JPH0781975B2 - Moisture sensitive element - Google Patents
Moisture sensitive elementInfo
- Publication number
- JPH0781975B2 JPH0781975B2 JP1304805A JP30480589A JPH0781975B2 JP H0781975 B2 JPH0781975 B2 JP H0781975B2 JP 1304805 A JP1304805 A JP 1304805A JP 30480589 A JP30480589 A JP 30480589A JP H0781975 B2 JPH0781975 B2 JP H0781975B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- lower electrode
- electrode
- moisture
- sensitive element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 13
- 239000010408 film Substances 0.000 description 63
- 239000010931 gold Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000002952 polymeric resin Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229920000620 organic polymer Polymers 0.000 description 5
- 239000010409 thin film Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229910052723 transition metal Inorganic materials 0.000 description 3
- 150000003624 transition metals Chemical class 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は有機高分子樹脂を感湿材料として用いてなる感
湿素子に係わり、特にその下側端子の構造に関するもの
である。TECHNICAL FIELD The present invention relates to a moisture-sensitive element using an organic polymer resin as a moisture-sensitive material, and more particularly to the structure of its lower terminal.
従来、この種の感湿素子は、絶縁性基板の表面に薄膜状
下側電極，有機高分子樹脂材料からなる感湿膜および透
湿性の薄膜状上側電極を順次積層形成して構成されてお
り、この感湿膜の相対湿度に対する対向電極間の容量値
もしくはインピーダンスの変化を湿度の検出として取り
出していた。Conventionally, this type of moisture-sensitive element is formed by sequentially laminating a thin film lower electrode, a moisture sensitive film made of an organic polymer resin material, and a moisture permeable thin film upper electrode on the surface of an insulating substrate. The change in the capacitance value or impedance between the counter electrodes with respect to the relative humidity of this moisture sensitive film is taken out as the humidity detection.
しかしながら、絶縁性基板上に成膜される薄膜状下側電
極は、電極構造においては、アルミニウム薄膜を用いる
と、腐食しやすく、長期安定性や信頼性に欠けることか
ら、厚膜ペーストを塗布し焼成した厚膜金電極が用いら
れていたが、この厚膜金電極では膜厚が約10μｍ前後で
あり、また、この厚膜金電極上に成膜される高分子樹脂
材料の感湿膜の膜厚が0.5〜10μｍ程度であるので、ピ
ンホールのために不良となつたり、さらに上側電極と下
側電極との間の短絡の原因となつたり、また、厚膜金電
極の表面は凹凸が大きいため、耐電圧特性を低下させた
りするなどの問題があつた。さらに電極の形成方法にお
いては、厚膜金電極を用いる場合、印刷，乾燥，焼成な
どの工程を必要とし、工程が複雑となる問題があつた。However, for the thin film lower electrode formed on the insulating substrate, when an aluminum thin film is used in the electrode structure, it is easily corroded and lacks long-term stability and reliability. A thick film gold electrode that was fired was used, but this thick film gold electrode has a film thickness of about 10 μm, and a film of a polymeric resin material formed on this thick film gold electrode Since the film thickness is about 0.5 to 10 μm, it may be defective due to pinholes, may cause a short circuit between the upper electrode and the lower electrode, and the surface of the thick film gold electrode may be uneven. Since it is large, there are problems such as deterioration in withstand voltage characteristics. Further, in the method of forming electrodes, when a thick film gold electrode is used, steps such as printing, drying and baking are required, which causes a problem that the steps are complicated.
このような課題を解決するために本発明による感湿素子
は、絶縁性基板上に形成される下側電極を厚さ50〜1000
ÅのNb膜と厚さ1000〜100000ÅのPt膜との２層構造の積
層膜により構成するものである。In order to solve such a problem, the moisture-sensitive element according to the present invention has a lower electrode formed on an insulating substrate with a thickness of 50 to 1000.
It is composed of a laminated film having a two-layer structure of a Å Nb film and a Pt film having a thickness of 1000 to 100000 Å.
本発明による他の感湿素子は、絶縁性基板上に形成され
る下側電極をNb膜とPt膜との間に導電性金属膜を介在さ
せた３層構造の積層膜により構成するものである。In another moisture-sensitive element according to the present invention, the lower electrode formed on the insulating substrate is composed of a laminated film having a three-layer structure in which a conductive metal film is interposed between an Nb film and a Pt film. is there.
本発明においては、Nb膜が絶縁性基板の表面に高い付着
力で密着形成され、このNb膜上にPt膜が密着して成膜さ
れる。また、Nb膜上に導電性の良好な導電性金属膜が高
い付着力で密着形成され、電極材となるとともにこの導
電性金属膜上に形成されるPt膜の厚さを薄くしても同程
度の導電率が得られる構成となつている。In the present invention, the Nb film is formed in close contact with the surface of the insulating substrate with high adhesion, and the Pt film is formed in close contact with the Nb film. In addition, a conductive metal film having good conductivity is closely formed on the Nb film with a high adhesive force to serve as an electrode material, and even if the Pt film formed on this conductive metal film is thinned, the same result is obtained. It is configured to obtain a conductivity of a certain degree.
以下、図面を用いて本発明の実施例を詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第１図（ａ）は本発明による感湿素子の一実施例を示す
要部平面図であり、同図（ｂ）は同図（ａ）のＢ−Ｂ′
線の断面図である。同図において、例えばガラス，アル
ミナ，シリコン，窒化アルミもしくは窒化珪素などから
なる絶縁性基板１の表面には遷移金属として例えばNbを
蒸着もしくはスパツタリング法により50〜1000Åの厚さ
に被着させてNb膜21が成膜され、引き続き貴金属として
例えばPtを蒸着もしくはスパツタリング法により1000〜
10000Åの厚さに被着させてPt膜22が成膜されて２層構
造からなる下側電極２が形成されている。この場合、こ
の下側電極２は、第２図に示すように絶縁性基板１上に
例えば表裏面で開口径の異なる開口部11aを有する厚さ
約0.1mmのSUS製のメタルマスク11を位置合せして上述し
た金属を蒸着もしくはスパツタリングすることにより、
Nb膜21およびPt膜22はエツジに丸味をおびて成膜され、
これによつてNb膜21がPt膜22で全面を完全に覆われた積
層構造で形成される。なお、2aは下側電極２と同一材
料，同一手段により一体的に成膜された電極端子であ
る。また、この下側電極２上には有機高分子樹脂材料を
スピンコートもしくはデイツピング法により塗布した
後、この有機高分子樹脂材料のガラス転移点以上の熱処
理を行なつて厚さ約10000〜50000Å程度の感湿膜３が形
成されている。なお、感湿膜３を構成する有機高分子樹
脂材料としては、メチルメタクリレートの重合体，メチ
ルメタクリレートとビニル基を２個以上有する化合物と
の共重合体，エチルメタクリレートの重合物，エチルメ
タクリレートとビニル基を２個以上有する化合物との共
重合体，メタクリル酸の重合物などが用いられる。ま
た、この感湿膜３上には例えばAuを加熱蒸着法により10
0〜500Åの厚さに被着させて透湿性の上側電極４が形成
されている。なお、4aは上側電極４と同一材料，同一手
段により一体的に成膜された電極端子である。最後に図
示されないが、電極端子2a,4a上に外部引き出し用のリ
ード線を導電性樹脂により接着して電気的接続を行なつ
て完成する。FIG. 1 (a) is a plan view of an essential part showing an embodiment of a moisture sensitive element according to the present invention, and FIG. 1 (b) is a sectional view taken along the line BB 'in FIG. 1 (a).
It is sectional drawing of a line. In the figure, for example, Nb is deposited as a transition metal on the surface of an insulating substrate 1 made of, for example, glass, alumina, silicon, aluminum nitride, or silicon nitride to a thickness of 50 to 1000 Å by vapor deposition or sputtering. film 2 1 is deposited, subsequently 1000 by an evaporation or Supatsutaringu method, for example, Pt as the precious metal
Was deposited to a thickness of 10000Å lower electrode 2 Pt film 2 2 is made of two-layer structure is deposited is formed. In this case, as shown in FIG. 2, the lower electrode 2 is provided with a metal mask 11 made of SUS having a thickness of about 0.1 mm, which has openings 11a having different opening diameters on the front and back surfaces, as shown in FIG. In addition, by vapor deposition or sputtering of the above metal,
The Nb film 2 1 and the Pt film 2 2 are formed with round edges on the edges.
This Yotsute Nb film 2 1 is formed completely covered with laminated structure entirely in Pt film 2 2. 2a is an electrode terminal integrally formed by the same material and the same means as the lower electrode 2. Further, an organic polymer resin material is applied on the lower electrode 2 by spin coating or dipping, and then heat treatment is performed at a temperature not lower than the glass transition point of the organic polymer resin material to obtain a thickness of about 10,000 to 50,000Å. The moisture sensitive film 3 is formed. The organic polymer resin material constituting the moisture sensitive film 3 is a polymer of methyl methacrylate, a copolymer of methyl methacrylate and a compound having two or more vinyl groups, a polymer of ethyl methacrylate, ethyl methacrylate and vinyl. A copolymer with a compound having two or more groups and a polymer of methacrylic acid are used. Further, Au is deposited on the moisture-sensitive film 3 by a heating vapor deposition method, for example.
A moisture-permeable upper electrode 4 is formed by being attached to a thickness of 0 to 500Å. Incidentally, 4a is an electrode terminal integrally formed by the same material and the same means as the upper electrode 4. Finally, although not shown, lead wires for external extraction are adhered to the electrode terminals 2a and 4a by a conductive resin to complete electrical connection.
このような構成によれば、下側電極２は、Nb膜21とPt膜
22との２層構造により構成したことにより、絶縁性基板
１との付着力が強化され、かつ耐食性の極めて良好な下
側電極２が得られた。つまり、下側電極２をPt膜22のみ
で構成した場合には絶縁性基板１との付着力が弱く、電
極として形成すると、剥離する問題があつたが、絶縁性
基板１上にNb膜21が高い付着力で接着されるとともこの
Nb膜２を完全に覆つてPt膜22が高い付着力で接着される
ので、安定した付着力の強いPt膜22を主体とした下側電
極２を得ることができた。また、この下側電極２にPt膜
22を用いたことにより、この下側電極２と水との間の化
学反応を抑えることができる。さらに下側電極２をメタ
ルマスク11により、電極構造を形成するため、工程が簡
単で安価にかつ安定な下側電極２を形成することができ
る。また、メタルマスク11により、Nb膜21はPt膜22に完
全に覆われた形状とすることができるので、Nb膜21の腐
食を確実に抑えることができる。さらにメタルマスクを
用いた電極形成法では下側電極２の端部の膜厚が徐々に
薄く形成できるので、電界の集中が少なくなり、耐電圧
特性を向上させることができる。According to this structure, the lower electrode 2, Nb film 2 1 and the Pt film
By having a two-layer structure of 2 2 and 2 , the lower electrode 2 having enhanced adhesion to the insulating substrate 1 and excellent corrosion resistance was obtained. That is, the case where the lower electrode 2 Pt film 2 2 only weak adhesion between the insulating substrate 1, to form an electrode, but the problem has been made to peel, Nb film on the insulating substrate 1 If 2 1 is bonded with high adhesion,
Since connexion Pt film 2 2 covering the Nb film 2 completely is bonded with high adhesion, it was possible to obtain a lower electrode 2 composed mainly of strong Pt film 2 2 stable and adhesion. Moreover, a Pt film is formed on the lower electrode 2.
By using two 2, it is possible to suppress the chemical reaction between the lower electrode 2 and water. Furthermore, since the electrode structure is formed on the lower electrode 2 by the metal mask 11, the process can be performed easily, inexpensively and stably, and the lower electrode 2 can be formed. In addition, the metal mask 11, Nb layer 2 1 can be the entirely covered shape Pt film 2 2, it is possible to reliably inhibit the corrosion of Nb films 2 1. Further, in the electrode forming method using the metal mask, the film thickness of the end portion of the lower electrode 2 can be gradually reduced, so that the concentration of the electric field can be reduced and the withstand voltage characteristic can be improved.
第３図は本発明による感湿素子の他の実施例を示す下側
電極の拡大断面図である。同図において、下側電極２′
は絶縁性基板１上に遷移金属からなる第１の金属膜21と
導電性金属からなる第２の金属膜22と貴金属からなる第
３の金属膜23とが順次被着形成され、３層構造の積層に
より構成されている。この場合、各金属膜は、Nb/Ni/Pt
3層構造で構成され、上記Niの代りにCu,Agなどを用いて
も良い。FIG. 3 is an enlarged cross-sectional view of the lower electrode showing another embodiment of the moisture sensitive element according to the present invention. In the figure, the lower electrode 2 '
Is a three-layer structure in which a first metal film 21 made of a transition metal, a second metal film 22 made of a conductive metal, and a third metal film 23 made of a noble metal are sequentially deposited on the insulating substrate 1. It is configured by stacking. In this case, each metal film is Nb / Ni / Pt.
It may have a three-layer structure, and Cu, Ag, or the like may be used instead of Ni.
このような構成によれば、遷移金属膜21と貴金属膜23と
の間に中間膜としての導電性金属膜22を介在させたこと
により、電極部の抵抗を同じにしたまま高価な貴金属で
あるPd,Au,Ptの厚さを500〜1000Å程度に薄くすること
ができ、コスト上有利であるとともに下側電極２′の電
極端子に外部引き出し用リード線を半田付けする際に第
３の金属膜33がAu膜の場合、Auが半田に食われるので、
第２の金属膜22を中間に設けることにより、はんだと第
２の金属膜22と電気的に接続させることができるので、
確実な電気的接続手段が確保できる。According to such a configuration, the conductive metal film 22 as an intermediate film is interposed between the transition metal film 21 and the noble metal film 23, which is an expensive noble metal while keeping the resistance of the electrode portion the same. The thickness of Pd, Au, and Pt can be thinned to about 500 to 1000Å, which is advantageous in terms of cost and when the external lead wire is soldered to the electrode terminal of the lower electrode 2 ', the third metal is used. When the film 33 is an Au film, Au is eaten by the solder,
By providing the second metal film 22 in the middle, the solder and the second metal film 22 can be electrically connected,
A reliable electrical connection means can be secured.
なお、前述した実施例においては、対向配置される上側
電極と下側電極との間に感湿膜を挾持させた感湿素子の
平面状下側電極を適用した場合について説明したが、く
し形電極など他の形状の電極構造に適用できることは言
うまでもない。In addition, in the above-described embodiment, the case where the planar lower electrode of the humidity sensitive element in which the moisture sensitive film is sandwiched between the upper electrode and the lower electrode which are opposed to each other is applied is described. It goes without saying that the present invention can be applied to electrode structures of other shapes such as electrodes.
以上説明したように本発明によれば、絶縁性基板との付
着力が強固でかつ安定でしかも耐食性の良好な下側電極
が得られるので、品質および信頼性の高い感湿素子が得
られるという極めて優れた効果を有する。As described above, according to the present invention, it is possible to obtain a moisture-sensitive element having high quality and reliability because a lower electrode having a strong adhesive force with an insulating substrate and being stable and having good corrosion resistance can be obtained. It has an extremely excellent effect.
第１図は本発明の一実施例による感湿素子を示す図、第
２図は第１図の下側電極の形成方法を説明する断面図、
第３図は本発明の他の実施例による感湿素子の下側電極
の構成を示す拡大断面図である。 １……絶縁性基板、2,2′……下側電極、21……Nb膜、2
2……Pt膜、2a……電極端子、21……第１の金属膜、22
……第２の金属膜、23……第３の金属膜、３……感湿
膜、４……上側電極、4a……電極端子、11……メタルマ
スク、11a……開口部。FIG. 1 is a diagram showing a moisture sensitive element according to an embodiment of the present invention, FIG. 2 is a sectional view for explaining a method of forming a lower electrode of FIG. 1,
FIG. 3 is an enlarged cross-sectional view showing the structure of the lower electrode of the moisture sensitive element according to another embodiment of the present invention. 1 ... insulating substrate, 2,2 '... lower electrode, 2 1 ... Nb film, 2
2 …… Pt film, 2a …… Electrode terminal, 21 …… First metal film, 22
... second metal film, 23 ... third metal film, 3 ... moisture-sensitive film, 4 ... upper electrode, 4a ... electrode terminal, 11 ... metal mask, 11a ... opening.
Claims (2)
極を順次積層形成してなる感湿素子において、 前記下側電極は厚さ50〜1000ÅのNb膜と、厚さ1000〜10
0000ÅのPt膜との２層構造の積層膜で構成したことを特
徴とする感湿素子。1. A moisture-sensitive element comprising a lower electrode, a moisture-sensitive film, and an upper electrode, which are sequentially laminated on an insulating substrate, wherein the lower electrode is a Nb film having a thickness of 50 to 1000Å and a thickness of 1000. ~Ten
A moisture-sensitive element characterized by comprising a laminated film having a two-layer structure with a 0000Å Pt film.
側電極は前記Nb膜と前記Pt膜との間に導電性金属膜を介
在させた３層構造の積層膜で構成したことを特徴とする
感湿素子。2. The moisture-sensitive element according to claim 1, wherein the lower electrode is composed of a laminated film having a three-layer structure in which a conductive metal film is interposed between the Nb film and the Pt film. Characteristic humidity sensitive element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1304805A JPH0781975B2 (en) | 1989-11-27 | 1989-11-27 | Moisture sensitive element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1304805A JPH0781975B2 (en) | 1989-11-27 | 1989-11-27 | Moisture sensitive element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03167463A JPH03167463A (en) | 1991-07-19 |
| JPH0781975B2 true JPH0781975B2 (en) | 1995-09-06 |
Family
ID=17937458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1304805A Expired - Lifetime JPH0781975B2 (en) | 1989-11-27 | 1989-11-27 | Moisture sensitive element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0781975B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5402075A (en) * | 1992-09-29 | 1995-03-28 | Prospects Corporation | Capacitive moisture sensor |
| JP2007278867A (en) * | 2006-04-07 | 2007-10-25 | Ghitron Technology Co Ltd | Electrode structure of humidity sensing part |
| JP2010164344A (en) * | 2009-01-13 | 2010-07-29 | Nitto Denko Corp | Substance detecting sensor |
| JP5849836B2 (en) * | 2012-04-10 | 2016-02-03 | 株式会社デンソー | Humidity sensor |
| JP6611362B2 (en) * | 2014-12-11 | 2019-11-27 | 北陸電気工業株式会社 | Capacitive humidity sensor |
| JP6883777B2 (en) * | 2016-07-26 | 2021-06-09 | ラピスセミコンダクタ株式会社 | Semiconductor devices and methods for manufacturing semiconductor devices |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6420439A (en) * | 1987-07-15 | 1989-01-24 | Yamatake Honeywell Co Ltd | Humidity sensible element |
-
1989
- 1989-11-27 JP JP1304805A patent/JPH0781975B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03167463A (en) | 1991-07-19 |
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