KR102714991B1 - Display device and method for fabricating the same - Google Patents

Abstract

A display device includes a base layer including a display area and a non-display area, a device layer including at least one organic layer, an encapsulation layer, an input sensing layer disposed on the encapsulation layer and including an electrode and a signal line electrically connected to the electrode, a pad electrically connected to the signal line and disposed in the non-display area, a dam disposed in the non-display area, a portion of which is disposed between the pad and the display area when viewed in a plan view, and a bank disposed in the non-display area, a portion of which is disposed between the portion of the dam and the pad when viewed in a plan view and does not overlap with the at least one organic layer, wherein the bank includes a first portion and a second portion, and a distance between an upper surface of the first portion of the bank and the base layer has a first distance, a distance between an upper surface of the second portion of the bank and the base layer has a second distance, and the first distance may be different from the second distance.

Description

DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME

The present invention relates to a display device and a manufacturing method thereof, and more specifically, to a display device and a manufacturing method thereof that improve defects occurring during a touch line wiring patterning process.

Various display devices are being developed for use in multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, and game consoles. The input devices of the display devices include keyboards and mice. In addition, recently, display devices have been equipped with touch-sensitive units as input devices.

The present invention relates to a display device and a manufacturing method thereof, and more specifically, to a display device and a manufacturing method thereof that improve defects occurring during a touch line wiring patterning process.

A display device according to one embodiment of the present invention includes a base layer including a display area and a non-display area, an element layer including a plurality of light-emitting elements arranged in the display area of the base layer, an encapsulation layer disposed on the element layer and including at least one inorganic layer and at least one organic layer, an input sensing layer disposed on the encapsulation layer and including an electrode and a signal line electrically connected to the electrode, a pad electrically connected to the signal line and arranged in the non-display area, a dam disposed in the non-display area, a portion of which is disposed between the pad and the display area when viewed in a plan view, and a bank disposed in the non-display area, a portion of which is disposed between the portion of the dam and the pad when viewed in a plan view, the bank not overlapping with the at least one organic layer, the bank including a first portion and a second portion, and a distance between an upper surface of the first portion of the bank and the base layer has a first distance, a distance between an upper surface of the second portion of the bank and the base layer has a second distance, and the first distance may be different from the second distance.
At least a portion of said signal line may be disposed above said second portion of said bank.
The above bank further includes an inclined third portion disposed between the first portion and the second portion, and the first distance may be greater than the second distance.
The display device is disposed over the bank and further includes a capping layer comprising the same material as the signal line, and at least a portion of the capping layer can be disposed over the third portion of the bank.
The first portion, the third portion, and the second portion are arranged along a first direction, the pads are provided in plurality, the plurality of pads are arranged along the first direction, and the signal line can be spaced apart from the capping layer in the first direction.
The above display area may include a first non-folding area, a folding area, and a second non-folding area arranged in a second direction intersecting the first direction.
The above bank may have a stepped shape.
The sealing layer includes a first inorganic thin film, an organic thin film disposed on the first inorganic thin film, and a second inorganic thin film disposed on the organic thin film, wherein the first inorganic thin film and the second inorganic thin film cover the dam, and the bank may non-overlap with the first inorganic thin film and the second inorganic thin film.
The above signal line may overlap the above dam.
A display device according to one embodiment of the present invention comprises: a base layer including a display area and a non-display area, an element layer including a plurality of light-emitting elements arranged in the display area of the base layer, an encapsulation layer disposed on the element layer and including at least one inorganic layer and at least one organic layer, an input sensing layer disposed on the encapsulation layer and including an electrode and a signal line electrically connected to the electrode, a pad electrically connected to the signal line and arranged in the non-display area, a dam disposed in the non-display area and having a portion disposed between the pad and the display area when viewed in a plan view, a bank disposed in the non-display area and having a portion disposed between the portion of the dam and the pad when viewed in a plan view and not overlapping with the at least one organic layer, and a capping layer disposed on the bank and including the same material as the signal line, wherein the bank includes a first portion having a first thickness, a second portion having a second thickness different from the first thickness, and a third portion disposed between the first portion and the second portion, and at least a portion of the capping layer is disposed between the first portion and the second portion of the bank. It can be placed on top of the third part.
The second thickness is smaller than the first thickness, and at least a portion of the signal line can be disposed over the second portion of the bank.
The above bank may have a stepped shape.
A foldable portable electronic device according to one embodiment of the present invention comprises: a base layer including an active region and a non-display region, an element layer including a plurality of light-emitting elements arranged in the active region of the base layer, an encapsulation layer disposed on the element layer and including at least one inorganic layer and at least one organic layer, an input sensing layer disposed on the encapsulation layer and including an electrode and a signal line electrically connected to the electrode, a pad electrically connected to the signal line and arranged in the non-display region, a dam disposed in the non-display region and having a portion disposed between the pad and the active region when viewed in a plan view, and a bank disposed in the non-display region and having a portion disposed between the portion of the dam and the pad when viewed in a plan view, the bank not overlapping with the at least one organic layer, the active region including a first non-folding region, a folding region, and a second non-folding region arranged in a first direction, the bank extending in a second direction different from the first direction, the bank including a first portion and a second portion, and an upper surface of the first portion of the bank and the base layer The distance between the upper surface of the second portion of the bank and the base layer has a first distance, and the distance between the upper surface of the second portion of the bank and the base layer has a second distance, and the first distance may be different from the second distance.
At least a portion of said signal line may be arranged over said second portion of said bank.
The above bank may have a stepped shape.
The above bank further includes a third inclined portion disposed between the first portion and the second portion, and the first distance may be greater than the first distance.
The above foldable portable electronic device is disposed over the bank and further includes a capping layer including the same material as the signal line, and at least a portion of the capping layer can be disposed over the third portion of the bank.
A flexible device according to one embodiment of the present invention comprises: a base layer including an active region and a non-display region, an element layer including a plurality of light-emitting elements arranged in the active region of the base layer, an encapsulation layer disposed on the element layer and including at least one inorganic layer and at least one organic layer, an input sensing layer disposed on the encapsulation layer and including an electrode and a signal line electrically connected to the electrode, a pad electrically connected to the signal line and arranged in the non-display region, a dam disposed in the non-display region and having a portion disposed between the pad and the active region when viewed in a plan view, and a bank disposed in the non-display region and having a portion disposed between the portion of the dam and the pad when viewed in a plan view, and which does not overlap with the at least one organic layer, wherein the active region includes a non-folding region and a flexible region adjacent in a first direction, the bank extending in a second direction different from the first direction, the bank including a first portion and a second portion, and a distance between an upper surface of the first portion of the bank and the base layer has a first distance, and the The distance between the upper surface of the second portion of the bank and the base layer has a second distance, and the first distance may be different from the second distance.
At least a portion of said signal line may be disposed above said second portion of said bank.
The above bank further includes a third inclined portion disposed between the first portion and the second portion, and the first distance may be greater than the first distance.
The flexible device is disposed over the bank and further includes a capping layer comprising the same material as the signal line, wherein at least a portion of the capping layer can be disposed over the third portion of the bank.
The above bank may have a stepped shape.

The present invention prevents organic substances inside the bank from leaking during an etching process due to insufficient thickness of a photoresist layer formed on the boundary by forming a capping pattern at an inclined boundary of the bank, thereby preventing phenomena such as film lifting from occurring.

FIG. 1 is a perspective view of a first operation of a display device according to one embodiment of the present invention.
FIG. 2A is a perspective view of a second operation of a display device according to one embodiment of the present invention.
FIG. 2b is a perspective view of a third operation of a display device according to one embodiment of the present invention.
FIG. 2c is a cross-sectional view of a display device according to one embodiment of the present invention.
FIGS. 3A and 3B are perspective views of a display device according to one embodiment of the present invention.
FIG. 4a is a cross-sectional view of a display module according to one embodiment of the present invention.
FIG. 4b is a plan view of an organic light-emitting display panel according to one embodiment of the present invention.
Figure 5 is an equivalent circuit diagram of a pixel according to one embodiment of the present invention.
FIGS. 6A and 6B are partial cross-sectional views of an organic light-emitting display panel according to one embodiment of the present invention.
FIGS. 7A to 7C are cross-sectional views of thin film encapsulation layers according to one embodiment of the present invention.
FIG. 8a is a cross-sectional view of a touch sensing unit according to one embodiment of the present invention.
FIGS. 8b to 8e are plan views of a touch sensing unit according to one embodiment of the present invention.
Figure 8f is a partial enlarged view of area AA of Figure 8e.
Figure 9 is a cross-sectional view taken along line AA' of Figure 8E.
Figure 10a is a cross-sectional view taken along the BB' line of Figure 8E.
FIG. 10b is a cross-sectional view of a bank (BAK) according to another embodiment of the present invention.
Figure 11 is a perspective view of a portion of the bank.
FIGS. 12A to 12G are drawings illustrating a process of forming a first capping pattern on a bank.
Figures 13a to 13c are plan views illustrating another embodiment of the present invention.
Fig. 14 is a cross-sectional view illustrating another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this specification, when a component (or region, layer, portion, etc.) is said to be "on", "connected", or "coupled" to another component, it means that it can be directly connected/coupled to the other component, or a third component may be arranged between them.

Identical drawing reference numerals refer to identical components. Also, in the drawings, the thicknesses, proportions, and dimensions of the components are exaggerated for the purpose of effectively explaining the technical contents. "And/or" includes all combinations of one or more that the associated configurations can define.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are only used to distinguish one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. The singular expression includes the plural expression unless the context clearly indicates otherwise.

Additionally, terms such as "below," "lower," "above," and "upper," are used to describe the relationships between components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

It should be understood that the terms "include" or "have" are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

Fig. 1 is a perspective view of a display device (DD) according to a first operation according to an embodiment of the present invention. Fig. 2a is a perspective view of a display device (DD) according to a second operation according to an embodiment of the present invention. Fig. 2b is a perspective view of a display device (DD) according to a third operation according to an embodiment of the present invention.

As illustrated in FIG. 1, in the first operation mode, the display surface (IS) on which the image (IM) is displayed is parallel to a plane defined by the first direction axis (DR1) and the second direction axis (DR2). The normal direction of the display surface (IS), i.e., the thickness direction of the display device (DD), is indicated by the third direction axis (DR3). The front (or upper surface) and the back (or lower surface) of each member are distinguished by the third direction axis (DR3). However, the directions indicated by the first to third direction axes (DR1, DR2, DR3) are relative concepts and can be converted into other directions. Hereinafter, the first to third directions refer to the same drawing reference numerals as the directions indicated by the first to third direction axes (DR1, DR2, DR3), respectively.

FIG. 1, FIG. 2A, and FIG. 2B illustrate a foldable display device as an example of a flexible display device (DD). However, the present invention may be a rollable display device or a banded display device that is rolled up, and is not particularly limited thereto. In addition, although a flexible display device is illustrated in the present embodiment, the present invention is not limited thereto. The display device (DD) according to the present embodiment may be a flat rigid display device. The flexible display device (DD) according to the present invention can be used in large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as mobile phones, tablets, car navigation systems, game consoles, and smart watches.

As illustrated in FIG. 1, the display surface (IS) of the flexible display device (DD) may include a plurality of areas. The flexible display device (DD) includes a display area (DD-DA) on which an image (IM) is displayed and a non-display area (DD-NDA) adjacent to the display area (DD-DA). The non-display area (DD-NDA) is an area on which an image is not displayed. FIG. 1 illustrates a vase as an example of the image (IM). As an example, the display area (DD-DA) may have a rectangular shape. The non-display area (DD-NDA) may surround the display area (DD-DA). However, the present invention is not limited thereto, and the shape of the display area (DD-DA) and the shape of the non-display area (DD-NDA) may be designed relatively.

As illustrated in FIGS. 1, 2A, and 2B, the display device (DD) may include a plurality of regions defined according to an operation form. The display device (DD) may include a bending region (BA) that is bent on the basis of a bending axis (BX), a first non-bending region (NBA1) that is not bent, and a second non-bending region (NBA2). As illustrated in FIG. 2A, the display device (DD) may be inner-bended so that the display surface (IS) of the first non-bending region (NBA1) and the display surface (IS) of the second non-bending region (NBA2) face each other. As illustrated in FIG. 2B, the display device (DD) may also be outer-bended so that the display surface (IS) is exposed to the outside.

In one embodiment of the present invention, the display device (DD) may include a plurality of bending areas (BA). In addition, the bending areas (BA) may be defined to correspond to the manner in which the user operates the display device (DD). For example, unlike FIGS. 2A and 2B, the bending areas (BA) may be defined parallel to the first direction axis (DR1) or may be defined in a diagonal direction. The area of the bending areas (BA) is not fixed and may be determined according to the radius of curvature. In one embodiment of the present invention, the display device (DD) may be configured to repeat only the operation modes illustrated in FIGS. 1 and 2A.

Fig. 2c is a cross-sectional view of a display device (DD) according to one embodiment of the present invention. Fig. 2 illustrates a cross-section defined by a second direction axis (DR2) and a third direction axis (DR3).

As shown in Fig. 2c, A display device (DD) includes a protective film (PM), a display module (DM), an optical member (LM), a window (WM), a first adhesive member (AM1), a second adhesive member (AM2), and a third adhesive member (AM3). The display module (DM) is disposed between the protective film (PM) and the optical member (LM). The optical member (LM) is disposed between the display module (DM) and the window (WM). The first adhesive member (AM1) combines the display module (DM) and the protective film (PM), the second adhesive member (AM2) combines the display module (DM) and the optical member (LM), and the third adhesive member (AM3) combines the optical member (LM) and the window (WM).

The protective film (PM) protects the display module (DM). The protective film (PM) provides a first outer surface (OS-L) exposed to the outside and an adhesive surface that is adhered to the first adhesive member (AM1). The protective film (PM) prevents external moisture from penetrating the display module (DM) and absorbs external impact.

The protective film (PM) may include a plastic film as a base substrate. The protective film (PM) may include a plastic film including any one selected from the group consisting of polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylenenaphthalate (PEN), polyethyleneterephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), polyarylene ether sulfone (poly(arylene ethersulfone)), and combinations thereof.

The material constituting the protective film (PM) is not limited to plastic resins and may include organic/inorganic composite materials. The protective film (PM) may include a porous organic layer and an inorganic material filled in the pores of the organic layer. The protective film (PM) may further include a functional layer formed on a plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating method. In one embodiment of the present invention, the protective film (PM) may be omitted.

The window (WM) may include a plastic film. The window (WM) may have a multilayer structure. The window (WM) may have a multilayer structure selected from a glass substrate, a plastic film, and a plastic substrate. The window (WM) may further include a bezel pattern. The multilayer structure may be formed through a continuous process or an adhesive process using an adhesive layer.

The optical member (LM) reduces external light reflectance. The optical member (LM) may include at least a polarizing film. The optical member (LM) may further include a phase difference film. In one embodiment of the present invention, the optical member (LM) may be omitted.

The display module (DM) may include an organic light-emitting display panel (DP) and a touch sensing unit (TS). The touch sensing unit (TS) is directly disposed on the organic light-emitting display panel (DP). In this specification, the term "directly disposed" means formed by a continuous process, excluding attachment using a separate adhesive layer.

The organic light-emitting display panel (DP) generates an image (IM, see FIG. 1) corresponding to input image data. The organic light-emitting display panel (DP) provides a first display panel surface (BS1-L) and a second display panel surface (BS1-U) facing each other in the thickness direction (DR3). Although the organic light-emitting display panel (DP) is exemplarily described in this embodiment, the display panel is not limited thereto.

The touch detection unit (TS) obtains coordinate information of external input. The touch detection unit (TS) can detect external input using a capacitive method.

Although not shown separately, the display module (DM) according to one embodiment of the present invention may further include an anti-reflection layer. The anti-reflection layer may include a color filter or a laminated structure of a conductive layer/insulating layer/conductive layer. The anti-reflection layer may absorb, cancel, or polarize light incident from the outside to reduce the external light reflectance. The anti-reflection layer may replace the function of the optical member (LM).

Each of the first adhesive member (AM1), the second adhesive member (AM2), and the third adhesive member (AM3) may be an organic adhesive layer such as an optically clear adhesive film (OCA), an optically clear adhesive resin (OCR), or a pressure sensitive adhesive film (PSA). The organic adhesive layer may include an adhesive material such as a polyurethane type, a polyacrylic type, a polyester type, a polyepoxy type, or a polyvinyl acetate type. As a result, the organic adhesive layer corresponds to one of the organic layers.

Although not shown separately, the display device (DD) may further include a frame structure that supports the functional layers to maintain the states shown in FIGS. 1, 2a, and 2b. The frame structure may include a joint structure or a hinge structure.

Figures 3a and 3b are perspective views of a display device (DD-1) according to one embodiment of the present invention. Figure 3a illustrates the display device (DD-1) in an unfolded state, and Figure 3b illustrates the display device (DD-1) in a bent state.

The display device (DD-1) may include one bending area (BA) and one non-bending area (NBA). The non-display area (DD-NDA) of the display device (DD-1) may be bent. However, in one embodiment of the present invention, the bending area of the display device (DD-1) may be changed.

The display device (DD-1) according to the present embodiment can be operated while being fixed in one form, unlike the display devices (DD) illustrated in FIGS. 1, 2a, and 2b. The display device (DD-1) can be operated in a bent state as illustrated in FIG. 3b. The display device (DD-1) can be fixed to a frame or the like in a bent state, and the frame can be coupled with a housing of an electronic device.

The display device (DD-1) according to the present embodiment may have the same cross-sectional structure as that illustrated in FIG. 2c. However, the non-bending area (NBA) and the bending area (BA) may have different laminated structures. The non-bending area (NBA) may have the same cross-sectional structure as that illustrated in FIG. 2c, and the bending area (BA) may have a different cross-sectional structure than that illustrated in FIG. 2c. The optical member (LM) and the window (WM) may not be placed in the bending area (BA). That is, the optical member (LM) and the window (WM) may only be placed in the non-bending area (NBA). The second adhesive member (AM2) and the third adhesive member (AM3) may also not be placed in the bending area (BA).

FIG. 4a is a cross-sectional view of a display module (DM) according to an embodiment of the present invention. FIG. 4b is a plan view of an organic light-emitting display panel (DP) according to an embodiment of the present invention. FIG. 5 is an equivalent circuit diagram of a pixel (PX) according to an embodiment of the present invention. FIGS. 6a and 6b are partial cross-sectional views of an organic light-emitting display panel (DP) according to an embodiment of the present invention.

As illustrated in FIG. 4a, the organic light-emitting display panel (DP) includes a base layer (SUB), a circuit layer (DP-CL) disposed on the base layer (SUB), a device layer (DP-OLED), and a thin film encapsulation layer (TFE). The base layer (SUB) may include at least one plastic film. The base layer (SUB) may include a flexible substrate, such as a plastic substrate, a glass substrate, a metal substrate, or an organic/inorganic composite material substrate.

The circuit layer (DP-CL) may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the circuit layer (DP-CL) may form a control circuit of signal lines or pixels. The device layer (DP-OLED) includes organic light-emitting diodes. The thin film encapsulation layer (TFE) includes an inorganic layer and an organic layer. The thin film encapsulation layer (TFE) may include at least two inorganic layers and an organic layer disposed therebetween. The inorganic layers protect the light-emitting device layer (DP-OLED) from moisture/oxygen, and the organic layer protects the light-emitting device layer (DP-OLED) from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, and the like. The organic layer may include, but is not limited to, an acrylic-based organic material.

The touch sensing unit (TS) is directly disposed on the thin film encapsulation layer (TFE). The touch sensing unit (TS) includes touch sensors and touch signal lines. The touch sensors and touch signal lines may have a single-layer or multi-layer structure.

The touch sensors and touch signal lines may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and graphene. The touch sensors and touch signal lines may include a metal layer, such as molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The touch sensors and touch signal lines may have the same layer structure or different layer structures. Specific details regarding the touch detection unit (TS) will be described later.

FIG. 4b is a plan view of an organic light-emitting display panel (DP) according to an embodiment of the present invention, and FIG. 5 is an equivalent circuit diagram of a pixel (PX) according to an embodiment of the present invention.

As illustrated in FIG. 4b, the organic light-emitting display panel (DP) includes a display area (DA) and a non-display area (NDA) on a plane. The display area (DA) and the non-display area (NDA) of the organic light-emitting display panel (DP) correspond to the display area (DD-DA, see FIG. 1) and the non-display area (DD-NDA, see FIG. 1) of the display device (DD, see FIG. 1), respectively. The display area (DA) and the non-display area (NDA) of the organic light-emitting display panel (DP) are not necessarily the same as the display area (DD-DA, see FIG. 1a) and the non-display area (DD-NDA, see FIG. 1) of the display device (DD, see FIG. 1) and may be changed depending on the structure/design of the organic light-emitting display panel (DP).

An organic light-emitting display panel (DP) includes a plurality of pixels (PX). An area where a plurality of pixels (PX) are arranged is defined as a display area (DA). In the present embodiment, a non-display area (NDA) may be defined along the border of the display area (DA).

The organic light-emitting display panel (DP) includes gate lines (GL), data lines (DL), light-emitting lines (EL), a control signal line (SL-D), an initialization voltage line (SL-Vint), a voltage line (SL-VDD), a first pad (PD1), and a power supply line (E-VSS).

The gate lines (GL) are respectively connected to corresponding pixels (PX) among the plurality of pixels (PX), and the data lines (DL) are respectively connected to corresponding pixels (PX) among the plurality of pixels (PX). Each of the light-emitting lines (EL) may be arranged parallel to a corresponding gate line among the gate lines (GL). The control signal line (SL-D) may provide control signals to the gate driving circuit (GDC). The initialization voltage line (SL-Vint) may provide an initialization voltage to the plurality of pixels (PX). The voltage line (SL-VDD) is connected to the plurality of pixels (PX) and may provide a first voltage to the plurality of pixels (PX). The voltage line (SL-VDD) may include a plurality of lines extending in a first direction (DR1) and a plurality of lines extending in a second direction (DR2). The power supply line (E-VSS) may be arranged to surround three sides of the display area (DA) in the non-display area (NDA). A common voltage (e.g., a second voltage) can be provided to a plurality of pixels (PX) of a power supply line (E-VSS). The common voltage can be a voltage of a lower level than the first voltage.

A gate driving circuit (GDC) connected to gate lines (GL) and emission lines (EL) may be arranged on one side of the non-display area (NDA). Some of the gate lines (GL), data lines (DL), emission lines (EL), control signal lines (SL-D), initialization voltage lines (SL-Vint), and voltage lines are arranged on the same layer, and some are arranged on different layers.

The first pad (PD) can be connected to the ends of data lines (DL), control signal lines (SL-D), initialization voltage lines (SL-Vint), and voltage lines (SL-VDD).

FIG. 5 illustrates an example of an ith pixel (PXi) connected to the kth data line (DLk) among a plurality of data lines (DL, see FIG. 4b).

The ith pixel (PXi) includes an organic light-emitting diode (OLED) and a pixel driver circuit that controls the organic light-emitting diode. The driver circuit may include seven thin film transistors (T1 to T7) and one storage capacitor (Cst).

The driving transistor controls the driving current supplied to the organic light-emitting diode (OLED). The output electrode of the second transistor (T2) is electrically connected to the organic light-emitting diode (OLED). The output electrode of the second transistor (T2) may be in direct contact with the anode of the organic light-emitting diode (OLED) or may be connected via another transistor (the sixth transistor (T6) in this embodiment).

The control electrode of the control transistor can receive a control signal. The control signal applied to the ith pixel (PXi) can include the (i-1)th gate signal (Si-1), the ith gate signal (Si), the (i+1)th gate signal (Si+1), the data signal (Dk), and the ith emission control signal (Ei). In an embodiment of the present invention, the control transistor can include a first transistor (T1) and third to seventh transistors (T3 to T7).

A first transistor (T1) includes an input electrode connected to the kth data line (DLk), a control electrode connected to the i-th gate line (GLi), and an output electrode connected to the output electrode of the second transistor (T2). The first transistor (T1) is turned on by a gate signal (Si, hereinafter referred to as the i-th gate signal) applied to the i-th gate line (GLi) and provides a data signal (Dk) applied to the k-th data line (DLk) to a storage capacitor (Cst). Fig. 6A is a partial cross-sectional view of an organic light-emitting display panel according to an embodiment of the present invention. Fig. 6B is a partial cross-sectional view of an organic light-emitting display panel according to an embodiment of the present invention. Specifically, Fig. 6A illustrates a cross-section of a portion corresponding to the first transistor (T1) of the equivalent circuit illustrated in Fig. 5. FIG. 6b illustrates a cross-section of a portion corresponding to the second transistor (T2), the sixth transistor (T6), and the organic light-emitting diode (OLED) of the equivalent circuit illustrated in FIG. 5.

Referring to FIGS. 6a and 6b, a circuit layer (DP-CL) is arranged on a base layer (SUB). Although not shown separately, functional layers may be further arranged on one surface of the base layer (SUB). The functional layers include at least one of a barrier layer and a buffer layer.

A semiconductor pattern (OSP1: hereinafter referred to as a first semiconductor pattern) of a first transistor (T1), a semiconductor pattern (OSP2: hereinafter referred to as a second semiconductor pattern) of a second transistor (T2), and a semiconductor pattern (OSP6: hereinafter referred to as a sixth semiconductor pattern) of a sixth transistor (T6) are arranged on a base layer (SUB). The first semiconductor pattern (OSP1), the second semiconductor pattern (OSP2), and the sixth semiconductor pattern (OSP6) may be selected from amorphous silicon, polysilicon, and metal oxide semiconductor.

A first insulating layer (10) may be arranged on the first semiconductor pattern (OSP1), the second semiconductor pattern (OSP2), and the sixth semiconductor pattern (OSP6). In FIGS. 6b and 6c, the first insulating layer (10) is exemplarily illustrated as being provided in the form of a layer covering the first semiconductor pattern (OSP1), the second semiconductor pattern (OSP2), and the sixth semiconductor pattern (OSP6), but the first insulating layer (10) may also be provided as a pattern arranged corresponding to the first semiconductor pattern (OSP1), the second semiconductor pattern (OSP2), and the sixth semiconductor pattern (OSP6).

The first insulating layer (10) may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer.

On the first insulating layer (10), a control electrode (GE1: hereinafter, the first control electrode) of the first transistor (T1), a control electrode (GE2: hereinafter, the second control electrode) of the second transistor (T2), and a control electrode (GE6: hereinafter, the sixth control electrode) of the sixth transistor (T6) are arranged. The first control electrode (GE1), the second control electrode (GE2), and the sixth control electrode (GE6) can be manufactured according to the same photolithography process as the gate lines (GL, see FIG. 5a).

A second insulating layer (20) covering the first control electrode (GE1), the second control electrode (GE2), and the sixth control electrode (GE6) may be arranged on the first insulating layer (10). The second insulating layer (20) may provide a flat upper surface. The second insulating layer (20) may include an organic material and/or an inorganic material.

On the second insulating layer (20), an input electrode (SE1: hereinafter, the first input electrode) and an output electrode (DE1: the first output electrode) of the first transistor (T1), an input electrode (SE2: hereinafter, the second input electrode) and an output electrode (DE2: the second output electrode) of the second transistor (T2), and an input electrode (SE6: hereinafter, the sixth input electrode) and an output electrode (DE6: the sixth output electrode) of the sixth transistor (T6) are arranged.

The first input electrode (SE1) and the first output electrode (DE1) are respectively connected to the first semiconductor pattern (OSP1) through the first through hole (CH1) and the second through hole (CH2) penetrating the first insulating layer (10) and the second insulating layer (20). The second input electrode (SE2) and the second output electrode (DE2) are respectively connected to the second semiconductor pattern (OSP2) through the third through hole (CH3) and the fourth through hole (CH4) penetrating the first insulating layer (10) and the second insulating layer (20). The sixth input electrode (SE6) and the sixth output electrode (DE6) are respectively connected to the sixth semiconductor pattern (OSP6) through the fifth through hole (CH5) and the sixth through hole (CH6) penetrating the first insulating layer (10) and the second insulating layer (20). Meanwhile, in another embodiment of the present invention, the first transistor (T1), the second transistor (T2), and the sixth transistor (T6) may be implemented by modifying them into a bottom-gate structure.

A third insulating layer (30) covering the first input electrode (SE1), the second input electrode (SE2), the sixth input electrode (SE6), the first output electrode (DE1), the second output electrode (DE2), and the sixth output electrode (DE6) is disposed on the second insulating layer (20). The third insulating layer (30) includes an organic layer and/or an inorganic layer. In particular, the third insulating layer (30) may include an organic material to provide a flat surface.

Any one of the first insulating layer (10), the second insulating layer (20), and the third insulating layer (30) may be omitted depending on the circuit structure of the pixel. Each of the second insulating layer (20) and the third insulating layer (30) may be defined as an interlayer. The interlayer insulating layer is positioned between a conductive pattern positioned below and a conductive pattern positioned above the interlayer insulating layer to insulate the conductive patterns.

A pixel defining layer (PDL) and an organic light emitting diode (OLED) are arranged on the third insulating layer (30). An anode (AE) is arranged on the third insulating layer (30). The anode (AE) is connected to the sixth output electrode (DE6) through a seventh through hole (CH7) that penetrates the third insulating layer (30). An opening (OP) is defined in the pixel defining layer (PDL). The opening (OP) of the pixel defining layer (PDL) exposes at least a portion of the anode (AE).

A pixel (PX, as shown in FIG. 4b) can be arranged in a pixel area on a plane. The pixel area can include an emitting area (PXA) and a non-emitting area (NPXA) adjacent to the emitting area (PXA). The non-emitting area (NPXA) can surround the emitting area (PXA). In the present embodiment, the emitting area (PXA) is defined to correspond to a portion of the anode (AE) exposed by the opening (OP).

The hole control layer (HCL) can be commonly arranged in the light-emitting area (PXA) and the non-light-emitting area (NPXA). Although not shown separately, a common layer such as the hole control layer (HCL) can be commonly formed in a plurality of pixels (PX, see FIG. 5a).

An organic light-emitting layer (EML) is disposed on a hole control layer (HCL). The organic light-emitting layer (EML) can be disposed in an area corresponding to an opening (OP). That is, the organic light-emitting layer (EML) can be formed separately for each of a plurality of pixels (PX). In this embodiment, a patterned organic light-emitting layer (EML) is illustrated as an example, but the organic light-emitting layer (EML) can be commonly disposed for a plurality of pixels (PX). In this case, the organic light-emitting layer (EML) can generate white light. In addition, the organic light-emitting layer (EML) can have a multilayer structure.

An electronic control layer (ECL) is disposed on an organic light-emitting layer (EML). Although not shown separately, the electronic control layer (ECL) may be formed commonly for a plurality of pixels (PX, see FIG. 4b).

A cathode (CE) is arranged on an electronic control layer (ECL). The cathode (CE) is arranged in common for a plurality of pixels (PX).

A thin film encapsulation layer (TFE) is disposed on a cathode (CE). The thin film encapsulation layer (TFE) is commonly disposed on a plurality of pixels (PX). The thin film encapsulation layer (TFE) includes at least one inorganic layer and at least one organic layer. The thin film encapsulation layer (TFE) may include a plurality of inorganic layers and a plurality of organic layers that are alternately stacked. In one embodiment of the present invention, the thin film encapsulation layer (TFE) may directly cover the cathode (CE).

FIGS. 7A to 7C are cross-sectional views of thin film encapsulation layers (TFE1, TFE2, TFE3) according to one embodiment of the present invention. Hereinafter, thin film encapsulation layers (TFE1, TFE2, TFE3) according to one embodiment of the present invention will be described with reference to FIGS. 7A to 7C.

As illustrated in FIG. 7a, the thin film encapsulation layer (TFE1) may include n inorganic thin films (IOL1 to IOLn), including a first inorganic thin film (IOL1) in contact with the cathode (CE, see FIG. 6a).

The first inorganic thin film (IOL1) is defined as a lower inorganic thin film, and inorganic thin films other than the first inorganic thin film (IOL1) among the n inorganic thin films (IOL1 to IOLn) can be defined as upper inorganic thin films.

The thin film encapsulation layer (TFE1) includes n-1 organic thin films (OL1 to OLn-1), and the n-1 organic thin films (OL1 to OLn-1) can be alternately arranged with n inorganic thin films (IOL1 to IOLn). The n-1 organic thin films (OL1 to OLn-1) can have an average thickness greater than the n inorganic thin films (IOL1 to IOLn).

Each of the n inorganic thin films (IOL1 to IOLn) may be a single layer containing one material, or may have multiple layers each containing different materials. Each of the n-1 organic thin films (OL1 to OLn-1) may be formed by depositing organic monomers. The organic monomers may include an acrylic monomer. In one embodiment of the present invention, the thin film encapsulation layer (TFE1) may further include an nth organic thin film.

As illustrated in FIGS. 7b and 7c, the inorganic thin films included in each of the thin film encapsulation layers (TFE2, TFE3) may have the same or different inorganic materials and may have the same or different thicknesses. The organic thin films included in each of the thin film encapsulation layers (TFE2, TFE3) may have the same or different organic materials and may have the same or different thicknesses.

As illustrated in FIG. 7b, the thin film encapsulation layer (TFE2) may include a first inorganic thin film (IOL1), a first organic thin film (OL1), a second inorganic thin film (IOL2), a second organic thin film (OL2), and a third inorganic thin film (IOL3) that are sequentially laminated.

The first inorganic thin film (IOL1) may have a two-layer structure. The first sub-layer (S1) and the second sub-layer (S2) may contain different inorganic materials.

As illustrated in FIG. 7c, the thin film encapsulation layer (TFE3) may include a first inorganic thin film (IOL10), a first organic thin film (OL1), and a second inorganic thin film (IOL20) that are sequentially laminated. The first inorganic thin film (IOL10) may have a two-layer structure. The first sub-layer (S10) and the second sub-layer (S20) may include different inorganic materials. The first organic thin film (OL1) is an organic layer including a polymer, and the second inorganic thin film (IOL20) may have a two-layer structure. The second inorganic thin film (IOL20) may include the first sub-layer (S100) and the second sub-layer (S200) deposited in different deposition environments. The first sub-layer (S100) may be deposited under a low power condition, and the second sub-layer (S200) may be deposited under a high power condition. The first sub-layer (S100) and the second sub-layer (S200) may contain the same inorganic material.

FIG. 8a is a cross-sectional view of a touch sensing unit (TS) according to one embodiment of the present invention. FIGS. 8b to 8e are plan views of a touch sensing unit (TS) according to one embodiment of the present invention.

As illustrated in FIG. 8a, the touch sensing unit (TS) includes a lower insulating layer (TS-LIL), a middle insulating layer (TS-MIL), a first conductive layer (TS-CL1), an upper insulating layer (TS-HIL), and a second conductive layer (TS-CL2). The lower insulating layer (TS-LIL) is directly disposed on the encapsulation layer (TFE). The first conductive layer (TS-CL1) is directly disposed on the lower insulating layer (TS-LIL). However, the present invention is not limited thereto, and another inorganic layer (e.g., a buffer layer) may be further disposed between the first conductive layer (TS-CL1) and the lower insulating layer (TS-LIL).

Each of the first conductive layer (TS-CL1) and the second conductive layer (TS-CL2) may have a single-layer structure or a multi-layer structure laminated along the third direction axis (DR3). The multi-layer conductive layer may include at least two of transparent conductive layers and metal layers. The multi-layer conductive layer may include metal layers including different metals. The transparent conductive layer may include ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), PEDOT, metal nanowires, and graphene. The metal layer may include molybdenum, silver, titanium, copper, aluminum, and alloys thereof.

Each of the first conductive layer (TS-CL1) and the second conductive layer (TS-CL2) includes a plurality of patterns. Hereinafter, the first conductive layer (TS-CL1) is described as including first conductive patterns, and the second conductive layer (TS-CL2) is described as including second conductive patterns. Each of the first conductive patterns and the second conductive patterns may include touch electrodes and touch signal lines.

Each of the lower insulating layer (TS-LIL), the middle insulating layer (TS-MIL), and the upper insulating layer (TS-HIL) may include an inorganic material or an organic material. The inorganic material may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic material may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin.

Each of the lower insulating layer (TS-LIL), the middle insulating layer (TS-MIL), and the upper insulating layer (TS-HIL) may have a single-layer or multi-layer structure. Each of the lower insulating layer (TS-LIL), the middle insulating layer (TS-MIL), and the upper insulating layer (TS-HIL) may have at least one of an inorganic layer and an organic layer. The inorganic layer and the organic layer may be formed by a chemical vapor deposition method.

The intermediate insulating layer (TS-MIL) is sufficient to insulate the first conductive layer (TS-CL1) and the second conductive layer (TS-CL2), and its shape is not limited. The shape of the intermediate insulating layer (TS-MIL) can be changed depending on the shapes of the first conductive patterns and the second conductive patterns. The intermediate insulating layer (TS-MIL) may cover the entire thin film encapsulation layer (TFE) or include a plurality of insulating patterns. It is sufficient for the plurality of insulating patterns to overlap the first connecting portions (CP1) or the second connecting portions (CP2) described below.

In this embodiment, a two-layer type touch sensing unit is illustrated as an example, but is not limited thereto. A single-layer type touch sensing unit includes a conductive layer and an insulating layer covering the conductive layer. The conductive layer includes touch sensors and touch signal lines connected to the touch sensors. The single-layer type touch sensing unit can obtain coordinate information in a self-cap method.

As illustrated in FIG. 8b, the touch sensing unit (TS) may include first touch electrodes (TE1-1 to TE1-5), first touch signal lines (TL1) connected to the first touch electrodes (TE1-1 to TE1-5), second touch electrodes (TE2-1 to TE2-4), and second touch signal lines (TL2) connected to the second touch electrodes (TE2-1 to TE2-4), and second pads (PD2) connected to the first touch signal lines (TL1) and the second touch signal lines (TL2). FIG. 8b illustrates, by way of example, a touch sensing unit (TS) including five first touch electrodes (TE1-1 to TE1-5) and four second touch electrodes (TE2-1 to TE2-4), but is not limited thereto.

Each of the first touch electrodes (TE1-1 to TE1-5) may have a mesh shape in which a plurality of touch openings are defined. Each of the first touch electrodes (TE1-1 to TE1-5) includes a plurality of first touch sensor portions (SP1) and a plurality of first connection portions (CP1). The first touch sensor portions (SP1) are arranged along the second direction (DR2). Each of the first connection portions (CP1) connects two adjacent first touch sensor portions (SP1) among the first touch sensor portions (SP1). Although not specifically illustrated, the first touch signal lines (TL1) may also have a mesh shape.

The second touch electrodes (TE2-1 to TE2-4) are insulated and intersect the first touch electrodes (TE1-1 to TE1-5). Each of the second touch electrodes (TE2-1 to TE2-4) may have a mesh shape in which a plurality of touch openings are defined. Each of the second touch electrodes (TE2-1 to TE2-4) includes a plurality of second touch sensor portions (SP2) and a plurality of second connecting portions (CP2). The second touch sensor portions (SP2) are arranged along the first direction (DR1). Each of the second connecting portions (CP2) connects two adjacent second touch sensor portions (SP2) among the second touch sensor portions (SP2). The second touch signal lines (TL2) may also have a mesh shape.

The first touch electrodes (TE1-1 to TE1-5) and the second touch electrodes (TE2-1 to TE2-4) are electrostatically coupled. When touch detection signals are applied to the first touch electrodes (TE1-1 to TE1-5), capacitors are formed between the first touch sensor portions (SP1) and the second touch sensor portions (SP2).

Some of the plurality of first touch sensor portions (SP1), the plurality of first connection portions (CP1), and the first touch signal lines (TL1), the plurality of second touch sensor portions (SP2), the plurality of second connection portions (CP2), and the second touch signal lines (TL2) may be formed by patterning the first conductive layer (TS-CL1) illustrated in FIG. 8A, and other some may be formed by patterning the second conductive layer (TS-CL2) illustrated in FIG. 8A.

In order to electrically connect the challenge patterns arranged on different layers, a contact hole penetrating the middle insulating layer (TS-MIL) illustrated in FIG. 8a can be formed. Hereinafter, a touch sensing unit (TS) according to one embodiment will be described with reference to FIGS. 8c to 8e.

As illustrated in FIG. 8c, first conductive patterns are arranged on the lower insulating layer (TS-LIL). The first conductive patterns may include bridge patterns (CP1). The bridge patterns (CP1) are arranged directly on the lower insulating layer (TS-LIL). The bridge patterns (CP1) correspond to the second connecting portions (CP2) illustrated in FIG. 8b.

As illustrated in FIG. 8d, an intermediate insulating layer (TS-MIL) covering bridge patterns (CP1) is disposed on a lower insulating layer (TS-LIL). Touch contact holes (TCH) that partially expose the bridge patterns (CP1) are defined in the intermediate insulating layer (TS-MIL). The touch contact holes (TCH) can be formed by a photolithography process.

As illustrated in FIG. 8e, second conductive patterns are arranged on a first touch insulating layer (TS-IL1). The second conductive patterns may include a plurality of first touch sensor portions (SP1), a plurality of first connection portions (CP1), and first touch signal lines (TL1), a plurality of second touch sensor portions (SP2), and second touch signal lines (TL2). Although not illustrated separately, an upper insulating layer (TS-HIL) covering the second conductive patterns is arranged on a middle insulating layer (TS-MIL).

In another embodiment of the present invention, the first conductive patterns may include first touch electrodes (TE1-1 to TE1-5) and first touch signal lines (TL1). The second conductive patterns may include second touch electrodes (TE2-1 to TE2-4) and second touch signal lines (TL2). In this case, contact holes (CH) are not defined in the first touch insulating layer (TS-IL1).

Additionally, in one embodiment of the present invention, the first challenge patterns and the second challenge patterns may be interchanged. That is, the second challenge patterns may include bridge patterns (CP1).

Figure 8f is a partial enlarged view of area AA of Figure 8e.

As illustrated in FIG. 8F, the first touch sensor portion (SP1) overlaps the non-luminous area (NPXA). The first touch sensor portion (SP1) includes a plurality of first extension portions (SP1-A) extending in a fifth direction (DR5) intersecting the first direction (DR1) and the second direction (DR2), and a plurality of second extension portions (SP1-B) extending in a sixth direction (DR6) intersecting the fifth direction (DR5). The plurality of first extension portions (SP1-A) and the plurality of second extension portions (SP1-B) may be defined as mesh lines. The line width of the mesh line may be several microns.

A plurality of first extension portions (SP1-A) and a plurality of second extension portions (SP1-B) are connected to each other to form a plurality of touch openings (TS-OP). In other words, the first touch sensor portion (SP1) has a mesh shape having a plurality of touch openings (TS-OP). Although the touch openings (TS-OP) are illustrated as corresponding to the light-emitting areas (PXA) one-to-one, the present invention is not limited thereto. One touch opening (TS-OP) may correspond to two or more light-emitting areas (PXA).

The sizes of the light-emitting areas (PXA) may vary. For example, the sizes of the light-emitting areas (PXA) that provide blue light and the light-emitting areas (PXA) that provide red light among the light-emitting areas (PXA) may be different. Accordingly, the sizes of the touch openings (TS-OP) may also vary. In Fig. 8f, the sizes of the light-emitting areas (PXA) are illustrated as being various, but are not limited thereto. The sizes of the light-emitting areas (PXA) may be the same, and the sizes of the touch openings (TS-OP) may also be the same.

The description of the first touch sensor unit (SP1) can be equally applied to the second touch sensor unit (SP2), so the description of the second touch sensor unit (SP2) is omitted.

The above touch sensing unit has been described, and the dam and bank will be described with reference to FIGS. 8B and 8E.

Referring to FIGS. 8B and 8E, a dam (DAM) is arranged on a non-display area (NDA, hereinafter referred to as a peripheral area) of a base layer (SUB, hereinafter referred to as a substrate). More specifically, the dam (DAM) may have a closed loop shape on a plane and may have a shape surrounding a display area. However, the shape of the dam (DAM) is not limited thereto and may be transformed into various shapes. In addition, there may be a plurality of dams (DAM). For example, a plurality of dams (DAM) that surround a display area on a plane and are spaced apart from each other may be arranged in the peripheral area (NDA).

The bank (BAK) is arranged in the peripheral area (NDA) of the substrate (SUB) adjacent to the dam (DAM). The bank (BAK) is arranged between the second pad (PD2) and the dam (DAM). In more detail, the bank (BAK) may have a bar shape on a plane, but is not limited thereto and may be modified in various ways.

The first touch signal lines (TL1) (TL1) and the second touch signal lines (TL2) (TL2) are extended to be arranged on the dam (DAM) and the bank (BAK) and connected to the second pad (PD2). The dam (DAM) and the bank (BAK) will be described in detail with reference to FIGS. 9 to 11.

FIG. 9 is a cross-sectional view taken along line A-A' of FIG. 8E. FIG. 10a is a cross-sectional view taken along line B-B' of FIG. 8E. FIG. 10b is a cross-sectional view of a bank (BAK) according to another embodiment of the present invention. FIG. 11 is a perspective view of a portion of the bank (BAK). Referring to FIGS. 9 to 11, the dam (DAM) may include an upper portion (DAMU) and a lower portion (DAMD). The upper portion (DAMU) is disposed on the lower portion (DAMD). In more detail, the upper portion (DAMU) may be disposed in contact with an upper surface of the lower portion (DAMD). The lower portion (DAMD) may be formed by the same process as the third insulating layer (30, see FIG. 6a). That is, the lower portion (DAMD) may be disposed on the same layer as the third insulating layer (30). The lower portion (DAMD) may be an organic layer and/or an inorganic layer. In particular, the lower portion (DAMD) may include an organic material to provide a flat surface.

The upper portion (DAMU) can be formed by the same process as the pixel defining layer (PDL). That is, the upper portion (DAMU) can be arranged on the same layer as the pixel defining layer (PDL). The upper portion (DAMU) can include an organic material. For example, the upper portion (DAMU) can include an organic material such as polyimide.

The dam (DAM) may have a protruding shape in cross-section by combining a lower portion (DAMD) and an upper portion (DAMU). The dam (DAM) may have a function of controlling the flow of an organic thin film material formed inside the encapsulation layer (TFE). For example, when the encapsulation layer (TFE) illustrated in FIG. 9 is the encapsulation layer (TFE3) illustrated in FIG. 7c, the dam (DAM) may control the flow of monomers of the first organic thin film (OL1), and the movement of the first organic thin film (OL1) in the first direction (DR1) may be controlled by the dam (DAM). Accordingly, the first inorganic thin film (IOL10) of the encapsulation layer (TFE) may be directly disposed on the dam (DAM), and the second inorganic thin film (IOL20) may be directly disposed on the first inorganic thin film (IOL).

A bank (BAK) can be arranged at a predetermined distance from the dam (DAM) in the first direction (DR1). The bank (BAK) includes a first bank portion (BANK1), a boundary portion (BOR), and a second bank portion (BANK2). The boundary portion (BOR) is arranged between the first bank portion (BANK1) and the second bank portion (BANK2).

The first bank portion (BANK1) may include an upper portion (BU) and a lower portion (BD). The upper portion (BU) is disposed on the lower portion (BD). More specifically, the upper portion (BU) may be disposed in contact with an upper surface of the lower portion (BD). The lower portion (BD) may be formed by the same process as the third insulating layer (30, see FIG. 6a). That is, the lower portion (BD) may be disposed on the same layer as the third insulating layer (30). The lower portion (BD) may be an organic layer and/or an inorganic layer. In particular, the lower portion (BD) may include an organic material to provide a flat surface.

The upper portion (BU) can be formed by the same process as the pixel defining film (PDL). The upper portion (BU) can be arranged on the same layer as the pixel defining film (PDL). The upper portion (BU) can include a portion corresponding to the pixel defining film (PDL) and a spacer (SPC). The spacer (SPC) can be formed simultaneously with the portion corresponding to the pixel defining film (PDL). In one example of the present invention, the spacer (SPC) can be arranged on the pixel defining film (PDL). That is, the first bank portion (BANK1) can be greater in height than the dam (DAM). The upper portion (BU) can include an organic material. For example, the upper portion (BU) can include an organic material such as polyimide.

The boundary portion (BOR) may also include an upper portion (BRU) and a lower portion (BRD) similar to the first bank portion (BANK1). The remaining description is omitted as it is the same as the first bank portion (BANK1).

The second bank portion (BANK2) can be formed by the same process as the third insulating layer (30). That is, the second bank portion (BANK2) can be arranged on the same layer as the third insulating layer (30). The second bank portion (BANK2) can be an organic layer and/or an inorganic layer.

The boundary portion (BOR) may be provided in multiple units. A second bank portion (BANK2) may be arranged between two adjacent boundary portions (BOR). The height of the second bank portion (BANK2) may be formed to be smaller than the heights of the first bank portion (BANK1) and the boundary portion (BOR).

In conclusion, the lower part (BD) of the first bank portion (BANK1), the lower part (BRD) of the boundary portion (BOR), and the second bank portion (BANK2) can be formed integrally.

As the second bank portion (BANK2) and the boundary portion (BOR) are formed, the bank (BAK) can prevent patterning defects of touch signal lines occurring on the upper surface of the bank (BAK) due to scratches caused by the mask during the process of supporting the mask used to form the encapsulation layer (TFE).

FIGS. 12A to 12G are drawings illustrating a process of forming a first capping pattern (CAP1) on a bank (BAK).

As illustrated in Fig. 12a, a lower insulating layer (TS-LIL) can be formed on the bank (BAK). The lower insulating layer (TS-LIL) can be formed on the bank (BAK) through a deposition process.

As illustrated in Fig. 12b, a middle insulating layer (TS-MIL) can be formed on the lower insulating layer (TS-LIL) through a deposition process.

As illustrated in FIG. 12c, a conductive layer (CODL) to be formed of a first capping pattern (CAP1) and touch signal lines (TL1, TL2) to be described later may be formed on the intermediate insulating layer (TS-MIL). The conductive layer (CODL) may be formed on the intermediate insulating layer (TS-MIL) through a deposition process. The conductive layer (CODL) may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and graphene. The conductive layer (CODL) may include a metal layer, for example, molybdenum, silver, titanium, copper, aluminum, or an alloy thereof.

Referring to FIG. 12d, a photoresist layer (PRE) may be formed on a conductive layer (CODL), and the remaining portion except for a portion where the first capping pattern (CAP1) and touch signal lines (TL1, TL2) are to be formed may be exposed.

Referring to FIG. 12e, an etching process can be performed on a conductive layer (CODL) corresponding to an exposed portion (ELA). For example, the conductive layer (CODL) corresponding to the exposed portion (ELA) can be etched through a dry etching process.

Referring to FIG. 12f, after the etching process is performed, the photoresist layer (PRE) can be removed through a strip process. When the photoresist layer (PRE) is removed, a first capping pattern (CAP1) can be formed between the middle insulating layer (TS-MIL) and the upper insulating layer (TS-HIL) corresponding to the boundary portion (BOR), and first touch signal lines (TL1) and second touch signal lines (TL2) can be formed between the middle insulating layer (TS-MIL) and the upper insulating layer (TS-HIL) corresponding to the second bank portion (BANK2).

Referring to FIGS. 10A, 11, and 12F, a first capping pattern (CAP1) and touch signal lines (TL1, TL2) may be formed between the middle insulating layer (TS-MIL) and the upper insulating layer (TS-HIL) so as to be covered. The upper insulating layer (TS-HIL) may be formed on the middle insulating layer (TS-MIL) through a deposition process.

By forming a first capping pattern (CAP1) corresponding to the boundary (BOR), the leakage of organic materials inside the bank (BAK) during the etching process due to insufficient thickness of the photoresist layer (PRE) formed on the boundary (BOR) is prevented, thereby preventing phenomena such as film lifting from occurring.

In addition, as illustrated in FIG. 10b, the first capping pattern (CAP1') may be formed between the middle insulating layer (TS-MIL) and the upper insulating layer (TS-HIL) corresponding to the first bank portion (BANK1) and the boundary portion (BOR), and the first capping pattern (CAP1) is not limited thereto and may be formed in various shapes. For example, in one embodiment of the present invention, the touch signal lines (TL1, TL2) and the first capping pattern (CAP1) are formed on the middle insulating layer (TS-MIL), but as described above, the touch signal lines (TL1, TL2) may also be formed on the lower insulating layer (TS-LIL), and in this case, the first capping pattern (CAP1) may be formed between the lower insulating layer (TS-LIL) and the middle insulating layer (TS-MIL).

Figures 13a to 13c are plan views for explaining another embodiment of the present invention. Figure 14 is a cross-sectional view for explaining another embodiment of the present invention.

As illustrated in FIG. 13a, dummy lines (DUL) may be arranged on the lower insulating layer (TS-LIL). The dummy lines (DUL) may overlap the touch signal lines (TL1, TL2) illustrated in FIG. 8e. Each of the dummy lines (DUL) may be connected in parallel with each of the aforementioned touch signal lines (TL1, TL2) to reduce the resistance of the line through which the signal is transmitted, thereby increasing the sensing sensitivity of the touch.

The method by which dummy lines (DUL) are formed is the same as the method by which the aforementioned touch signal lines (TL1, TL2) are formed, so description thereof will be omitted.

As illustrated in FIG. 13b, dummy contact holes (DCH) that partially expose the aforementioned touch signal lines (TL1, TL2) may be defined in the middle insulating layer (TS-MIL). The dummy contact holes (DCH) may be formed by a photolithography process. Each of the dummy lines (DUL) of FIG. 13a may be connected in parallel to each of the touch signal lines (TL1, TL2) by the dummy contact holes (DCH).

As illustrated in FIG. 13c, the dummy lines (DUL) overlap with the touch signal lines (TL1, TL2), and thus may not be depicted on a plane after the first touch signal lines (TL1) and the second touch signal lines (TL2) are formed. Each of the dummy lines (DUL) may be connected to a second pad (PD2') to which the corresponding touch signal lines (TL1, TL2) are connected.

Referring to FIG. 14, a second capping pattern (CAP2) may be arranged between the lower insulating layer (TS-LIL) and the middle insulating layer (TS-MIL) corresponding to the boundary portion (BOR), and dummy lines (DUL) may be arranged between the lower insulating layer (TS-LIL) and the middle insulating layer (TS-MIL) corresponding to the second bank portion (BANK2). The second capping pattern (CAP2) and the dummy lines (DUL) may be formed by the same process, and since the formation process is the same as the formation process of the first capping pattern (CAP1) and the touch signal lines (TL1, TL2), a description thereof will be omitted.

By forming the second capping pattern (CAP2), the aforementioned defective phenomena such as film lifting can be prevented.

Although the dummy lines (DUL) are described in this specification as being arranged on the lower insulating layer (TS-LIL) and the middle insulating layer (TS-MIL), this may be variously modified. For example, the touch signal lines (TL1, TL2) may be arranged on the lower insulating layer (TS-LIL) and the middle insulating layer (TS-MIL), and the dummy lines (DUL) may be arranged between the middle insulating layer (TS-MIL) and the upper insulating layer (TS-HIL).

Although the present invention has been described above with reference to preferred embodiments thereof, it will be understood by those skilled in the art or having ordinary knowledge in the art that various modifications and changes may be made to the present invention without departing from the spirit and technical scope of the present invention as set forth in the claims below.

Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the scope of the patent claims.

TS-LIL: Lower insulation layer BAK: Bank
TS-MIL: Middle insulation layer BANK2: Second bank section
TS-HIL: Top insulation layer CAP1: First capping pattern

Claims (22)

A base layer including a display area and a non-display area;
A device layer including a plurality of light-emitting devices arranged in the display area of the base layer;
An encapsulation layer disposed on the above-described element layer and including at least one inorganic layer and at least one organic layer;
An input sensing layer disposed on the above-described sealing layer and including an electrode and a signal line electrically connected to the electrode;
A pad electrically connected to the signal line and arranged in the non-display area;
A dam disposed in the non-display area, and having a portion disposed between the pad and the display area when viewed on a plane; and
A bank disposed in the non-display area, a portion of which, when viewed on a plane, is disposed between the portion of the dam and the pad, and which does not overlap with the at least one organic layer,
A display device, wherein the bank includes a first portion and a second portion, and a distance between an upper surface of the first portion of the bank and the base layer has a first distance, and a distance between an upper surface of the second portion of the bank and the base layer has a second distance, and the first distance is different from the second distance. In the first paragraph,
A display device wherein at least a portion of said signal line is disposed above said second portion of said bank. In the first paragraph,
A display device wherein the bank further includes an inclined third portion disposed between the first portion and the second portion, and wherein the first distance is greater than the second distance. In the third paragraph,
further comprising a capping layer disposed on the above bank and containing the same material as the signal line;
A display device wherein at least a portion of the capping layer is disposed over the third portion of the bank. In the fourth paragraph,
The first part, the third part, and the second part are arranged along the first direction,
The above pads are provided in plurality, and the plurality of pads are arranged along the first direction,
The above signal line is a display device spaced apart from the capping layer in the first direction. In clause 5,
A display device including a first non-folding region, a folding region, and a second non-folding region arranged in a second direction intersecting the first direction. In the first paragraph,
The above bank is a display device having a step shape. In the first paragraph,
The above encapsulating layer includes a first inorganic thin film, an organic thin film disposed on the first inorganic thin film, and a second inorganic thin film disposed on the organic thin film.
The above first inorganic film and the above second inorganic film cover the dam,
The above bank is a display device that does not overlap with the first inorganic thin film and the second inorganic thin film. In the first paragraph,
The above signal line is a display device overlapping the above dam. A base layer including a display area and a non-display area;
A device layer including a plurality of light-emitting devices arranged in the display area of the base layer;
An encapsulation layer disposed on the above-described element layer and including at least one inorganic layer and at least one organic layer;
An input sensing layer disposed on the above-described sealing layer and including an electrode and a signal line electrically connected to the electrode;
A pad electrically connected to the signal line and arranged in the non-display area;
A dam disposed in the non-display area, and having a portion disposed between the pad and the display area when viewed on a plane;
A bank disposed in the non-display area, a portion of which, when viewed on a plane, is disposed between the portion of the dam and the pad, and which does not overlap with the at least one organic layer; and
A capping layer is disposed on the above bank and includes the same material as the signal line,
The bank comprises a first portion having a first thickness, a second portion having a second thickness different from the first thickness, and a third portion disposed between the first portion and the second portion.
A display device wherein at least a portion of the capping layer is disposed over the third portion of the bank. In Article 10,
A display device wherein the second thickness is smaller than the first thickness, and at least a portion of the signal line is disposed over the second portion of the bank. In Article 10,
The above bank is a display device having a step shape. A base layer including an active area and a non-display area;
A device layer including a plurality of light-emitting devices arranged in the active area of the base layer;
An encapsulation layer disposed on the above-described element layer and including at least one inorganic layer and at least one organic layer;
An input sensing layer disposed on the above-described sealing layer and including an electrode and a signal line electrically connected to the electrode;
A pad electrically connected to the signal line and arranged in the non-display area;
A dam disposed in the non-display area, and having a portion disposed between the pad and the active area when viewed on a plane; and
A bank disposed in the non-display area, a portion of which, when viewed on a plane, is disposed between the portion of the dam and the pad, and which does not overlap with the at least one organic layer,
The above active region includes a first non-folding region, a folding region, and a second non-folding region arranged in a first direction,
The above bank extends in a second direction different from the first direction,
The above bank comprises a first part and a second part,
A foldable portable electronic device wherein a distance between an upper surface of the first portion of the bank and the base layer has a first distance, a distance between an upper surface of the second portion of the bank and the base layer has a second distance, and the first distance is different from the second distance. In Article 13,
A foldable portable electronic device, wherein at least a portion of said signal line is disposed over said second portion of said bank. In Article 13,
The above bank is a foldable portable electronic device having a step shape. In Article 13,
A foldable portable electronic device wherein the bank further includes an inclined third portion disposed between the first portion and the second portion, and wherein the first distance is greater than the second distance. In Article 16,
further comprising a capping layer disposed on the above bank and containing the same material as the signal line;
A foldable portable electronic device, wherein at least a portion of the capping layer is disposed over the third portion of the bank. A base layer including an active area and a non-display area;
A device layer including a plurality of light-emitting devices arranged in the active area of the base layer;
An encapsulation layer disposed on the above-described element layer and including at least one inorganic layer and at least one organic layer;
An input sensing layer disposed on the above-described sealing layer and including an electrode and a signal line electrically connected to the electrode;
A pad electrically connected to the signal line and arranged in the non-display area;
A dam disposed in the non-display area, and having a portion disposed between the pad and the active area when viewed on a plane; and
A bank disposed in the non-display area, a portion of which, when viewed on a plane, is disposed between the portion of the dam and the pad, and which does not overlap with the at least one organic layer,
The above active region includes a non-folding region and a flexible region adjacent in the first direction,
The above bank extends in a second direction different from the first direction,
A flexible device wherein the bank comprises a first portion and a second portion, a distance between an upper surface of the first portion of the bank and the base layer has a first distance, a distance between an upper surface of the second portion of the bank and the base layer has a second distance, and the first distance is different from the second distance. In Article 18,
A flexible device wherein at least a portion of said signal line is disposed over said second portion of said bank. In Article 18,
A flexible device wherein the bank further includes an inclined third portion disposed between the first portion and the second portion, wherein the first distance is greater than the second distance. In Article 20,
further comprising a capping layer disposed on the above bank and containing the same material as the signal line;
A flexible device wherein at least a portion of the capping layer is disposed over the third portion of the bank. In Article 18,
The above bank is a flexible device having a step shape.

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