JP2885995B2 - Heat pipe cooling system for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pipe type cooling device for a semiconductor, in which a heat pipe having heat radiation fins is inserted and a semiconductor element is interposed between base plates.

[0002]

2. Description of the Related Art FIG. 7 is a partially cutaway plan view showing a conventional heat pipe type cooling device for a semiconductor, and FIG. 8 is a front view thereof. 1 is a cooler body having a structure in which a number of heat pipes 1c having a number of heat radiation fins 1b are inserted into a base plate 1a, 2 is a semiconductor element held between the base plates 1a, 3 is a base plate 1 holding a semiconductor element 2
a, presser plates 4 disposed on both sides of the base plate 1, through bolts penetrating the base plate 1 a, tightening nuts screwed to both ends of the through bolts 4, 6 a cover,
The cover 6 includes upper and lower plates 6a, 6b mounted on the holding plate 3.
And a partition plate 6c that shields both side surfaces of the cooler main body 1. Reference numeral 7 denotes a support plate provided at the lower end of the holding plate 3 so as to protrude laterally, 8 denotes a power receiving bar connected to the base bolt 1a, 9 denotes a power receiving bar 8
This is an external power supply boost bar that is connected and fixed by the nut 0a and the nut 10b.

Next, the operation will be described. When power is supplied to the semiconductor element 2 via the external power supply boost bar 9 and power receiving bar 8, the semiconductor element 2 generates heat by energization, and this heat is transmitted to the base plate 1 a that sandwiches the semiconductor element 2. The working fluid in the heat pipe 1c inserted into the base plate 1a is heated and evaporated by the heat transmitted to the base plate 1a. The evaporating hydraulic fluid is cooled by the radiating fins 1b to be in a liquid state, so that the semiconductor element 2 is radiated.

[0004]

The conventional heat pipe type cooling device for a semiconductor device is constructed as described above. Therefore, when replacing a failed semiconductor device, a rigid power supply bar 8 is required. The bolt 10a and the nut 10b for connection between the power supply and the external power supply boost bar 9 must be removed. For this reason, there has been a problem that the replacement work of the semiconductor element is troublesome and time-consuming.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a heat pipe type cooling device for a semiconductor device in which a semiconductor device can be easily and quickly replaced.

[0006]

SUMMARY OF THE INVENTION A heat pipe type cooling device for a semiconductor device according to the present invention is assembled by sandwiching a semiconductor device between base plates into which heat pipes having heat radiation fins are inserted, and an external power supply boost bar. And a connector in which the power receiving bar connected to the base plate is inserted into and removed from the connector.

[0007]

The assembled body of the semiconductor element according to the present invention is retracted in a pull-out manner, the power receiving bar connected to the base plate is detached from the connector, the tightening nut of the through bolt for assembly is loosened, and the gap between the adjacent base plates is removed. By expanding, the semiconductor element can be replaced easily and quickly. After the replacement, power is supplied by advancing the assembled body of the semiconductor elements in a pull-out manner and inserting the power receiving bar into the connector.

[0008]

【Example】

Embodiment 1 FIG. Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a partially cutaway plan view, FIG. 2 is a front view thereof,
FIG. 3 is a side view thereof. In FIGS. 1 to 3, 1 is a cooler main body, 2 is a semiconductor element, 3 is a holding plate, 4 is a through bolt, 5 is a fastening nut, 6 is a cover, and 8 is a power receiving member. Bar, 9 is an external power supply boost bar, 10a is a bolt,
Numeral 10b denotes a nut, which is exactly the same as the conventional device shown in FIG. The cover 6 is composed of upper and lower plates 6a and 6b mounted on the holding plate 3, as shown in FIG. 3, and partition plates 6c for shielding both side surfaces of the cooler main body 1.

Reference numeral 11 denotes a connector. As shown in FIGS. 4 and 5, the connector 11 is provided with a connection bar 11c on an arm 11b provided at substantially equal intervals on the upper surface of a case 11a.
1d, etc., a junction 11e is attached to the tip of a connection bar 11c located in the case 11a, and the junctions 11e are insulated from each other by a shielding plate 11f. Part 11
g, 11h and arms 11i projecting from both side ends are fixed to a device body (not shown). A guide member 12 protrudes from the lower end of the holding plate 3.
Is bent in a U-shape and serves as a guide when the assembled body of the semiconductor elements is fitted in a rail groove (not shown) and is moved back and forth in a pull-out manner.

Next, the operation will be described. First, the assembled body of the semiconductor element 2 is moved forward in the direction of arrow a using the guide member 12 fitted in the rail groove (not shown) as a guide, and the power receiving bar 8 is moved to the junction 11e as shown in FIGS. When press-fitted in the middle, the external power boost bar 9
Power is supplied to the semiconductor element 2 via the junction 11 e and the power receiving bar 8.

When the semiconductor element 2 generates heat by energization, and this heat is transmitted to the base plate 1a sandwiching the semiconductor element 2, the hydraulic fluid in the heat pipe 1c inserted into the base plate 1a is transmitted by the heat transmitted to the base plate 1a. Heats and evaporates. Then, the evaporating hydraulic fluid is cooled by the radiating fins 1b to be in a liquid state, so that the semiconductor element 2 is radiated. Further, the radiation fins 1b are naturally cooled by the ventilation flowing in the direction shown in FIG.

When the semiconductor element 2 is to be replaced due to a failure or the like, the assembled body of the semiconductor element 2 is moved backward in the direction of arrow b to connect the power receiving bar 8 to the junction of the connector 11 as shown in FIG. 11e, and then loosening the tightening nut of the through bolt 4 to widen the space between the adjacent base plates 1a, it is possible to perform the replacement work very simply and quickly.

[0013]

As described above, according to the present invention, the assembled body of the semiconductor elements can be moved back and forth in a pull-out manner, and the power receiving bar connected to the base plate can be connected to the connector connected to the external power supply boost bar. Since it was configured to be inserted and removed,
The connection and disconnection between the power receiving bar and the power supply boost bar can be easily performed, and the semiconductor element can be easily and quickly replaced.

[Brief description of the drawings]

FIG. 1 is a partially cutaway plan view showing an embodiment of the present invention.

FIG. 2 is a front view showing the embodiment.

FIG. 3 is a transverse sectional view taken along line AA of FIG. 2;

FIG. 4 is an enlarged view of a connector section.

FIG. 5 is a cross section along the line BB in FIG. 4;

FIG. 6 is a sectional view taken along line CC of FIG. 4;

FIG. 7 is a partially cutaway plan view of a conventional heat pipe cooling device for a semiconductor device.

FIG. 8 is a front view of the conventional device.

[Explanation of symbols]

 1a Base plate 1b Radiator fin 1c Heat pipe 2 Semiconductor element 8 Power receiving bar 9 Power supply boost bar 11 Connector

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 23/34-23/473 H01L 25/11

Claims (1)

(57) [Claims] 1. A heat pipe type cooling device for a semiconductor device, wherein a semiconductor device is sandwiched between base plates into which a heat pipe having heat radiation fins is inserted, wherein a connector to which an external power supply boost bar is connected is provided. A heat pipe type cooling device for a semiconductor device, wherein the assembled body of the semiconductor device is configured to be able to move in a pull-out manner so that a power receiving bar connected to a base plate can be inserted into and removed from the connector.