RU240203U1 - Adapter for installing microcircuits in SSOP-10 package on the back side of DIP-10 mounting site on the main printed circuit board - Google Patents

Abstract

This utility model relates to microcircuit adapters. The technical result consists of enabling the installation of microcircuits in an SSOP-10 package on the reverse side of a DIP-10 footprint on a main printed circuit board, ensuring the appropriate switching logic. This technical result is achieved by an adapter comprising a main substrate, on one side of which a panel for the microcircuit in the SSOP-10 package is mounted, electrically connected to through-hole metallized contact holes of the DIP-10 footprint formed on the substrate. In this case, in the view from the panel side, the panel terminals are connected to the contact holes of the DIP-10 landing site in the following order: 1st with 10th, 2nd with 9th, 3rd with 8th, 4th with 7th, 5th with 6th, 6th with 5th, 7th with 4th, 8th with 3rd, 9th with 2nd and 10th with 1st. 3 fig.

Description

Field of technology

This utility model relates to microcircuit adapters, more specifically, to adapters with a ZIF panel for removable installation of microcircuits in SSOP-10 packages on the backside of a DIP-10 footprint on a main printed circuit board. This utility model can be used for removable mounting of surface-mount microcircuits in devices designed for through-hole packages, without the need to redesign the main printed circuit board.

State of the art

A prior art chip adapter described in patent CN 200983360 Y, issued November 28, 2007, comprises a transition printed circuit board (PCB) containing dual-in-line (d.i.l.) pins and corresponding solder pads designed for mounting chips in PLCC or SOIC packages. These pads are electrically connected to the DIP pins in a direct order: the first pin of the SOIC chip is connected to the first pin of the DIP, the second to the second, and so on, providing a direct pinout without cross-connections. This allows, when mounting the adapter on a DIP chip on a main PCB, the chip to be replaced with a chip in an SOIC package while maintaining the same connection diagram, without the need to redesign the main PCB. The design of the well-known adapter assumes direct pinout: the SOIC pins directly correspond to the DIP pins in terms of numbering, which is only acceptable when installed on the side of the main printed circuit board where the microcircuit seat in the DIP package is located.

The electrical connections in the known solution for mounting an adapter with a microcircuit in a SOIC package on the back side of the main printed circuit board (opposite to the mounting site of the microcircuit in the DIP package), due to the mirror image of two rows of contact holes of the DIP package mounting site, lead to a numbering mismatch, i.e., they do not ensure the correspondence of the pins of the SOIC package on the adapter printed circuit board and the contact holes of the DIP package mounting site on the main printed circuit board, as a result of which the connection logic is disrupted.

Thus, the existing pinout of the adapter board does not allow for correct switching between the SSOP-10 pins and the DIP-10 contact holes when mounted on the rear side of the main PCB. This precludes the use of this solution in cases where design or manufacturing requirements require the adapter board to be mounted on the rear side of the main PCB. Furthermore, the existing solution does not allow for removable installation of the chip within the SSOP-10 package—it is mounted by soldering, which complicates chip replacement in the event of a malfunction or the need for reprogramming. This also limits the number of installation/removal cycles, reducing the ease of use and serviceability of the device.

Also known from the prior art is the STK5XX integrated circuit module, described in patent KR 20080000110 U, dated January 28, 2008, designed for programming ATMEL microcontrollers using the STK500 basic programmer. This known technical solution is a universal add-on (top module) combining the functions of several specialized modules (STK501, STK503, STK505, STK520, STK525), allowing the connection of various adapters – both for SOIC and TQFP packages and for their corresponding connectors. This utilizes a system of interchangeable printed and pluggable adapters connected to a common universal programmer board.

Despite the stated advantages, the known technical solution is not intended for the removable installation of an SSOP-10 microcircuit as part of an adapter on the reverse side of a DIP-10 footprint on the main board while maintaining the correspondence of the contact pins, since the electrical connections in known adapters do not provide the mirror switching required for installation on the opposite side from the DIP-10 footprint, which excludes the use of such adapters in conditions where installation can only be performed from the reverse side, for example, due to limitations in the layout or dimensions of the device housing.

Thus, the known technical solution does not allow for the correct installation of a microcircuit in an SSOP-10 package on the reverse side of the DIP-10 package seat on the main printed circuit board, which limits its applicability in tasks of directly replacing DIP-10 microcircuits with SSOP-10 without redesigning the main board.

Disclosure of a utility model

Thus, the objective of the utility model is to eliminate the shortcomings of the prior art, and the technical result of the utility model is to create an adapter that enables the installation of microcircuits in an SSOP-10 package on the back side of a DIP-10 seat on the main printed circuit board, ensuring the appropriate switching connection logic.

The mentioned technical result is achieved by means of an adapter for installing microcircuits in the SSOP-10 case on the back side of the DIP-10 seat on the main printed circuit board, which contains

the main substrate, on one side of which a panel for a microcircuit in an SSOP-10 package is installed,

which is electrically connected to the through metallized contact holes of the DIP-10 footprint made on the substrate,

in this case, in the view from the side of the said panel,

The 1st terminal of the panel is connected to the 10th contact hole of the DIP-10 landing site,

The 2nd pin of the panel is connected to the 9th contact hole of the DIP-10 mounting site,

The 3rd pin of the panel is connected to the 8th contact hole of the DIP-10 mounting site,

The 4th pin of the panel is connected to the 7th contact hole of the DIP-10 mounting site,

The 5th pin of the panel is connected to the 6th contact hole of the DIP-10 mounting site,

The 6th pin of the panel is connected to the 5th contact hole of the DIP-10 mounting site,

The 7th pin of the panel is connected to the 4th contact hole of the DIP-10 mounting site,

The 8th pin of the panel is connected to the 3rd contact hole of the DIP-10 landing site,

The 9th pin of the panel is connected to the 2nd contact hole of the DIP-10 landing site,

The 10th pin of the panel is connected to the 1st contact hole of the DIP-10 landing site.

It's worth noting that the adapter's mirror-image pinout design allows for easy installation of SSOP-10 packaged ICs on existing device printed circuit boards (PCBs) using the reverse side of the DIP-10 footprint. This design also ensures reliable switching that complies with the connection logic and allows the adapter to be used in cases where design or process requirements require it to be installed on the reverse side of the main PCB.

In a particular implementation form of an adapter for installing microcircuits in an SSOP-10 package on the back side of a DIP-10 seat on the main printed circuit board, the mentioned panel for the microcircuit in the SSOP-10 package is made in the form of a ZIF panel for the microcircuit in the SSOP-10 package.

This allows for quick installation and removal of SSOP-10 packaged microcircuits from the DIP-10 footprint on the main printed circuit board.

Installing an adapter with a ZIF backplane and an SSOP-10 chip on the reverse side of the main PCB is useful when mounting the chip from the DIP-10 footprint is impossible due to design constraints, such as height limitations or dense component placement. Placing the adapter on the reverse side allows for access to other circuit elements, calibration nodes, or interface connectors located on the main side of the board. Removable chip installation via an adapter with a ZIF backplane is especially useful during development, setup, or device maintenance, when multiple chip replacements are required without soldering. This improves repairability, speeds up testing and calibration processes, and allows the use of a single main board with different SSOP-10 chips for debugging or comparative analysis. In addition, using an adapter with a ZIF panel is justified in cases where soldering is impossible or undesirable - for example, when working with sensitive or non-standard microcircuits.

Brief description of the drawings

The utility model is illustrated by Fig. 1, 2 and 3, which show an example of the design in a view from two sides and an electrical circuit diagram of an adapter for the removable installation of microcircuits in an SSOP-10 case from the back side of the DIP-10 seat on the main printed circuit board, respectively.

Implementation of a utility model

The adapter, illustrated in Fig. 1, 2 and 3, is designed for removable installation of a microcircuit in an SSOP-10 package from the back side of a DIP-10 seat on the main printed circuit board of the device.

As shown in Figs. 1 and 2, the adapter includes a base substrate (1), which can be made, for example, of FR4 fiberglass, polyimide, or another dielectric used in the production of printed circuit boards. A ZIF panel (2) is mounted on one side of the substrate (1) for removable installation of a microcircuit in an SSOP-10 package. The pins of the ZIF panel (2) are electrically connected to metallized contact holes (3) located on the substrate (1) in accordance with the arrangement of the DIP-10 pins. These connections can be made using current-carrying copper tracks formed on the surface of the substrate using a photoresist method and subsequent etching. Metallization of the holes (3) is achieved by applying a metal coating, most often copper, to the inner walls of the holes, which ensures reliable electrical contact between the layers of the board or components on the opposite side.

Fig. 3 shows the electrical circuit diagram of the adapter that implements a mirror connection of the ZIF-panel pins with the contact holes of the DIP-10. In particular, in the view from the ZIF-panel side, its pins are connected to the contact holes of the DIP-10 mounting site in the following order: 1st with 10th, 2nd with 9th, 3rd with 8th, 4th with 7th, 5th with 6th, 6th with 5th, 7th with 4th, 8th with 3rd, 9th with 2nd and 10th with 1st.

This mirror-image alignment ensures proper connection of the SSOP-10 packaged chip when installed in an adapter on the back of a DIP-10 footprint on the main PCB. This is especially important when component height or top-side mounting density are limited.

The following installation procedure is provided for the implementation of the utility model.

The adapter is connected to the main printed circuit board using contact leads (pin contacts), which are metal elements that provide an electrical and mechanical connection between the adapter and the main printed circuit board.

Examples of contact pin design:

individual metal pins similar to the pin contacts of standard connectors;

lengths of stiff wire formed to fit into holes;

specially manufactured metal elements with a straight or profiled shape.

Contact terminals can be made from materials that provide the necessary mechanical strength and good solderability, such as tinned copper, bronze or brass.

Position of elements on the adapter when assembled:

The contact pins are installed and soldered into the metallized holes of the adapter on the side opposite the location of the ZIF panel.

The free ends of the contact pins are intended for installation in the contact holes of the DIP-10 mounting site on the main printed circuit board from its reverse side.

The adapter is installed on the main printed circuit board and secured by soldering the contact pins into the holes of the DIP-10 mounting site on its back side.

The SSOP-10 packaged chip is removable and housed within the adapter's ZIF socket. It should be noted that the pins of the SSOP-10 packaged chip, when installed within the adapter's ZIF socket, correspond directly to the pins of the ZIF socket itself: the first pin of the chip contacts the first pin of the ZIF socket, the second pin contacts the second pin of the ZIF socket, and so on. This is due to the design of ZIF sockets, which are originally intended for removable installation of chips without inversion or mirrored numbering. Therefore, when installing the chip within the ZIF socket, precise alignment of the electrical circuits between the corresponding pins of the SSOP-10 package and the adapter's ZIF contacts is ensured, which is critical for subsequent correct connection to the contact holes of the DIP-10 footprint on the main board. This approach allows for mirror pinout to be implemented directly on the adapter substrate and eliminates the need for numbering inversion at the contact interface level between the chip and the ZIF board, ensuring reliable and predictable connections under reverse assembly conditions.

Variant of the sequence of soldering operations.

Installing contact pins into the metallized holes of the adapter from the side opposite the ZIF panel, followed by soldering.

Installing the adapter with contact pins on the main printed circuit board from the opposite side relative to the DIP-10 seat.

Soldering the contact pins into the corresponding holes of the DIP-10 mounting site of the main printed circuit board.

This design ensures:

reliable electrical connection between the SSOP-10 microcircuit located in the ZIF panel and the main printed circuit board via an adapter;

mechanical stability of the connection due to rigid fixing of the contact terminals;

the possibility of removable placement of the SSOP-10 chip in conditions of limitations on the height of components and placement density on the main board.

Implementing the described connection scheme on a ZIF-panel adapter allows the use of chips in SSOP-10 packages without redesigning the main PCB. This ensures convenient and reliable connections and is an optimal solution for developing, debugging, or servicing devices that require multiple chip replacements without soldering. This solution improves repairability, speeds up testing and calibration processes, allows the use of a single board with various SSOP-10 chips, and is also useful in situations where soldering is impossible or undesirable—for example, when working with sensitive or non-standard components. The ability to mount the adapter on the back of the main PCB makes it particularly useful in space-constrained or high-density environments.

Claims (15)

1. An adapter for installing microcircuits in the SSOP-10 package on the back side of the DIP-10 seat on the main printed circuit board, containing the main substrate, on one side of which a panel for a microcircuit in an SSOP-10 package is installed, which is electrically connected to the through metallized contact holes of the DIP-10 footprint made on the substrate, in this case, in the view from the side of the said panel, The 1st pin of the panel is connected to the 10th contact hole of the DIP-10 landing site, The 2nd pin of the panel is connected to the 9th contact hole of the DIP-10 mounting site, The 3rd pin of the panel is connected to the 8th contact hole of the DIP-10 mounting site, The 4th pin of the panel is connected to the 7th contact hole of the DIP-10 mounting site, The 5th pin of the panel is connected to the 6th contact hole of the DIP-10 mounting site, The 6th pin of the panel is connected to the 5th contact hole of the DIP-10 mounting site, The 7th pin of the panel is connected to the 4th contact hole of the DIP-10 mounting site, The 8th pin of the panel is connected to the 3rd contact hole of the DIP-10 landing site, The 9th pin of the panel is connected to the 2nd contact hole of the DIP-10 landing site, The 10th pin of the panel is connected to the 1st contact hole of the DIP-10 landing site. 2. The adapter according to item 1, in which the said panel for a microcircuit in an SSOP-10 package is made in the form of a ZIF panel for a microcircuit in an SSOP-10 package.