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PH12020500005B1 - Resin film forming film and resin film forming composite sheet - Google Patents

Resin film forming film and resin film forming composite sheet

Info

Publication number
PH12020500005B1
PH12020500005B1 PH1/2020/500005A PH12020500005A PH12020500005B1 PH 12020500005 B1 PH12020500005 B1 PH 12020500005B1 PH 12020500005 A PH12020500005 A PH 12020500005A PH 12020500005 B1 PH12020500005 B1 PH 12020500005B1
Authority
PH
Philippines
Prior art keywords
film forming
resin film
test specimen
composite sheet
immersed
Prior art date
Application number
PH1/2020/500005A
Other languages
English (en)
Other versions
PH12020500005A1 (en
Inventor
Keishi Fuse
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12020500005A1 publication Critical patent/PH12020500005A1/en
Publication of PH12020500005B1 publication Critical patent/PH12020500005B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H10P72/7402—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Engineering & Computer Science (AREA)
  • Dicing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
PH1/2020/500005A 2017-07-06 2018-05-11 Resin film forming film and resin film forming composite sheet PH12020500005B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017132980 2017-07-06
PCT/JP2018/018248 WO2019008898A1 (fr) 2017-07-06 2018-05-11 Film formant un film de résine et feuille composite formant un film de résine

Publications (2)

Publication Number Publication Date
PH12020500005A1 PH12020500005A1 (en) 2021-01-11
PH12020500005B1 true PH12020500005B1 (en) 2023-05-17

Family

ID=64950807

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2020/500005A PH12020500005B1 (en) 2017-07-06 2018-05-11 Resin film forming film and resin film forming composite sheet

Country Status (8)

Country Link
JP (1) JP7044780B2 (fr)
KR (1) KR102507152B1 (fr)
CN (1) CN110831766B (fr)
MY (1) MY194458A (fr)
PH (1) PH12020500005B1 (fr)
SG (1) SG11201913224TA (fr)
TW (1) TWI743361B (fr)
WO (1) WO2019008898A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020184475A1 (fr) * 2019-03-08 2020-09-17 帝人株式会社 Composite élément polymère/base inorganique, son procédé de production, et élément polymère pour celui-ci
CN114206610A (zh) * 2019-08-09 2022-03-18 Skc株式会社 接合用膜及包括其的透光层叠体
JP7471879B2 (ja) * 2020-03-18 2024-04-22 リンテック株式会社 フィルム状接着剤及びダイシングダイボンディングシート
JP7471880B2 (ja) * 2020-03-18 2024-04-22 リンテック株式会社 フィルム状接着剤及びダイシングダイボンディングシート
JP7387510B2 (ja) * 2020-03-26 2023-11-28 リンテック株式会社 保護膜形成フィルム、保護膜形成用複合シート、及び保護膜形成フィルム付きワークの搬送方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4331047B2 (ja) * 2004-04-28 2009-09-16 信越ポリマー株式会社 電子部品保持具の製造方法
JP4732472B2 (ja) 2007-03-01 2011-07-27 日東電工株式会社 熱硬化型ダイボンドフィルム
JP5483734B2 (ja) * 2007-10-25 2014-05-07 コーロン インダストリーズ インク フィルム型感光性転写材料
JP5390209B2 (ja) 2009-02-04 2014-01-15 日東電工株式会社 熱硬化型ダイボンドフィルム
JP4717156B1 (ja) * 2010-11-01 2011-07-06 協和界面科学株式会社 剥離試験装置
SG11201602049TA (en) * 2013-09-30 2016-04-28 Lintec Corp Composite sheet for resin film formation
SG11201605465SA (en) * 2014-01-08 2016-08-30 Lintec Corp Composite sheet for protective-film formation
WO2017010385A1 (fr) * 2015-07-10 2017-01-19 日東電工株式会社 Module solaire, procédé de fabrication de module solaire, et procédé de câblage de cellule solaire

Also Published As

Publication number Publication date
TWI743361B (zh) 2021-10-21
KR102507152B1 (ko) 2023-03-07
JPWO2019008898A1 (ja) 2020-05-21
KR20200026833A (ko) 2020-03-11
MY194458A (en) 2022-11-30
JP7044780B2 (ja) 2022-03-30
CN110831766A (zh) 2020-02-21
PH12020500005A1 (en) 2021-01-11
SG11201913224TA (en) 2020-01-30
TW201907491A (zh) 2019-02-16
WO2019008898A1 (fr) 2019-01-10
CN110831766B (zh) 2021-09-21

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