrically and outwardly directed to the bulb 110 so that the LEDs 10 are arranged in a certain order in the central part of the bulb cavity 111 to create a lighting effect throughout the light emitting 1102 rhnosti bulb 110. It should be noted that the bulb 110 is also serves as a means for heat dissipation.

In particular, as shown in FIG. 11, the LED array 100 includes one LED 10 for creating illumination, two fluorescent elements 20, 30, forming with the LED 10 a three-layer sandwich structure, a connecting element 50, which fixes the LED 10 between two fluorescent elements 20, 30 so that a plurality of channel openings 70 are formed between two fluorescent elements 20, 30. The connecting element 50 includes an electrode 81 located at a distal end and intended for ktricheskogo compound LED 10 and LED lamp adapter 82, the bulb 110, for connecting to a power source.

Alternatively, the LED array 100 comprises a plurality of LEDs 10 connected in series or parallel to create illumination, two fluorescent elements 20, 30, forming a three-layer structure with LEDs 10, a connecting element 50 that fixes the LEDs 10 between two fluorescent elements 20, 30 in this way so that a plurality of channel openings 70 are formed between the two fluorescent elements 20, 30. The connecting element 50 includes an electrode 81 located at a distal end, which rednaznachen to electrically connect the LEDs 10 to the power source.

For example, as shown in FIG. 12, the two fluorescent elements 20, 30 are two identical rectangular fluorescent crystals 20, 30, which have two opposite sides for connection, on which there is a first end and a second end of electrode 81, which are intended for connection with LEDs 10.

For example, as shown in FIG. 13, the two fluorescent elements 20, 30 are two identical circular fluorescent crystals 20, 30 which have two opposite sides for connection, on which there is a first end and a second end of electrode 81, which are designed to connection with the LEDs 10. As shown, one of the LEDs 10 is located in the center, from which the other LEDs diverge outward, concentrically surrounding the LED 10 located in the center, so that the heat transfer channels 40, which matured into the holes 70 open channels radically divergent perimeter LED array 100, which optimizes the heat dissipation.

Alternatively, as shown in FIGS. 14, 15, the LED matrix 100 comprises one LED 10 for creating lighting, two fluorescent elements 20, 30 forming a three-layer structure with LED 10, a positioning element 90 that fixes the position of the LED 10 between two fluorescent elements 20, 30, and an electrode 81, in which the first end and the second end are connected to two opposite sides of the LED, are located on two opposite sides of the LED matrix 100 and are intended for electrical connection of the LED 10 with a power source. It should be noted that it is not required that the LED 10 in this embodiment have an inverted crystal structure.

Alternatively, as shown in FIGS. 18-20, several illustrative examples of flask 110 are given as examples, in which flask 110 has various shapes that will suit different purposes and designs. For example, the flask 110 may have a segmented shape, which is shown in FIG. 18, a candle-shaped shape, as shown in FIG. 19; and a cap shape as shown in FIG.

Preferably, the LED lamp according to the present invention may further include a structure 18 for removing heat and formed on the outer surface of the bulb 110 in order to further increase the surface area of heat dissipation when a high power LED matrix 100 is used, especially for outdoor lighting. For example, as shown in FIG. 21, the LED lamp comprises a bulb 110 in which a light reflecting surface 1102 is formed on one side and a non-light emitting surface 1103 on the opposite side, an LED matrix 100 producing a light effect, a light reflecting element 160 that directs light from the LED matrix 100 onto the light emitting surface 1102 so that the light effect is realized through the light emitting surface 1102 and the heat-removing structure 18 including a plurality of ribs 181 extending radially onto no systematic way of the light emitting surface of the bulb 110 and 1103 for creating additional heat dissipating surface area.

It should be noted that the LED lamp according to this invention can also be used for a backlit display in a computer or television. As shown in FIG. 22, the LED lamp is arranged to provide illumination by means of a reflective cap 190, which is connected to the reflective panel 191 and the diffuser panel 192 in such a way that light is guided by the reflective cap 190, the reflective panel 191 and the diffuse panel 192 on the light guide panel 193 to create a lighting effect.

It should be noted that, compared to traditional lighting equipment, an LED light source also emits heat while it creates lighting, and the heat produced, which significantly increases the ambient temperature, significantly and negatively affects the light output of the LED light source. In traditional technical solutions, the light effect of the LED light source is created due to electroluminescence caused by electrons and holes, when they are exposed to external energy, which is supplied as electricity to the pn junction, and the light effect arising from the pn junction must pass through semiconductor materials and sealing materials of the LED light source itself to go outside and create a light effect. As a result of this, taking into account the supplied electricity and the efficiency of use of the supplied electricity, the emitted light power and the transmission efficiency of light, the percentage of conversion of energy into light energy will be approximately only 30% to 40%, while the thermal energy will be about 70%. Therefore, heat management is the most important factor determining the development of traditional technical solutions. Compared with traditional technical solutions, this invention directs the development to increase light output and reduce heat production, which successfully solves the problem of low efficiency of LED light sources.

In the LED light source proposed in this invention, it is possible to successfully avoid the prejudice or practice of using a radiator specially designed for LED light sources in traditional technical solutions, and use the characteristics of electroluminescence, which allow you to create a light effect in all directions, optimize the use of light effect in all directions so as to successfully solve the problem of bottlenecks in relation to heat dissipation caused by traditional m radiator, which serves as the main or sole channel for heat dissipation, by creating an open area around the LED and creating channels so that the light output, as well as the efficiency of heat dissipation, increase significantly. In addition, an increase in heat dissipation efficiency made it possible to lower the ambient temperature, which further optimizes the conditions for electrons and holes to create a highly efficient light effect by electroluminescence, and therefore, allows the creation of a cycle of high heat dissipation, high light output, and high heat dissipation efficiency. When testing the LED light source according to this invention, the percentage conversion of energy from electrical to light can reach 85% or more.

In addition, the additional use of an inert filler gas around the LEDs 10 for direct heat transfer, further reduced the ambient temperature around the LEDs, and, therefore, even more, up to 90% or more, increased the percentage of conversion of electrical energy into light energy, which is a significant effect created by this invention.

In an alternative embodiment of the present invention as shown in FIGS. 23-25. the LED light source includes a bulb 110 and one or more than one LED array 100 located inside the bulb 110 and fixed therein. The bulb 110 delimits the bulb cavity 111 located inside the bulb 110 and intended to be filled with gas filler 112. Each LED array 100 includes a plurality of LEDs 10, a plurality of connecting elements 80, such as a wire connecting electrically the LEDs 10, two fluorescent elements 20, 30, electrode 81 and reflective element 160.

Two fluorescent elements 20, 30 are located on top of the two light emitting surfaces 11, 12 of the LEDs 10 and fix the LEDs 10 in such a position that the light emitted from the LED 10 is able to pass through the two fluorescent elements 20, 30 to create lighting in an angle exceeding 180 ° due to electroluminescence on two surfaces emitting light 11, 12.

The electrode 81 is electrically connected to the LEDs in order to electrically connect the LEDs, which are interconnected by a connecting element 80, with a power source.

The reflective element 160 extends away from one side of one fluorescent element 20 (30) at a certain distance from the LED matrix 100 and along it so that the light emitted by the LED 10 is guided by the reflective surface of the reflective element 160 and falls in one direction, which turns out to be useful for creating a light effect in one direction. In other words, the light emitted by the LED light source is collected and reflected in a predetermined direction due to the presence of the reflective element 160.

The LEDs 10 are arranged so that uniform and optimal light emission is achieved. Thus, every two LEDs 10 are arranged in pairs, in which one of the LEDs 10, designated as the first LED 10A, has an inverted crystal structure, and the other, designated as the second LED 10B, has a standard structure. For example, as shown in FIGS. 24 and 25, a plurality of pairs of LEDs 10 are arranged in such a way that they form two rows, which allows for uniform and optimal light emission.

In other words, two rows of LEDs 10 having alternating structures representing an inverted crystal structure and a standard structure are mounted on one straight line to create a uniform and optimal light effect.

The flask 110 may also have a bulb cover 1101 that facilitates heat transfer. For example, as shown in FIG. 23, flask coating 1101 is formed over the entire inner surface of flask 110. It is preferred that coating 1101 is made of polydimethylsiloxane or materials with similar thermophysical properties.

27, 28 and 30 illustrate another alternative embodiment of an LED light source, which further includes an electrical conductive layer 80A superimposed on at least one of the fluorescent elements 20, 30, wherein the LED 10 is in electrical contact with the electrical conductive layer 80A in such a way that the LEDs 10 are electrically connected in series or in parallel, and the LEDs 10 are electrically connected to the electrode 81 via the conductive layer 80A. In other words, the connecting element 80, designed to electrically connect the LEDs 10, as described above, can be eliminated. In other words, the connecting element may be a connecting wire or a printed circuit and serve to electrically connect with the LEDs 10.

As shown in Figs. 27-29, an electrically conductive layer 80A is deposited on each of the fluorescent elements 20, 30 in the form of a printed wiring layer, wherein the electrically conductive layer 80A is made, preferably, of a transparent material through which light can pass so that when the light emitted by LED 10, light can pass through the conductive layer 80A to the fluorescent elements 20, 30.

As shown in FIGS. 29 and 30, two opposite faces of the LED 10 are electrically connected to the conductive layers 80A on the fluorescent elements 20, 30, respectively. In particular, the acceptor impurity-doped element 102 and the donor-doped element 101 are located at two opposite faces of the LED 10 to be electrically connected to the conductive layers 80A on the fluorescent elements 20, 30, respectively. According to a preferred embodiment, the conductive layer 80A may be a printed wiring layer deposited on the fluorescent elements 20, 30 in such a place that it is aligned with the acceptor impurity-doped element 102 and the donor-doped element 101, of the LED 10 when the LED 10 connected to the fluorescent element 20, 30. Thus, the LED light source proposed in this invention can be connected to an AC source without using a rectifier or transformer.

More than two LEDs 10 can be connected to the fluorescent elements 20, 30 when they are located on the same straight line at a certain distance from each other so that the LEDs 10 are electrically connected to each other through the conductive layers 80A. In addition, at the ends of the sides of the fluorescent elements 20, 30, there are electrodes 81 that are electrically connected to the conductive layer 80A, respectively, so that when the LED 10 is connected to the fluorescent elements 20, 30, the LEDs 10 are electrically connected to the electrodes 81 via electrically conductive layers 80A. Therefore, due to the production method described above, production costs are substantially reduced, and light output and heat dissipation efficiency are significantly increased.

It should be noted that the conductive layer 80A can be formed on one of the fluorescent elements 20, 30, while the element 102 doped with an acceptor impurity and the element 101 doped with a donor impurity are located on the same face of the LED 10, i.e. an acceptor impurity doped element 102 and a donor impurity doped element 101 are located on one of the light emitting surfaces 11, 12 of the LED 10 so that the acceptor doped element 102 and a donor doped element 101 of the LED 10 can be electrically connected to the conductive layer 80A on one of the fluorescent elements 20, 30. As shown in FIG. 29A, the conductive layer 80A is in the form of a printed wiring layer formed on the corresponding fluorescent element 2 0, on which there are many pairs of connecting substrates, printed by printed wiring on the corresponding fluorescent element 20, 30 and intended for electrical connection with the element 102 doped with an acceptor impurity and the element 101 doped with a donor impurity, each LED, respectively, and many connecting elements printed by printing on the corresponding fluorescent element 20, 30 and designed to electrically connect the LEDs 10, at a time when the light iody 10, each of which has an element 102 doped with acceptor impurity and the element 101, doped with a donor impurity, disposed on the same light-emitting surfaces 11, are electrically connected to the conductive layer 80A.

It should also be noted that the LEDs 10 in the LED array 100, which is mounted in the bulb 110 to form an LED lamp, as shown in Figs. 7-10, 18-21 and 23-24, can be mounted on one straight line, adjacent to each other. at different orientations and form an elongated structure similar to the structure of the LED matrix shown in Fig. 6A, in order to ensure the property of emitting light in all directions. The location of the LEDs with different orientations in the LED matrix should be considered as an obvious alternative to this invention.

The present invention also provides a method for manufacturing an LED light source according to a preferred embodiment described above. As shown in FIG. 26, a method for manufacturing the LED 10 includes the following steps.

(1) the application of the first current-scattering layer 15 and the second light emitting layer 14, preferably oriented horizontally.

(2) The formation of the LED 10, in which there are two light-emitting surfaces 11, 12, by doping the LED 10 with the formation of the acceptor-impurity-doped element 102 on the current-scattering layer 15 and the donor-impurity element 101 on the light-emitting layer 14 such so that between these two layers 14, 15 a pn junction is created at which electroluminescence occurs.

Preferably, the method further includes the step of connecting the third layer 13 forming the substrate with the light emitting layer 14.

A method of manufacturing an LED array 100 includes the following steps:

(a) Placing at least one LED 10 between two fluorescent elements 20, 30 so that the two light emitting surfaces 11, 12 of the LEDs 10 face two fluorescent elements 20, 30, which form a direct support for them and provide direct heat transfer .

(b) The electrical connection of the electrode 81 with the LED 10 in order to electrically connect the LED 10 to a power source.

(c) Formation of the LED array 100 by fixing two fluorescent elements 20, 30 with the fixing element 5 to form a camera 51 for accommodating the LEDs, in which one or more of the LEDs 10 is placed so that between the camera 51 for accommodating the LED and the external openings 70 of the channels are created outside the chamber 51 to accommodate the LEDs, as a result of which direct heat transfer from the laminated LED 10 through the openings of the 70 channels is achieved.

It should be noted that two fluorescent elements 20, 30 can be used to accommodate a plurality of LEDs 10. Thus, the LEDs 10 in step (a) are placed on a straight line between the two fluorescent elements 20, 30 so that the two light-emitting surfaces 11, 12 LEDs 10 are turned in the direction of two fluorescent elements 20, 30, which form a direct support for them and carry out direct heat transfer.

When a plurality of LEDs 10 are used, the LEDs 10 are placed on one straight line so that a heat transfer channel 40 is formed between two adjacent LEDs 10, which is open by the channel opening 70 and is designed to optimize heat dissipation.

When the manufacture of an LED lamp is proposed, the proposed method also includes the following steps.

(A) Installing one or more than one LED array 100 inside the cavity 11 of the bulb 110.

(B) Creating the structure of the LED lamp by electrically connecting the electrode 81 with the adapter 82 of the LED lamp on the bulb 110 so that the LED matrix 100 is located inside the cavity 11 of the bulb filled with filler gas 112, while the filler gas 112 serves as a medium for heat transfer designed to remove the heat generated by the LED matrix 100, so that it reaches the bulb 110.

When multiple LED arrays 100 are used, a design 17 may be included to create a lighting effect designed to optimize the lighting effect. In this case, the specified method will also include the following steps:

(A1) Turning on the lighting effect structure 17, which includes one or more of the connecting element 170, each of which is designed to connect one of the LED arrays 100 to the adapter 82 on the bulb 110 so as to arrange the LED arrays 100 in an optimal position inside the cavity 112 of the bulb so that the illumination generated by the LED array 100 can reach the entire lighting surface 1102 of the bulb 110.

It should be noted that the locking element 5 may be a connecting element 50 or two positioning elements 90 and serve to secure the two fluorescent elements 20, 30 by molecular bonding or by clamping. The LED 10 may be a two-layer LED 10 or a three-layer LED 10, which creates lighting on both sides.

Alternatively, the LED light source proposed in this invention can be manufactured in the following manner, as shown in Fig.31 and 32.

Each LED 10 is connected to the first fluorescent element 20 in such a position that each of the LEDs 10 is mounted upside down, as shown in FIG. Therefore, the element 102 doped with an acceptor impurity and the element 101 doped with a donor impurity are located on the same face of the LED 10 and connected to the first fluorescent element 20, as shown in FIG. 32. The connecting element 80 is pre-mounted on the first fluorescent element 20, forms a plurality of protruding contacts on the first fluorescent element 20 and is aligned with the LED 10 so that when the LED 10 is connected to the first fluorescent element 20, the LED 10 is electrically connected to the connecting element 80.

An advantage is that the conductive layer 80A, which is configured as a printed wiring layer, can be formed in advance on the first fluorescent element 20 so that it is electrically connected to the LED 10 when the LED 10 is connected to the first fluorescent element 20. Then, the second fluorescent element 30 can be applied to the LEDs 10 after the LEDs 10 are connected to the first fluorescent element 20, so that the LEDs 10 are enclosed between the fluorescent elements 20, 30. It should be noted that with etodiody 10 can be placed with a large degree on the first fluorescent element 20 and using this method, to fix them between two fluorescent members 20, 30.

33 shows an alternative embodiment of the fluorescent element 30A, according to which the fluorescent element 30A is made in the form of a thin fluorescent layer 30A, superimposed on each LED 10, while the fluorescent layer 30A operates in the same way as the fluorescent element 30 described above. Thus since the element 102 doped with an acceptor impurity and the element 101 doped with a donor impurity are located on the same face of the LED 10, the fluorescent layer 30A is preferably formed by sputtering the opposite face of the LED 10. Therefore, it is possible to significantly reduce the total thickness of the LED light source by reducing the thickness of the fluorescent element 30 by using the fluorescent layer 30A. In particular, each LED 10 is designed in such a way that it has a light emitting layer 14 and a current scattering layer 15, wherein the acceptor impurity doped element 102 and the donor impurity element 101 are located on the current diffusing layer 15 in the form of protruding point LED pins 10.

As shown in Fig. 34, the LED 10 is connected to the first fluorescent element 20, while the element 102 doped with an acceptor impurity and the element 101 doped with a donor impurity are located on the same face of the LED 10, which is opposite the fluorescent element 20. The fluorescent layer 30A, acting as a replacement for the fluorescent element 30, is applied to the LED 10 so that it covers the element 102 doped with an acceptor impurity and the element 101 doped with a donor impurity in order to close a diode 10 located on the first fluorescent element 20. Therefore, the connecting element 80 is formed on the first fluorescent element 20 by ultrasonic welding to create an electrical connection with the element 102 doped with an acceptor impurity and the element 101 doped with a donor impurity, while the connection points of the element 102 doped with an acceptor impurity and an element 101 doped with a donor impurity, wherein the connection points of the element 102 doped with an acceptor impurity and a donor doped element 101 impurity, with the connecting elements 80 covered with a fluorescent layer 30A.

Fig. 35 shows an alternative arrangement of the LED 10, in which the LED 10 is connected to the first fluorescent element 20 in such a way that the element 102 doped with an acceptor impurity and the element 101 doped with a donor impurity are located on the same face of the LED 10 and face to the first fluorescent element 20. In other words, the element 102 doped with an acceptor impurity and the element 101 doped with a donor impurity are electrically connected to the connecting elements 80 on the first fluorescent element NTE 20 formed by welding. The fluorescent layer 30A, acting as a substitute for the fluorescent element 30, is applied to the LED 10 and covers the LED 10 located on the first fluorescent element 20.

Alternatively, the fluorescent element 30 may be formed as a plurality of individual fluorescent elements 31A that are superimposed on the LEDs 10, respectively, to replace the substrate layer 13, with the individual fluorescent element 31A superimposed on the light emitting layer 14, as shown in FIG. 36 . In other words, the backing layer 13 is eliminated and replaced by the fluorescent layer 31A, as shown in FIG.

In other words, the substrate layer 13 can be formed as a sapphire layer connected to the corresponding fluorescent element 30, an integrated layer combined with the corresponding fluorescent element 30, a thin fluorescent layer 30A, or individual fluorescent elements 31A. It should be noted that the specific embodiment and alternatives can be used interchangeably and be used in various lighting fixtures, such as the LED lamps shown in FIGS. 6-11 and 18-23. In addition, the connecting element 80 and the conductive layer 80A are interchangeable when it is necessary to make an electrical connection with the acceptor-impurity-doped element 102 and the donor-doped element 101 in the LED 10. The acceptor-doped element 102 and the donor-doped element 101 impurity, can be formed either on the same face of the LED 10, or formed on opposite sides of the LED 10 so that they can be electrically connected to the connecting element Ohm 80 or conductive layer 80A.

Thus, thanks to the manufacturing method described above, production costs are significantly reduced, and light output and heat dissipation efficiency are significantly increased. In addition, a traditional LED light source having a polymer case, a sealed layer will generate a relatively greater amount of heat at a temperature of 200 ° C at the end point, since heat is retained and stored inside the polymer case, and heat can only be transmitted through the sapphire substrate. Therefore, the light intensity in the conventional LED light source will decrease when the temperature due to the heat generation of the traditional LED light source increases. The LED light source proposed in this invention will generate heat and create a temperature of 40-50 ° C, since the heat can be efficiently dissipated through the fluorescent elements 20, 30 so that an ordinary fan that creates air flow can be included in the LED light source, and increasing heat dissipation in the LED light source of the present invention. As soon as the temperature of the environment surrounding the LED light source decreases, the light intensity of the LED source increases, while the heat generated by it is minimized.

In addition, this invention allows to solve the unresolved problem that arose due to the traditional idea that the LED requires a special substrate that dissipates heat as a support. No heat dissipating substrate is used in the present invention, but it is possible to emit light on both sides of the LED light source, which overcomes the angle limitations inherent in LEDs and makes it possible to use light energy in all angles of radiation so that achieve at least 30% more use of light energy. In other words, this invention can significantly and completely overcome the bottleneck associated with heat dissipation in a traditional heat dissipating substrate, and provides full illumination and complete heat dissipation in all directions at the same time, which significantly increases the lighting efficiency and ability dissipate heat. In particular, this invention allows the LED 10 to operate efficiently at a relatively low ambient temperature with a significant increase in its ability to dissipate heat, which further optimizes the conditions under which electrons and holes create a powerful light effect due to electroluminescence, and therefore create a good high duty cycle heat dissipation efficiency - high lighting efficiency - high heat dissipation. The LED light source proposed in this invention, as shown by tests, provides 85% or more conversion of electrical energy into light energy.

One skilled in the art will understand that the embodiment of the present invention shown in the drawings and described above is only an example and cannot be considered restrictive.

Thus, it can be seen that the objectives of the present invention have been fully and effectively implemented. Embodiments have been shown and described with the aim of illustrating the functional and constructive principles of the present invention, and they can be modified without departing from these principles. Therefore, this invention includes all modifications not exceeding the scope and essence of the following claims.

Claims (13)

1. An LED light source comprising one or more than one LED matrix (100), wherein each LED matrix (100) comprises:
many LEDs (10), while the LEDs (10) have a first light emitting surface (11) and a second light emitting surface located on the opposite side (12 and LEDs (10) are designed to create lighting by electroluminescence on both the first and second light emitting surfaces (11, 12);
two fluorescent elements (20, 30) located on top of the first and second surfaces (11, 12) of each LED (10), respectively, and designed to fix the LEDs (10) in a position in which the illumination created by both the first and second emitting the light by the surfaces (11, 12) of the LEDs (10) can pass through the two indicated fluorescent elements (20, 30), leaving the first and second light emitting surfaces (11, 12), respectively;
an electrode (81) electrically connected to the LED (10) and designed to perform electrical connection of the LEDs (10) with a power source; and
characterized in that the fixing element (5) is connected to two fluorescent elements (20, 30) and is designed to hold the fluorescent elements (20, 30) in a position in which between the inner surfaces of the fluorescent elements (20, 30) is formed a chamber (51) for placing the LEDs so that inside the chamber (51) for placing the LEDs it is possible to place the LEDs (10), while in the fixing element (5) between the fluorescent elements (20, 30) there are many channel openings (70) by means of The light emitting diodes (10) communicate with the environment outside the chamber (51) to accommodate the LEDs, while the LEDs (10) are placed between the two fluorescent elements (20, 30) to form a three-layer structure so that the LEDs (10) are arranged in rows between two fluorescent elements (20, 30), forming a heat transfer channel (40) between two opposite sides of two rows of LEDs (10), respectively, while the holes (70) of the channels are made at a distance from each other along the fixing its member (5) so as to make possible the transfer of heat from each LED (10) situated within the chamber (51) for placing the LEDs through the heat transfer channels (40) and the holes (70) channels. 2. The LED light source according to claim 1, in which each LED matrix further includes a locking element (5) connected to the outer edges of the fluorescent elements (20, 30) and designed to maintain a distance between them in order to fix the LEDs (10) between the fluorescent elements (20, 30). 3. The LED light source according to claim 2, in which each LED (10) has an inverted crystal structure with six faces emitting light and contains several layers superimposed on each other and arranged in a certain order, which are a rigid and transparent substrate-forming layer (13), the light-emitting layer (14) and the current-scattering layer (15) are sequentially superposed on one another, while one of the fluorescent elements (30) is connected to the substrate-forming layer (13), and the other fluorescent element (20) is connected with p layer (15) sseivayuschim current. 4. The LED light source according to claim 3, wherein between each two adjacent LEDs (10) inside the heat-conducting channel (40) there are many support elements (60) arranged systematically and orderly, designed to fix the relative location of each two LEDs (10) and to maintain a certain height of the chamber 51 for placing the LEDs between two fluorescent elements (20, 30). 5. The LED light source according to claim 4, in which an inert gas is used to increase the heat dissipation from the LEDs (10) to fill the volume of the chamber (51) for placing the LEDs between two fluorescent elements 20, 30. 6. The LED light source according to claim 5, in which the fixing element (5) has a cross section in the form of the letter E with three horizontal sections and a vertical section passing between them, while two horizontal sections of the E-shaped fixing element (5) are connected with two outer sides of the fluorescent elements (20, 30) respectively along their outer edges, and the middle horizontal portion of the E-shaped locking element (5) extends into the chamber (51) to accommodate the LEDs in order to further fix Irina chamber 51 to accommodate the LEDs. 7. The LED light source according to claim 6, in which each LED (10) has an inverted crystal structure, wherein each LED (10) contains an element (102) doped with an acceptor impurity, and an element (101) doped with a donor impurity, located on one of the first or second light emitting surfaces and are electrically connected to the specified electrode (81). 8. The LED light source according to claim 7, further having an LED lamp design in the form of an incandescent lamp that includes a bulb body (110), delimiting a bulb cavity (111) inside and having a filler gas (112) inside the body ( 110) the bulb, while the LED matrix is mounted inside the cavity (111) of the bulb, forming a LED lamp. 9. The LED light source according to claim 8, in which the LED lamp in the form of an incandescent lamp further includes a structure (17) for creating a lighting effect to which LED arrays (100) are mounted inside the bulb cavity (111), wherein the construction (17) for creating a lighting effect, includes a plurality of connecting elements (170) radially diverging inside the bulb cavity (111) and connected to the LED arrays (100), respectively, so as to position the LED arrays (100) in an optimal position inside the cavity (111) flasks in the body (110) of the flask. 10. The LED light source according to claim 9, in which the LED lamp in the form of an incandescent lamp also includes a heat sink structure (18) made on the outer surface of the body (ON) of the bulb to increase the surface area of the heat dissipating. 11. The LED light source according to claim 10, in which the LEDs (10) are firmly fixed between the two indicated fluorescent elements (20, 30) with the formation of a three-layer structure so that the LEDs are fixed in a position in which the first and second emitting light the surfaces (11, 12) of the LEDs (10) face the fluorescent elements (20, 30), rely on them and get a mechanism for direct heat transfer from the LEDs (10) while the LEDs (10) are fixed inside the camera (51) for light placement iodov between the fluorescent elements (20, 30). 12. The LED light source according to claim 11, further comprising a connecting element extending from the electrode (81) to the LEDs (10) and designed to electrically connect the LEDs (10) to the electrode (81). 13. A method of manufacturing an LED light source, comprising the following sequence of steps:
(a) providing a plurality of LEDs (10) in which there is a first light emitting surface (11) and a second light emitting surface (12) located on the opposite side, wherein the LEDs (10) are designed to create lighting by electroluminescence as on the first, so on the second surface emitting light (11, 12);
(b) fixing the LEDs (10) between the two fluorescent elements (20, 30) in order to create an LED matrix (100), such that the lighting created by the LEDs (10) can pass through both fluorescent elements (20, 30) as from the first , and from the second surface emitting light (11, 12), respectively;
(c) electrical connection of the electrode (81) with the LEDs (10) in order to electrically connect the LEDs (10) to a power source;
(d) connecting the fixing element (5) with the outer edges of the fluorescent elements (20, 30) in order to keep the distances between them constant and thereby fix the LEDs (10) between the fluorescent elements (20, 30);
wherein step (a), in addition, includes the following steps:
(a.1) applying to the current-scattering layer (15) a light emitting layer (14); and
(a.2) the formation of these LEDs (10) by doping the LEDs (10) so as to form an element (102) doped with an acceptor impurity on a current-scattering layer (15) and an element (101) doped with a donor impurity on a radiating the light layer (14) in such a way that between the current-scattering layer (15) and the light-emitting layer (14) a pn junction is formed at which electroluminescence must occur;
(a.3) attaching the substrate-forming layer (13) to the light-emitting layer (14), wherein the substrate-forming layer (13) is made in the form of a transparent and rigid structure and is located between the corresponding fluorescent element and the light-emitting layer (14) LEDs (10);
step (b), in addition, includes the step of placing the LEDs (10) between two fluorescent elements (20, 30) with the formation of a three-layer structure for fixing the LEDs (10) in such a position that the first and second light-emitting surfaces (11,12) LEDs (10) are turned directly to the fluorescent elements (20, 30), rely on them and receive a mechanism for direct heat transfer from the LEDs while the LEDs (10) are fixed inside the chamber (51) to place the LEDs in the gap between the fluorescent elements tami (20, 30);
step (c) also includes the step of laying the connecting element from the electrode (81) to the LEDs (10) in order to electrically connect the LEDs (10) to the electrode (81), and the step of forming the conductive layer (80A) at least at least one of the fluorescent elements (20, 30) in order to electrically connect the LEDs to the electrode (81),
Moreover, step (a), in addition, includes the step of forming a plurality of channel openings (70) in the fixing element (5) so as to ensure that the camera (51) communicates to accommodate the LEDs with the external environment, allowing heat to be dissipated from the LEDs (10) inside the camera (51) to accommodate the LEDs.

Images