JP2018109240A - Evaporation source - Google Patents

Abstract

A metal or metal alloy evaporation apparatus with improved heat load on a substrate and / or other components during OLED manufacturing and an improved method of operating a metal or metal alloy evaporation source. The evaporation source is capable of translation along a linear guide and is configured to evaporate a metal or metal alloy, and one or more evaporating crucibles provided on the evaporating crucible. , Consisting of two distribution pipes 106, for example, which have one or more outlets 712 provided along the length and are in fluid communication with the evaporation crucible. The distribution pipe further comprises a first outer tube 234 and a first inner tube 232, the distribution pipe and the evaporation crucible being provided as one single piece. [Selection] Figure 2

Description

  Embodiments of the invention relate to the deposition of metallic materials, such as for OLED manufacturing. In particular, embodiments relate to the evaporation of metals and metal alloys. In particular, embodiments relate to evaporation sources for metals or metal alloys, evaporation source arrays for metals or metal alloys, and methods of operating evaporation sources.

  A metal evaporator is a tool used for organic light emitting diode (OLED) manufacturing. An OLED is a special light emitting diode that includes a thin film of an organic compound with a light emitting layer therein. Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, cell phones, and other portable devices for displaying information. OLEDs can also be used for general space illumination. The range of colors, brightness, and viewing angles possible with OLED displays is greater than that of conventional LCD displays because OLED pixels emit directly and do not require a backlight. Thus, the energy consumption of an OLED display is significantly less than that of a conventional LCD display. Furthermore, since the OLED can be manufactured on a flexible substrate, the use is further expanded. For example, a typical OLED display can include a layer of organic material disposed between two electrodes, all deposited on a substrate, so as to form a matrix display panel having individually energizable pixels. . The OLED is always placed between two glass panels and the end of the glass panel is sealed to encapsulate the OLED therein.

  OLED displays or OLED lighting applications include, for example, a stack of several organic materials and metals or metal alloys that evaporate in a vacuum. For OLED stack manufacturing, co-evaporation of two or more metals or metal alloys may be desired.

  For example, a typical OLED display can include a layer of organic material located between two electrodes, all deposited on a substrate. One of these electrodes consists of a transparent conductive layer such as ITO or other transparent conductive oxide material (TCO). The second electrode is made of metal or metal alloy. Cesium fluoride or silver can be deposited as a protective layer or layer to reduce electron affinity, which is often a very thin layer of lithium fluoride between the cathode and the electron transport layer.

  From the perspective of high temperature metal evaporation, the thermal load on the substrate and / or other components during OLED manufacturing can be high. Accordingly, an improved metal or metal alloy evaporation apparatus and improved metal or metal alloy evaporation are desired.

  In view of the above, an evaporation source for a metal or metal alloy, an evaporation source array, and a method of operating an evaporation source array are provided. Further advantages, features, aspects and details are apparent from the dependent claims, the description and the drawings.

  According to embodiments, an evaporation source for a metal or metal alloy is provided. The evaporation source is an evaporation crucible configured to evaporate a metal or metal alloy, and a distribution pipe having one or more outlets provided along the length of the distribution pipe, the evaporation crucible and the fluid And a distribution pipe, the distribution pipe includes a first outer tube and a first inner tube, and the distribution pipe and the evaporation crucible are provided as one single part.

  According to another embodiment, the evaporation crucible of the evaporation source further includes a second outer tube and a second inner tube, and the second outer tube and the second inner tube of the evaporation crucible are a single unit. Provided as part of the part. A single part is provided, for example, by welding, sintering, or another non-removable bond. According to yet another embodiment, the distribution pipe can further comprise a first heating element disposed inside the first inner tube and / or the evaporating crucible can be provided on the second inner tube. Further comprising a second heating element arranged on the inside, the evaporation crucible and the distribution pipe can be made from molybdenum or tantalum.

  The evaporation source may further include one or more drains, and the one or more outlets are nozzles that extend along the evaporation direction. The evaporation direction of the outlet or outlets can be essentially horizontal. The distribution pipe of the evaporation source can be a vapor distribution showerhead including one or more outlets, in particular a linear vapor distribution shower where the vapor distribution showerhead provides a linear source for metal or metal alloy vapor Head. According to a still further embodiment, the distribution pipe of the evaporation source can include an opening that can be sealed with screws or bolts for filling the evaporation source or the crucible respectively with the evaporation material. Furthermore, the distribution pipe of the evaporation source can have a non-circular cross section perpendicular to the length of the distribution pipe having a main part corresponding to a part of the triangle, in particular a cross section perpendicular to the length of the distribution pipe, A triangle with rounded corners and / or cut corners.

  According to another embodiment, an evaporation source for a metal or metal alloy is provided. The evaporation source array includes a first evaporation source and at least a second evaporation source, and includes at least a first outlet of one or a plurality of outlets of the first evaporation source and one of the second evaporation sources. Alternatively, at least the second discharge port of the plurality of discharge ports has a distance of 25 mm or less. The evaporation source array is rotatable about an axis during evaporation of the distribution pipe, is one or more supports for the distribution pipe, can be coupled to the first driver, or includes the first driver, The first driver can be configured to further include a support configured for translational movement of the one or more supports and the distribution pipe.

  Embodiments are also directed to apparatus for performing the disclosed methods and include apparatus portions for performing the described methods or processes. These methods or processes may be performed by means of hardware components, a computer programmed by appropriate software, by any combination of the two, or in any other way. Furthermore, embodiments according to the present disclosure are also directed to methods for operating the described apparatus. This includes methods or processes for performing any function of the device. According to the method described herein, the evaporated material of the first evaporation source is silver (Ag), the evaporated material of the second evaporation source is magnesium (Mg), and the first evaporation source The evaporated material and the evaporated material of the second evaporation source are evaporated at a ratio of 1: 1 ≦ Ag: Mg ≦ 7: 1.

  In order that the above features of the present invention may be understood in detail, a more detailed description of the invention, briefly outlined above, may be obtained by reference to the embodiments. The accompanying drawings relate to embodiments of the invention and are described in the following description.

FIG. 2 shows a schematic top view of a deposition apparatus for depositing a metal material, such as a metal or metal alloy, in a vacuum chamber according to embodiments described herein. FIG. 2 shows a schematic diagram of a portion of an evaporation source according to embodiments described herein. A and B show schematic cross-sectional views of portions of an evaporation source or an evaporation tube, respectively, according to embodiments described herein. FIG. 4 shows a schematic top cross-sectional view of an array of two evaporation sources or two evaporation tubes, respectively, according to embodiments described herein. A to C show schematic cross-sectional views of respective portions of an evaporation source or an evaporation tube, according to embodiments described herein. FIG. 3 shows a schematic cross-sectional view of a portion of an evaporation source or an evaporation tube according to embodiments described herein. FIG. 3 shows a schematic view of a portion of an evaporation tube according to embodiments described herein. FIG. 6 shows a schematic diagram of a portion of an array of openings in a shield according to embodiments described herein. FIG. 6 shows a schematic diagram of a portion of an array of openings in a shield according to embodiments described herein. FIG. 2 shows a schematic diagram of a portion of an evaporation source according to embodiments described herein. A and B show schematic cross-sectional views of portions of an evaporation source or an evaporation tube, respectively, according to embodiments described herein. FIG. 6 shows a schematic diagram of another evaporation source according to embodiments described herein. FIG. 6 shows a schematic diagram of yet another evaporation source according to embodiments described herein. A and B are deposition apparatus for depositing organic material in a vacuum chamber according to embodiments described herein, and organic material evaporation according to embodiments described herein at different deposition locations in the vacuum chamber. Figure 2 shows a schematic diagram of an evaporation source for FIG. 6 shows a flowchart of a method for depositing a metal material, such as a metal or metal alloy, with a distribution pipe according to embodiments described herein.

  Reference will now be made in detail to various embodiments of the invention, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to the same components. Generally, only the differences with respect to the individual embodiments are described. Each example is provided by way of explanation of the invention, not limitation of the invention. In addition, features illustrated or described as part of one embodiment may be used in or combined with other embodiments, thereby creating yet another embodiment. It is. This specification is intended to include such modifications and variations.

  FIG. 1 shows the evaporation source 100 in a position within the vacuum chamber 110. According to some embodiments, which can be combined with other embodiments described herein, the evaporation source is configured for translational movement and rotation about an axis. The evaporation source 100 includes one or more evaporation crucibles 104 and one or more distribution pipes 106. Two evaporating crucibles and two distribution pipes are shown in FIG. 1, and the evaporation crucibles and distribution pipes can be provided on the support 102. A distribution pipe 106 having an evaporation crucible 104 is supported by a support 102. Two substrates 121 are provided in the vacuum chamber 110. A metal material such as metal or metal alloy evaporates from the distribution pipe 106.

  According to the embodiments described herein, the substrate is coated with a metallic material in an essentially vertical position. For example, the metallic material can be a metal or metal alloy such as calcium, aluminum, barium, ruthenium, magnesium-silver alloy, silver, or combinations thereof. The view shown in FIG. 1 is a top view of an apparatus including an evaporation source 100. Typically, the distribution pipe is a steam distribution showerhead, in particular a linear steam distribution showerhead. The distribution pipe provides a source that extends essentially vertically. According to embodiments described herein, which can be combined with other embodiments described herein, essentially vertical refers to 20 ° or less, particularly when referring to substrate orientation, for example, It is understood that a deviation from the vertical direction of 10 ° or less is allowed. This deviation from the vertical direction can be used to reduce particle generation on the substrate or the layer deposited thereon. Alternatively, a deviation may be provided, for example, because a substrate support having some deviation from the vertical orientation may result in a more stable substrate position. However, the substrate orientation during the deposition of the metal material is considered to be essentially vertical and is considered different from the horizontal substrate orientation. The surface of a vertically oriented substrate is coated with a source extending in one direction corresponding to one substrate dimension and translational movement along another direction corresponding to another substrate dimension.

  FIG. 1 shows an embodiment of a deposition apparatus 200 for depositing a metal material such as a metal or metal alloy in a vacuum chamber 110. The evaporation source 100 is provided in the vacuum chamber 110 on a track or linear guide 220, such as, for example, a loop track (eg, shown in FIG. 11A). The trajectory of the linear guide 220 is configured for translational movement of the evaporation source 100. According to different embodiments that can be combined with other embodiments described herein, a driver for translational motion can be placed in the evaporation source 100, in the trajectory or linear guide 220, in the vacuum chamber 110, Or a combination thereof.

  FIG. 1A shows a valve 205, such as a gate valve. Valve 205 allows a vacuum seal to an adjacent vacuum chamber (not shown in FIG. 1). The valve can be opened for transport of the substrate 121 or frame 131 into or out of the vacuum chamber 110. The frame 131 can support a mask that masks the edge of the substrate 121.

  According to some embodiments, which can be combined with other embodiments described herein, an additional vacuum chamber, such as maintenance vacuum chamber 210, is provided adjacent to vacuum chamber 110. The vacuum chamber 110 and the maintenance vacuum chamber 210 are connected by a valve 207. Valve 207 is configured to open and close the vacuum seal between vacuum chamber 110 and maintenance vacuum chamber 210. The evaporation source 100 can be transferred to the maintenance vacuum chamber 210 while the valve 207 is open. Thereafter, the valve can be closed to provide a vacuum seal between the vacuum chamber 110 and the maintenance vacuum chamber 210. When the valve is closed, the maintenance vacuum chamber 210 can be ventilated and opened for evaporation source 100 maintenance without breaking the vacuum in the vacuum chamber 110. Accordingly, it may also be possible to operate the evaporation source 100 in the vacuum chamber 110 while the maintenance vacuum chamber 210 is ventilated for maintenance purposes.

  The two substrates 121 are supported on respective transport tracks in the vacuum chamber 110. In addition, two trajectories are provided thereon for providing a frame 131, for example a mask frame. The coating on the substrate 121 can be masked by the respective mask and can be supported by the frame 131. According to the exemplary embodiment, the frame 131, that is, the first frame 131 corresponding to the first substrate 121 and the second frame 131 corresponding to the second substrate 121 are provided at predetermined positions. It is done.

  According to some embodiments, which can be combined with other embodiments described herein, the substrate 121 can be supported by a substrate support 126 coupled to the alignment unit 112. The alignment unit 112 can adjust the position of the substrate 121 with respect to the mask 131. FIG. 1 shows an embodiment in which the substrate support 126 is coupled to the alignment unit 112. Thus, the substrate moves relative to the frame 131 and / or mask to provide proper alignment between the substrate and the frame during the deposition of the metal material. Either the frame and / or mask can be positioned relative to the substrate 121, or both the frame 131 and the substrate 121 can be positioned relative to each other. The alignment unit 112 is configured to adjust the position relative to each other between the substrate 121 and the mask 131, allowing for correct alignment of the frame during the deposition process, which is a high quality OLED display. Useful for manufacturing.

  Examples of alignment of the frame and substrate relative to each other include an alignment unit that allows relative alignment in at least two directions that define a plane of the substrate and a plane that is essentially parallel to the plane of the frame. For example, alignment can be performed at least in the x-direction and y-direction, i.e., in two Cartesian directions that define the parallel planes. Typically, the frame and the substrate can be essentially parallel to each other. In particular, the alignment can be further performed in a direction essentially perpendicular to the plane of the substrate and the plane of the mask. Thus, the alignment unit is configured for at least XY alignment, in particular XYZ alignment of the frame and the substrate relative to each other. One particular example that can be combined with other embodiments described herein is to align the substrate with respect to the frame in the x-, y-, and z-direction, where the frame is , Can be held stationary in the vacuum chamber 110.

  As shown in FIG. 1, the linear guide 220 provides the direction of translation of the evaporation source 100. On both sides of the evaporation source 100, the substrate 121 on the opposite side of the evaporation source 100 can extend essentially parallel to the direction of translation. According to an exemplary embodiment, the substrate 121 can be moved into and out of the vacuum chamber 110 via the valve 205. The deposition apparatus 200 can include respective transport tracks for transporting each of the substrates 121. For example, the transfer track can extend into and out of the vacuum chamber 110 parallel to the substrate position shown in FIG.

  Typically, additional tracks are provided that support the frame 131. Thus, some embodiments, which can be combined with other embodiments described herein, can include four trajectories in the vacuum chamber 110. In order to move one of the frames 131 out of the chamber, for example for cleaning the frame 131, the frame can be moved onto the transport path of the substrate 121. Each frame can then enter and exit the vacuum chamber 110 on the substrate transport trajectory. Even though it is possible to provide the frame 131 with a separate transport trajectory into and out of the vacuum chamber 110, the cost of ownership of the deposition apparatus 200 is only two trajectories, namely the substrate transport trajectory. In addition to extending into and out of the vacuum chamber 110, in addition, the frame 131 can be reduced if it can be moved onto each one of the substrate transport trajectories by a suitable actuator or robot. it can.

  FIG. 1 shows an exemplary embodiment of an evaporation source 100. The evaporation source 100 includes a support 102. The support 102 is configured for translational movement along the linear guide 220. The support 102 can support one or a plurality of, for example, two evaporation crucibles 104 and one or a plurality of, for example two, two distribution pipes 106 provided on the evaporation crucible 104. According to the embodiments described herein, which can be combined with other embodiments described herein, the distribution pipe and the evaporation crucible are provided as one single piece. In this single part, the vapor generated in the evaporating crucible can move upward from one or more outlets of the distribution pipe. According to the embodiments described herein, the distribution pipe 106 can also be considered a vapor distribution showerhead, such as, for example, a linear vapor distribution showerhead.

  FIG. 2 shows a diagram of a portion of an evaporation source according to an embodiment described herein. The evaporation source can include a distribution pipe 106 and an evaporation crucible 104. The evaporation crucible 104 can be fixed to the first end of the distribution pipe 106 in a non-detachable manner, for example by welding. Accordingly, the evaporation crucible 104 and the distribution pipe 106 are provided as a single part. There is no gas or slit in the contact area 230, and the contact area 230 can be hermetically closed. According to the embodiments described herein, there are no gaps and / or slits between the evaporation crucible and the distribution pipe. In particular, the inside of the evaporation crucible and the inside of the distribution pipe form one common cavity space. The hollow space is free of gaps or slits, such as gaps or slits between the evaporation crucible and the distribution pipe, for example. Without providing the evaporation crucible and distribution pipe as one single piece, the gas or slit may be in the contact area 230 between the evaporation crucible 104 and distribution pipe 106. For example, the evaporation crucible and distribution pipe can be welded to each other, thus avoiding gaps or slits in the contact area of the evaporation crucible and distribution pipe.

  At the second end of the distribution pipe 106 opposite the first end, the closure plate 236 can be secured in a non-removable manner, such as by welding, and a gap to hermetically close the contact area 230. Or there is no slit. The cover plate 236 can be provided with openings or apertures 238 for filling the evaporation source 100 or the evaporation crucible 104 with the evaporation material, respectively. This opening or opening 238 can be removably sealed in a vapor tight manner with a closure 240 such as a screw, bolt, plug or any suitable seal. In some embodiments, one opening or aperture may be provided for filling the evaporation source 100 or the evaporation crucible 104 with an evaporation material. However, it is also possible to provide a plurality of openings or apertures. Thus, the cavity space provided by providing the evaporation crucible and distribution pipe as a single part is for filling the evaporation source 100 or the evaporation crucible 104 with the evaporation material at one or more outlets 712, for example nozzles. Only one or more openings or apertures are open to the outside. One or more outlets 712 direct vaporized material, such as metal vapor or metal alloy vapor, to the substrate. According to embodiments that can be combined with other embodiments described herein, the cavity space or volume that can provide the deposited material is between the distribution pipe and the inner tube within the distribution pipe. And / or between the crucible wall and the inner tube inside the crucible.

  According to the embodiment, the distribution pipe 106 may be an elongated pipe including an inner tube 232 and an outer tube 234 as shown in FIG. The inner tube 232 can be formed as a cylinder having one closed end and one open end. Inner tube 232, outer tube 234, and closure 236 can be welded to form one single piece. Further, the inner tube 232, outer tube 234, closure 236, and crucible 104 can be welded to form the evaporation source 100 as one single piece.

  According to the embodiments described herein, the evaporation source 100 includes a distribution pipe 106 and an evaporation crucible 104, where the distribution pipe and the evaporation crucible are provided as one single piece. The evaporation source formed as one single piece provides a closed housing or boundary of the evaporation source space without slits or gaps. The advantage of this structure or design is that it prevents liquid metal or metal vapor from entering the slits or gaps. There are known metals whose wettability can cause flow through such slits or gaps. Such liquid metal slows through the slits or gaps, travels slowly, flows or oozes and reaches the outside of the evaporation source. As a result, contamination or contamination inside the coating machine, or destruction of high-precision machine parts can occur. In addition, liquid metals can cause electrical shorts.

  According to the embodiments described herein, providing the distribution pipe and the evaporation crucible as one single part without slits or gaps means that these parts can be welded, sintered, soldered, brazed, for example. It is herein intended to be integrally joined in a non-removable manner, such as by attaching, manufacturing from a single part, pressure welding or press fitting, 3D printing, bonding, fusing, or other suitable means It can be understood.

  According to embodiments that can be combined with other embodiments described herein, the distribution pipe 106 includes a first outer tube 234 and a first inner tube 232. The first outer tube and the first inner tube of the distribution pipe, for example by welding or any other suitable means described above, to form one single part without slits or gaps, They can be joined together in a non-detachable manner. Furthermore, the distribution pipe includes a first heating element 715 disposed inside the first inner tube 232. A hollow space, a closed housing or part of the space of the evaporation source is formed between the wall of the first outer tube and the wall of the first inner tube. Thus, the first heating element is not in the cavity space, closed housing or space of the evaporation source to which the material for layer deposition is supplied. However, the first heating element is in the first outer tube and the first inner tube.

  According to another embodiment, which can be combined with other embodiments described herein, the distribution pipe 104 comprises a second outer tube 248 and a second inner tube 244. The second outer tube and the second inner tube of the evaporation crucible are used to form one single part without slits or gaps, such as by welding or any other suitable means described above, etc. They can be joined together in a non-detachable manner. In addition, the evaporation crucible includes a second heating element 725 disposed within the second inner tube. A hollow space of the evaporation source, a closed housing or a further part of the space is formed between the wall of the second outer tube and the wall of the second inner tube. Thus, the second heating element is not in the cavity space, closed housing or space of the evaporation source to which the material for layer deposition is supplied. However, the second heating element is in the second outer tube and the second inner tube.

  The distribution pipe further comprises one or more outlets that can be formed as nozzles. One or more outlets or nozzles extend along the evaporation direction. The direction of evaporation can be essentially horizontal. The distribution pipe can be an evaporative distribution showerhead having one or more outlets. In particular, the evaporative distribution showerhead may be a linear vapor distribution showerhead that provides a linear source for metal vapor. According to an embodiment, the one or more outlets of the evaporation source have a distance of 25 mm or less. Furthermore, the one or more outlets or nozzle openings of the evaporation source have a cross section between 1 mm and 6 mm in diameter, for example between 1 mm and 3 mm.

  The distribution pipe further includes one or more openings for filling the evaporation source 100 or the evaporation crucible 104 with the evaporation material. This opening for filling the evaporation source 100 or the evaporation crucible 104 with the evaporation material may be sealable with screws or bolts. Sealable can be understood here as a vapor-sealed chain that is removable to fill the evaporation source or evaporation crucible with the evaporation material. A vapor tight seal can be achieved by using a lid or cap. The lid or cap can be provided by screws or bolts. According to some embodiments, which can be combined with other embodiments described herein, the lid or cap can be made from graphite. According to another embodiment, the evaporation crucible can be made from molybdenum or tantalum.

  According to a further embodiment, the distribution pipe can be made from molybdenum or tantalum. In addition, molybdenum or tantalum nozzle bars can be produced. According to a further embodiment, the evaporation crucible, distribution pipe and nozzle bar can be made from molybdenum or tantalum. According to another embodiment that can be combined with other embodiments described herein, the evaporation source can be formed such that the distribution pipe has a non-circular cross-section perpendicular to the length of the distribution pipe. it can. The evaporation source can have a main part corresponding to a triangular part. The cross section perpendicular to the length of the distribution pipe can be a triangle with rounded and / or cut corners as a triangle. Furthermore, the evaporation source can have a triangular cross section.

  The above design offers the possibility of combining a first evaporation source and a second evaporation source to form an array. An array of evaporation sources can be used to increase the evaporation rate of a metal or metal alloy. Furthermore, the array of evaporation sources can be used for the simultaneous evaporation of two different metals or metal alloys. According to an embodiment that can be combined with other embodiments described herein, the array of evaporation sources is such that the evaporation direction of one or more outlets of each evaporation source is along the length of the distribution pipe. It can arrange | position so that it may incline with respect to the symmetrical plane provided. For example, the tilt angle of the distribution source, for example, the angle at which the main evaporation direction of the evaporation source radiates with respect to the surface orthogonal to the substrate surface can be 20 degrees or less, for example between 3 degrees and 10 degrees. This orientation of one or more outlets or nozzles offers the possibility of realizing a reduction in the distance between the array of evaporation sources and the substrate.

  According to the embodiment, the evaporated material of the first evaporation source can be silver (Ag), and the evaporated material of the second evaporation source can be magnesium (Mg). The first and second evaporated materials may evaporate in a ratio of 1: 2 ≦ Ag: Mg ≦ 7: 1, in particular 1: 1 ≦ Ag: Mg ≦ 5: 1. According to embodiments described herein, the evaporation source includes one or more evaporation crucibles and one or more distribution pipes, each one of the one or more distribution pipes being one or more evaporation lines. Each one of the crucibles can be in fluid communication. Various applications for OLED device manufacturing include processes in which one or more metallic materials are vaporized simultaneously.

  Thus, for example, as shown in FIG. 4, two distribution pipes and corresponding evaporation crucibles can each be provided adjacent to each other as a single piece. Accordingly, the evaporation source 100 may also be referred to as an evaporation source array, for example, two or more metal materials are evaporated simultaneously. As described herein, the evaporation source array itself may be referred to as an evaporation source for two or more metal materials, eg, metals or metal arrays.

  As described herein, evaporation sources and evaporation source arrays for metallic materials can each be improved against the desire to deposit different metals independently or in combination with each other. An evaporation source that evaporates two or more metal materials from the same crucible may not sufficiently mix the metal alloy materials when depositing two or more metal alloy materials on the substrate. Thus, for example, it is desirable to improve the mixing of metal alloy materials for applications where two different metal materials are deposited to provide one metal alloy layer on a substrate.

  One or more outlets of the distribution pipe can be one or more openings or one or more nozzles, such as can be provided, for example, in a showerhead or another vapor distribution system. The evaporation source can include a vapor distribution showerhead, such as, for example, a linear vapor distribution showerhead having a plurality of nozzles or openings. A showerhead can be understood herein as including a housing having an opening in which the pressure in the showerhead is higher than the pressure outside the showerhead, for example, by at least an order of magnitude. .

  According to the embodiments described herein, which can be combined with other embodiments described herein, the rotation of the distribution pipe is due to the rotation of the evaporator crucible and the evaporator control housing to which the distribution pipe is mounted. Can be provided. For example, the evaporation crucible and the distribution pipe can be provided as one single piece by welding. Additionally or alternatively, rotation of the distribution pipe can be provided by moving the evaporation source along a curved portion of a looped track (see, eg, FIG. 11A). Thus, the material source can include a distribution pipe and an evaporation crucible, both of which can be rotatably mounted, i.e. can be integral.

  According to some embodiments, which can be combined with other embodiments described herein, the evaporation source includes a distribution pipe (eg, an evaporation tube). The distribution pipe may have multiple openings, such as a nozzle array implemented. Further, the evaporation source includes a crucible containing an evaporation material. According to some embodiments, which can be combined with other embodiments described herein, the distribution pipes or evaporator tubes can be designed in a triangular shape, thus making the openings or nozzle arrays as close as possible to each other It is possible. This makes it possible to achieve an improved mixing of different metal materials, for example in the case of co-evaporation of two, three or more different metal materials.

  According to further embodiments that can be additionally or alternatively implemented, the evaporation source described herein suppresses the temperature rise of the substrate on which the temperature sensitive organic material is deposited. This can be, for example, less than 5 Kelvin, or less than 1 Kelvin. Heat transfer from the evaporation source to the substrate can be reduced by improved cooling. Additionally or alternatively, considering the triangular shape of the evaporation source, the area extending radially toward the substrate is reduced. In addition, large quantities of metal plates, such as up to 10 metal plates, can be provided to reduce heat transfer from the evaporation source to the substrate. According to some embodiments, which can be combined with other embodiments described herein, the heat shield or metal plate can be provided with an orifice to the outlet or nozzle, and the evaporation source At least on the front side, i.e. on the side facing the substrate.

  According to an exemplary embodiment that can be combined with other embodiments described herein, distribution pipe 106 provides a source. For example, a plurality of openings such as nozzles and / or outlets 712 are arranged along at least one line. According to an alternative embodiment, an elongated opening can be provided that extends along at least one line. For example, the elongated opening can be a slit. According to some embodiments, which can be combined with other embodiments described herein, the lines extend essentially vertically. For example, the length of the distribution pipe 106 or the length of the plurality of openings and / or outlets corresponds at least to the height of the substrate to be deposited in the deposition apparatus. In many cases, the length of the distribution pipe 106 or the length of the openings and / or outlets will be at least 10% or even 20% longer than the height of the substrate being deposited. According to some embodiments, which can be combined with other embodiments described herein, the length of the distribution pipe or the length of the plurality of openings and / or outlets can include the height of the substrate. If H, the protrusion, or the overhang is P, it is possible to provide a constant P with respect to H such that the total length of the distribution pipe or the length of the plurality of openings and / or outlets is given by H + 2. This constant protrusion or overhang can provide uniform deposition on the top and / or bottom of the substrate.

  According to some embodiments that may be combined with other embodiments described herein, the length of the distribution pipe may be 1.3 m or more, for example 2.5 m or more. According to one configuration, the evaporation crucible 104 is provided at the lower end of the distribution pipe 106 as shown in FIG. The metal material evaporates in the evaporation crucible 104. The vapor of the metallic material enters the distribution pipe 106 at the bottom of the distribution pipe and is guided essentially laterally through a plurality of openings in the distribution pipe, for example, toward an essentially vertical substrate.

  According to some embodiments, which can be combined with other embodiments described herein, the outlet (eg, nozzle) is positioned such that the main evaporation direction is ± 20 degrees horizontally. The According to some specific embodiments, the direction of evaporation can be oriented slightly upward, for example in the range from horizontal to 15 °, such as 3 ° to 7 ° upwards. Similarly, the substrate can be slightly tilted to be substantially perpendicular to the evaporation direction. The evaporation direction and this slightly tilted orientation of the substrate can reduce unwanted particle formation. For illustrative purposes, the evaporation crucible 104 and distribution pipe 106 are shown in FIG. 2 without a heat shield. A first heating element 715 and a second heating element 725 can be seen in the schematic perspective view shown in FIG. 3B.

  3A and 3B show schematic cross-sectional views of portions of an evaporation source or an evaporation tube, respectively, according to embodiments described herein. The evaporation crucible can be a reservoir for the metal material to be evaporated. According to some embodiments, which can be combined with other embodiments described herein, the first heating element can be provided with a distribution pipe and the second heating element has an evaporation crucible. Can be provided. For example, the first heating element and the second heating element can be provided to heat the distribution pipe and the evaporation crucible from the distribution pipe and the evaporation crucible, respectively. Thus, the overall heating power can be reduced, and then the thermal load on the substrate or mask can also be reduced as a result. However, one of the first heating element and the second heating element may also be provided to heat the source from the outside.

FIG. 3A shows a second heating element 725. The second heating element 725 can be provided on the bottom plate 242 of the evaporation crucible 104 or can be configured to surround the exterior of the evaporation crucible (not shown). The volume of the evaporation crucible 104 is between from 100 cm ³ to 3000 cm ^3, in particular between from 700 cm ³ to 1700 cm ^3, more specifically may be a 1200 cm ^3. The first heating element 715 can be disposed inside the inner tube 232 of the distribution pipe 106 and is provided to heat the distribution pipe. Both the first heating element 715 and the second heating element 725 can be independently and independently temperature controlled and / or power controlled. Therefore, the distribution pipe 106 can be heated to a temperature at which the vapor of the metal material supplied by the evaporation crucible 104 does not condense in the distribution pipe 106, for example, the inside of the wall of the distribution pipe 106. Evaporation crucible 104 is used to generate and ensure the flow of metal vapor required for the thickness of the metal layer that is to be deposited on the substrate, for example, at a vaporization rate suitable for metal materials such as metals or metal alloys. It can be heated to a temperature that evaporates.

  FIG. 3B shows a schematic cross-sectional view of the lower portion of each evaporation source or evaporation tube, according to further embodiments described herein. As can be seen from FIG. 3B, according to some embodiments, which can be combined with other embodiments described herein, the evaporation source 100 comprises a distribution pipe 106 and an evaporation crucible 104. The distribution pipe 106 includes an outer tube 234 and an inner tube 232. The evaporation crucible 104 includes an outer tube 248, an inner tube 244, and a bottom plate 242. Both inner tubes 232 and 244 can be formed as cylinders with one closed end and one open end. The cylinder may have any cross-sectional shape such as circular, elliptical, triangular, quadrangular, hexagonal, or polygonal. However, the cylinder provides a more symmetrical thermal radiation. A first heating element 715 for overheating the distribution pipe 106 can be disposed inside the inner tube 232. A second heating element 725 for overheating the crucible 104 can be disposed inside the inner tube 244. The first and / or second heating element may be the electrical heating element illustrated in FIG. 3B.

  Placing heating elements within the inner tubes 232 and 244 reduces heat loss to the area outside the evaporation source. Thus, the overall heating power can be reduced and then the thermal load on the substrate or mask can also be reduced. In addition, having a heating element in the tube can result in thermal expansion, such as a heating element such as a rod that provides improved thermal contact between the heating element and the distribution tube and crucible inner tube. . Therefore, it can be ensured that the heating power is effectively transferred from the first heating element 715 and the second heating element 725 to the inner tube 232 of the distribution pipe and the inner tube 244 of the crucible, respectively. Furthermore, thermal damage to the heating element that can occur when the heating element placed in a vacuum during operation has low thermal contact to the object to be heated and cannot dissipate heat is prevented. According to some embodiments, which can be combined with other embodiments described herein, the heating element can exhibit a greater thermal expansion or greater coefficient of thermal expansion than the inner tube. Thus, heating the heating element improves the thermal contact between the heating element and the inner tube.

  The first inner tube 232 of the distribution pipe 106 and the second inner tube 244 of the crucible 104 can have surfaces 246 whose closed ends are opposite to each other. According to the embodiment, the first inner tube 232 of the distribution pipe 106 and the second inner tube 244 of the evaporation crucible 104 can face each other even if they are not in mechanical contact. According to another embodiment, the first inner tube 232 of the distribution pipe 106 and the second inner tube 244 of the evaporation crucible may be in mechanical contact. At surface 246, intertubes 232 and 244 can be in direct contact or indirect contact. The closed end can provide a recess and a protrusion. For example, the recesses and protrusions can be formed like slots and keys. On the surface 246, the first inner tube 232 and the second inner tube 244 can provide a space surrounded by the recesses and protrusions. This space can be filled with a material that exhibits low thermal conductivity to thermally isolate the thermal control of the heating elements 715 and 725. According to some embodiments, which can be combined with other embodiments described herein, inner tubes 232 and 244 can be made from two different parts in floating contact, both inner tubes Sufficient space for thermal expansion is provided at the end provided with recesses and protrusions such as slots and keys.

  According to yet another embodiment, the first inner tube 232 of the distribution pipe and the second inner tube 244 of the evaporation crucible may be in direct but detachable mechanical contact. The slit or gap between the first inner tube 232 of the distribution pipe and the second inner tube 244 of the evaporation crucible does not affect the functionality of the evaporation source 100. In this part of the evaporation source there is no opening to the outside of the evaporation source. Each of the first and second inner tubes is hermetically closed at this end. The first and second inner tubes show openings at their opposite ends for mounting the heating elements 715, 725 in the first and second inner tubes. By joining the open end of the first inner tube 232 to the closure plate 236 in a non-detachable manner as described above, there are no slits, gaps or openings to the outside of the evaporation source 100. The same applies to the second inner tube 244 at the bottom plate 242 of the evaporation crucible 104.

  According to yet further embodiments, the first inner tube 232 of the distribution pipe 106 and the second inner tube 244 of the evaporating crucible 104 may be welded or any of the above-described options to form one single piece, for example. It can be joined together in a non-detachable manner, such as by other suitable means. When both are formed, the first and second inner tubes, as a single piece, can be split and routed by welding, soldering, or another non-removable method without having one further assembly operation. There is a possibility of joining it to each evaporating crucible. Alternatively, the inner tubes 232 and 244 can be made as one single piece. This combined inner tube can be welded onto the closure plate 236, outer tubes 234 and 248 and the bottom plate 242 to form the evaporation source 100 as one single piece.

  The above-described embodiments provide a closed evaporation space with no openings such as slits or gaps, except for the intended openings for filling the evaporation material 240 in the distribution pipe 106 or the evaporation crucible 104, respectively. An evaporation source 100 made from parts is provided. In addition, there are one or more openings or nozzles for directing the vapor to the substrate.

  FIG. 4 shows a schematic top cross-sectional view of an array of two evaporation sources or two evaporation tubes, respectively, according to embodiments described herein. The distribution pipe 106 provides a radiation source. The inner tube 232 can be disposed in the outer tube 234 of the distribution pipe 106. For example, a plurality of openings such as nozzles and / or outlets 712 are arranged along at least one line. According to alternative embodiments, one elongated opening extending along at least one line can be provided on each distribution pipe 106. For example, the elongated opening can be a slit. According to some embodiments, which can be combined with other embodiments described herein, these lines extend essentially vertically, ie along lines extending in the drawing plane in FIG. . As can be seen from FIG. 4, the opening and / or outlet 712, such as the nozzle of each distribution pipe, is provided with the evaporation direction of one or more openings and / or discharge openings 712 along the length of each distribution pipe. It arrange | positions so that it may incline with respect to a symmetry plane. The tilt angle contacts each other when the center of the beam of evaporating material covers the distance between the opening or nozzle and the substrate 121 which can be located at a distance D relative to the opening of the distribution pipe 106 or the nozzle array. Can be adapted. According to embodiments that can be combined with other embodiments described herein, the substrate 121 can be held in a fixed position and the array of distribution pipes 106 is provided by a linear guide 220. Move along a transport line parallel to

  The distance D between the substrate and the opening of the distribution pipe 106 or the nozzle may be 500 mm or less, for example, 145 mm or less. For example, the distance D can be 50 to 1000 mm, particularly 50 to 500 mm.

  FIG. 5A shows a cross section of the distribution pipe 106. The distribution pipe 106 has walls 322, 326, and 324 that surround the internal cavity space 710. The inner tube 232 is disposed in the outer tube. The wall 322 is provided on the outlet side of the evaporation crucible where the outlet 712 is provided. According to some embodiments that can be combined with other embodiments described herein, the outlet 712 can be provided by a nozzle 312. The distribution pipe cross section can be essentially triangular, i.e. the main part of the distribution pipe corresponds to the triangular part, and the distribution pipe cross section has rounded and / or cut corners. It can be a triangle. As shown in FIG. 5A, for example, the triangular corners on the outlet side are cut.

  The width on the outlet side of the distribution pipe, for example, the dimension of the wall 322 in the cross section shown in FIG. Further, other dimensions of the cross section of the distribution pipe 106 are indicated by arrows 354 and 355. According to the embodiments described herein, the outlet side width of the distribution pipe is 30% or less of the maximum cross-sectional dimension, for example, larger dimensions than those indicated by arrows 354 and 355. 30%. Considering this, the outlet 712 of the adjacent distribution pipe 106 can be provided with a smaller distance. Shorter distances improve the mixing of metal materials that evaporate next to each other. This can be better understood with reference to FIGS. 5C, 9A, 9B, 10A, and 10B. Still further or alternatively, apart from the improved mixing of the metal material, the width of the wall facing the deposition area or substrate respectively can be reduced essentially in parallel. Thus, for example, the surface area of walls facing the deposition area or substrate, respectively, essentially in parallel, such as walls 322, can be reduced. This reduces the thermal load provided to the mask or substrate that is slightly supported in or prior to the deposition area.

According to some embodiments, which can be combined with other embodiments described herein, the length of the distribution pipe and the area of all outlets of the distribution pipe divided by the hydraulic diameter of the distribution pipe product, i.e., the value calculated by the formula ^N * ^a * L / D is, 7000 mm ² or less, for example, can be from 1000 mm ² and 5000 mm ^2. In this equation, N is the number of outlets in the distribution pipe, A is the cross-sectional area of one outlet, L is the length of the distribution pipe, and D is the hydraulic diameter of the distribution pipe. is there.

  FIG. 5B shows further details of the distribution pipe 106 according to some embodiments described herein. The heating element may be an electric heater disposed inside the inner tube 232 of the distribution pipe 106 and inside the inner tube 244 of the evaporation crucible 104. For example, the heating element can be provided by a heating wire, such as a coated heating wire, fastened to the inner tube 232 or 244 or otherwise secured.

  Two or more heat shields 372 are respectively provided around the pipe of the distribution pipe 106 or the outer tube of the distribution pipe. For example, the heat shields 372 can be spaced from each other. A protrusion 373 that can be provided as a spot on one of the heat shields separates the heat shields from one another. Thus, a stack of heat shields 372 is provided. For example, two or more heat shields can be provided, for example, 5 or more heat shields, or indeed 10 heat shields. According to some embodiments, this stack is designed to compensate for the thermal expansion of the source during the process, so the nozzle is never blocked. According to further embodiments that can be combined with other embodiments described herein, the outermost shield can be water cooled.

  As exemplarily shown in FIG. 5B, a nozzle 312 is provided in the outlet 712 shown in the cross section shown in FIG. 5B. The nozzle 312 extends through the heat shield 372. Thereby, since the nozzle guides the metal material through the stack of the heat shield, condensation of the metal material at the heat shield can be reduced. The nozzle can be heated to a temperature similar to the temperature inside the distribution pipe 106. To improve heating of the nozzle 312, for example, for the example shown in FIG. 6, a nozzle support portion 412 can be provided that is in contact with the heated wall of the distribution pipe.

  FIG. 5C shows an embodiment in which two distribution pipes are provided next to each other. Therefore, an evaporation source having a distribution pipe arrangement as shown in FIG. 5C can evaporate two metal materials adjacent to each other. Thus, such an evaporation source can also be referred to as an evaporation source array. As shown in FIG. 5C, the cross-sectional shape of the distribution pipe 106 allows the outlets or nozzles of adjacent distribution pipes to be placed close to each other. According to some embodiments, which can be combined with other embodiments described herein, the first outlet or nozzle of the first distribution pipe and the second discharge of the second distribution pipe. The outlet or nozzle can have a distance of 25 mm or less, such as a distance of 5 mm to 25 mm. More specifically, the distance of the first outlet or nozzle to the second outlet or nozzle can be 10 mm or less.

  According to further embodiments that can be combined with other embodiments described herein, the tube of nozzle 312 can be extended. Considering the small distance between the distribution pipes, extending the pipes in such a way can be trivial to avoid internal clogging or condensation. The tube extension can be designed such that two sources or even three sources can be provided in a straight line on top of each other, i.e. along a distribution tube extension which can be a vertical extension. This special design allows even two or three source nozzles to be aligned on a small tube extension, thus achieving perfect mixing.

  FIG. 5C further illustrates the reduced heat load according to embodiments described herein. A deposition area 312 is shown in FIG. 5C. Typically, the substrate can be provided in a deposition area for deposition of a metallic material on the substrate. The angle 395 between the sidewall 326 and the deposition area 312 is shown in FIG. 5C. As can be appreciated, the sidewall 326 is inclined at a relatively large angle so that the heat radiation that may occur regardless of the heat shield and cooling elements is not radiated directly toward the deposition area. According to some embodiments, which can be combined with other embodiments described herein, the angle 395 can be 15 degrees or more. Accordingly, the dimension or area indicated by arrow 392 is significantly smaller than the dimension or area indicated by arrow 394. The dimension indicated by arrow 392 is such that the surface facing the deposition area is essentially parallel to distribution pipe 106, or has an angle of 30 degrees or less, or 15 degrees or less. This corresponds to the cross-sectional dimension of the distribution pipe 106. The corresponding area, that is, the area that provides a direct thermal load to the substrate, is the dimension shown in FIG. 5C multiplied by the length of the distribution pipe. The dimension indicated by the arrow 394 is the projection on the deposition area 312 of the entire evaporation source at each cross section. The corresponding area, ie the area of the projected shadow on the surface of the deposition area, is the dimension shown by FIG. 5C (arrow 394) multiplied by the length of the distribution pipe. According to embodiments described herein, which can be combined with other embodiments described herein, the area indicated by arrow 392 is 30% compared to the area indicated by arrow 394 or May be less. In view of the above, the shape of the distribution pipe 106 reduces the direct heat load released towards the deposition area. Therefore, the temperature stability of the substrate and the mask provided in front of the substrate can be improved.

  FIG. 6 illustrates a further optional variation of the evaporation source according to embodiments described herein. FIG. 6 shows a cross section of the distribution pipe 106. The wall of the distribution pipe 106 surrounds the internal cavity space 710. The inner tube 232 is disposed in the outer tube. Steam can exit the cavity space through nozzle 312. To improve heating of the nozzle 312, a nozzle support portion 412 is provided that is in contact with the heated wall of the distribution pipe 106. The outer shield 402 surrounding the distribution pipe 106 is a cooling shield for further reducing the heat load. In addition, cooling shields 404 are provided to further reduce each thermal load toward the deposition area of the substrate.

  According to some embodiments, which can be combined with other embodiments described herein, the cooling shield is a conduit for a cooling fluid, such as water, attached to the shield or provided within the shield. It can provide as a metal plate which has. Additionally or alternatively, thermoelectric cooling means or other cooling means can be provided to cool the cooling shield. Typically, the outer shield, i.e., the outermost shield surrounding the inner cavity space of the distribution pipe, can be cooled.

  FIG. 6 illustrates a further aspect that can be provided by some embodiments. A shaper shield 405 is shown in FIG. The shaper shield typically extends from a portion of the evaporation source toward the substrate or deposition area. Therefore, the direction of steam passing through the outlet and exiting one or more distribution pipes can be controlled, i.e. the angle of steam discharge can be reduced. According to some embodiments, at least a portion of the metallic material that evaporates through the outlet or nozzle is blocked by the shaper shield. With such an arrangement, the width of the emission angle can be controlled. According to some embodiments, the shaper shield 405 can be cooled to the same extent as the cooling shields 402 and 404 to further reduce the thermal radiation emitted towards the deposition area.

  FIG. 7A shows a part of the evaporation source. According to some embodiments, which can be combined with other embodiments described herein, the evaporation source or evaporation source array is a vertical linear source. Thus, the three outlets 712 are part of the vertical outlet array. FIG. 7A shows a stack of heat shields 572 that can be attached to the distribution pipe by a securing element 573, such as, for example, a screw or the like. Further, the outer shield 404 is a cooling shield having a further opening provided therein. According to some embodiments, which can be combined with other embodiments described herein, the outer shield design can be configured to allow thermal expansion of the components of the evaporation source. In this case, when the operating temperature is reached, the opening maintains alignment with the nozzle of the distribution pipe or reaches alignment with the nozzle of the distribution pipe. FIG. 7B shows a side view of the cooling outer shield 404. The cooling outer shield can essentially extend along the length of the distribution pipe. Alternatively, two or three cooling outer shields can be provided next to each other so as to extend along the length of the distribution pipe. The cooling outer shield is attached to the evaporation source by a fixing element 502 such as, for example, a screw, where the fixing element is essentially the center of the distribution pipe (± 10% or ± 20 along the length extension). %). When the distribution pipe is thermally expanded, the length of the portion of the outer shield 404 that is exposed to the thermal expansion is reduced. The opening 531 of the outer shield 404 can be circular when approaching the fixed element 502 and can have an elliptical shape when the distance from the fixed element is increased. According to some embodiments, the length of the opening 531 in a direction parallel to the longitudinal axis of the evaporator tube may increase as the distance from the fixed element increases. Typically, the width of the opening 531 in a manner perpendicular to the vertical axis of the evaporator tube can be constant. In view of the above, the outer shield 404 may extend particularly when thermally expanded along the longitudinal axis of the evaporator tube, and increasing in dimension parallel to the longitudinal axis of the evaporator tube compensates for thermal expansion or at least partially. There is a possibility of compensation. Thus, the evaporation source can be operated over a wide temperature range without an opening in the outer shield 404 that blocks the nozzle.

  FIG. 7C illustrates further optional features of the embodiments described herein that can be provided for other embodiments described herein as well. FIG. 7C shows a side view from the side of the wall 322 (see FIG. 5A) when a shield 572 is provided on the wall 322. In addition, a sidewall 326 is shown in FIG. 7C. As can be seen from FIG. 7C, shields 572 or shields in the stack of shields are segmented along the length of the evaporation pipe. The length of the shield portion may be 200 mm or less, such as 120 mm or less, 60 mm to 100 mm, etc. Thus, the length of the shield portion, eg, the stack of shields, is shortened to reduce its thermal expansion. Thus, the nozzle can be extended therethrough, and the alignment of the opening in the shield corresponding to the outlet 712 is of little importance.

  According to further embodiments that can be combined with other embodiments described herein, two or more heat shields 372 are provided around the inner cavity space 710 of the distribution pipe 106 and the heated portion. Accordingly, heat radiation from the heated portion of the distribution pipe 106 toward another portion of the substrate, mask or deposition apparatus can be reduced. As one example, as shown in FIG. 7A, more layers of heat shield 572 can be provided on the side where an opening or outlet is provided. A stack of heat shields is provided. According to exemplary embodiments that can be combined with other embodiments described herein, the heat shields 372 and / or 572 are spaced from each other by about 0.1 mm to 3 mm. According to some embodiments, which can be combined with other embodiments described herein, the stack of heat shields can have a thermal expansion of the source during processing, as described with respect to FIGS. 7A-7C. It is designed to compensate for this so that the nozzle is never blocked. In addition, the outermost shield can be cooled, for example, water cooled. Thus, according to some embodiments, the outer shield 404, particularly with openings provided on its sides, can be, for example, a cooling shield with conical openings provided therein. Thus, such a device allows temperature stability with a ΔT shift of 1 ° C., even if the nozzle has a temperature of about 1300 ° C.

  FIG. 8 shows a further view of the evaporation source 100. An evaporation crucible 104 is provided for evaporating the metal material. A second heating element is provided in the second inner tube 244 to heat the evaporation crucible 104 (both not shown in FIG. 8). The distribution pipe 106 is in fluid communication with the evaporation crucible so that the metal material evaporated in the evaporation crucible can be distributed into the distribution pipe 106. The evaporated metal material exits the distribution pipe 106 through an opening (not shown in FIG. 8). The evaporation crucible 106 has a side wall 326, a wall 324 that faces the wall on the outlet side, and an upper wall 325. The upper wall 325 and the first inner tube 232 are joined by welding or the like so that an opening such as a slit or a gap is not provided. The first heating element (not shown in FIG. 8) is disposed in the first inner tube 232 of the distribution pipe 106. According to some embodiments, which can be combined with other embodiments described herein, one or more of the evaporation source and / or wall can be made of molybdenum or tantalum, respectively. In particular, the evaporation source and / or one or more of the walls can be made of molybdenum or tantalum. Both sections, the evaporation crucible 104 and the distribution pipe 106 can be heated independently of each other.

  The shield 404 that further reduces heat dissipation towards the deposition area is cooled by a cooling element 680. For example, a conduit can be attached to shield 404 to provide cooling fluid therein. As shown in FIG. 8, a shaper shield 405 can be additionally provided to the cooling shield 404. According to some embodiments, which can be combined with other embodiments described herein, the shaper shield can also be cooled, for example, water cooled. For example, the shaper shield can be attached to a cooling shield or a cooling shield device. The thickness uniformity of the deposited film of metal material can be adjusted on one or more outlets or nozzle arrays that can be placed beside the nozzles and additional shaper shields. By making the source design compact, the source can be moved by a drive mechanism within the vacuum chamber of the deposition apparatus. In this case, all controller, power supply and additional support functions are performed in an atmospheric box attached to the source.

  9A / B shows a further top view including a cross section of the distribution pipe 106. FIG. FIG. 9A shows an embodiment having three distribution pipes 106 provided on the evaporator control housing 702. The evaporator control housing is configured to maintain atmospheric pressure therein and is at least one selected from the group consisting of a switch, a valve, a controller, a cooling unit, a cooling control unit, a heating control unit, a power source, and a measurement device. Configured to house one element. Thus, components for operating the evaporation source of the evaporation source array can be provided in close proximity to the evaporation crucible and distribution pipe at atmospheric pressure and can be moved through the deposition apparatus with the evaporation source.

  The distribution pipe 106 shown in FIG. 9A is heated by a first heating element provided in the first inner tube 232. A cooling shield 402 is provided to surround the distribution pipe 106. According to some embodiments, which can be combined with other embodiments described herein, one cooling shield can surround two or more distribution pipes 106. The metal material that evaporates in the evaporating crucible is distributed to each of the distribution pipes 106 and can exit the distribution pipe through the outlet 712. Typically, the plurality of outlets are distributed along the length of the distribution pipe 106. FIG. 9B shows an embodiment similar to FIG. 9A where two distribution pipes are provided. The outlet is provided by a nozzle 312. Each distribution pipe is in fluid communication with an evaporation crucible (not shown in FIGS. 9A and 9B), where the distribution pipe is non-circular and includes an outlet side provided with one or more outlets. , Having a cross section perpendicular to the length of the distribution pipe, the width of the cross-section outlet being 30% of the maximum cross-sectional dimension or less.

  FIG. 10A shows a further embodiment described herein. Three distribution pipes 106 are provided. The evaporator control housing 702 is provided adjacent to the distribution pipe and connected to the distribution pipe via a thermal insulator 879. As previously described, an evaporator control housing configured to maintain atmospheric pressure therein comprises a group of switches, valves, controllers, cooling units, cooling control units, heating control units, power supplies, and measurement devices. At least one element selected from: In addition to the cooling shield 402, a cooling shield 404 having a sidewall 804 is provided. The cooling shield 404 and sidewall 804 provide a U-shaped cooled heat shield to reduce thermal radiation toward the deposition area, ie, the substrate and / or mask. Arrows 811, 812, and 813 each indicate evaporated metal material exiting the distribution pipe 106. Since the distribution pipes are essentially triangular, the evaporation cones based on the three distribution pipes are close to each other, thus improving the mixing of the metal material from different distribution pipes.

  As further shown in FIG. 10A, a shaper shield 405 is provided, for example, attached to the cooling shield 404 or as part of the cooling shield 404. According to some embodiments, the shaper shield 405 can also be cooled to further reduce the heat load released towards the deposition area. The shaper shield delimits a distribution cone of metal material distributed toward the substrate, i.e., the shaper shield is configured to block at least a portion of the metal material.

  FIG. 10B shows a cross-sectional view of yet another evaporation source, according to embodiments described herein. Three distribution pipes are shown, and each distribution pipe is heated by a heating element (both not shown in FIG. 10B) provided on the inner tube. Vapor generated in an evaporation crucible (not shown) exits the distribution pipe through nozzles 312 and 612, respectively. In order to position the nozzle outlets 712 closer together, the outer nozzle 612 includes a tube extension that includes a short tube extending toward the nozzle tube of the central tube. According to some embodiments, the tube extension 612 can have a bend of 60 degrees to 120 degrees, such as 90 degrees. The plurality of shields 572 are provided on the outlet side wall of the evaporation source. For example, at least five, or even at least seven shields 572 are provided on the outlet side of the evaporator tube. The shield 402 is provided with one or more distribution pipes, and a cooling element 822 is provided there. A plurality of shields 372 are provided between the distribution pipe and the shield 402. For example, at least two, or even at least five shields 372 are provided between the evaporation tube and the shield 402. The plurality of shields 572 and the plurality of shields 372 are provided as a stack of shields, for example, the shields are spaced from each other by 0.1 mm to 3 mm.

  According to further embodiments that can be combined with other embodiments described herein, additional shields 812 can be provided between the distribution pipes. For example, the additional shield 812 can be a cooling shield or a cooling lug. With such a further shield, the temperature of the distribution pipes can be controlled independently of each other. For example, when different materials evaporate through adjacent distribution pipes, these materials may need to be evaporated at different temperatures. Thus, additional shields 812, such as cooling shields, can reduce crosstalk between distribution pipes in the evaporation source or evaporation source array.

  The embodiments described herein are most relevant to an evaporation source and an evaporation apparatus for depositing a metal material on a substrate, while the substrate is oriented essentially vertically. A deposition system comprising several deposition devices for coating several layers of organic or metallic material on a substrate for the production of OLEDs, especially on a substrate for OLED manufacturing, due to the essentially vertical substrate orientation A small footprint is possible. The apparatus described herein is configured for large area substrate processing or processing of multiple substrates in a large area carrier. Vertical orientation further allows for good and scalable substrate size generation, ie good scalability for current and future glass sizes. However, an evaporation source with improved cross-sectional shape and the concept of heat shield and cooling element can also be provided for material deposition on a horizontal substrate.

  FIGS. 11A and 11B show a further embodiment of the deposition apparatus 500. FIG. 11A shows a schematic top view of the deposition apparatus 500. FIG. 11B shows a schematic side cross-sectional view of the deposition apparatus 500. The deposition apparatus 500 includes a vacuum chamber 110. For example, a valve 205, such as a gate valve, allows a vacuum seal to an adjacent vacuum chamber. The valve can be opened for transfer of the substrate 121 or mask 132 into or out of the vacuum chamber 110. Two or more evaporation sources 100 are provided in the vacuum chamber 110. The example shown in FIG. 11A shows seven evaporation sources. According to exemplary embodiments that can be combined with other embodiments described herein, two evaporation sources, three evaporation sources, or four evaporation sources can be advantageously provided. Also, maintenance logistics for a limited number of evaporation sources (eg, 2 to 4) may be easier compared to the multiple evaporation sources that may be provided by some embodiments. Thus, the cost of ownership can be better for such a system.

  According to some embodiments, which can be combined with other embodiments described herein, a looped track 530 can be provided for the example shown in FIG. 11A. The looped track 530 can include a straight portion 534 and a curved portion 533. The looped track 530 provides translational movement of the evaporation source and rotation of the evaporation source. As mentioned above, the evaporation source can typically be a radiation source, such as a linear vapor distribution showerhead.

  According to some embodiments, which can be combined with other embodiments described herein, a loop track is used to move one or more evaporation sources along the loop track. Includes rail device, roller device or magnetic guide.

  Based on the looped trajectory 530, the source row can move in translation along the substrate 121, typically masked by the mask 132. The curved portion 533 of the loop-shaped track 530 rotates the evaporation source 100. In addition, a curved portion 533 can be provided to position the evaporation source in front of the second substrate 121. A further straight portion 534 of the looped track 530 provides further translational movement along the further substrate 121. As mentioned above, according to some embodiments, which can be combined with other embodiments described herein, the substrate 121 and optionally the mask 132 remain essentially stationary during deposition. . A source, eg, an evaporation source that provides multiple sources in an essentially vertical orientation of the line, is moved along a stationary substrate.

  According to some embodiments, which can be combined with other embodiments described herein, the substrate 121 shown in the vacuum chamber 110 is further driven by a substrate support having rollers 403 and 424. In the stationary deposition position, it can be supported by the substrate support 126 connected to the alignment unit 112. The alignment unit 112 can adjust the position of the substrate 121 with respect to the mask 132. Thus, the substrate can be moved relative to the mask 132 to provide accurate alignment between the substrate and the mask during the deposition of the metal material. According to further embodiments that can be combined with other embodiments described herein, alternatively or additionally, the mask 132 and / or the mask frame 131 holding the mask 132 may be attached to the alignment unit 112. Can be combined. Either the mask can be positioned relative to the substrate 121, or both the mask 132 and the substrate 121 can be positioned relative to each other.

  The embodiment shown in FIGS. 11A and 11B shows two substrates 121 provided in the vacuum chamber 110. However, particularly for embodiments including a row of evaporation sources 100 in a vacuum chamber, at least three substrates or at least four substrates can be provided. In this way, sufficient time for the exchange of substrates, i.e. transfer of a new substrate to the vacuum chamber and transfer of the processing substrate from the vacuum chamber, can be achieved with a large number of evaporation sources and hence higher throughput. Even a deposition apparatus 500 can be provided.

  FIG. 11A and FIG. 11B show a first transport track for the first substrate 121 and a second transport track for the second substrate 121. A first roller assembly is shown on one side of the vacuum chamber 110. The first roller assembly includes a roller 424. In addition, the transport system includes a magnetic guide element 524. Similarly, a second transport system having rollers and magnetic guide elements is provided on the opposite side of the vacuum chamber. The upper part of the carrier 421 is guided by a magnetic guiding element 524. Similarly, according to some embodiments, the mask frame 131 can be supported by a roller 403 and a magnetic guide element 503.

  FIG. 11B exemplarily shows two supports 102 provided on each straight portion 534 of the looped track 530. The evaporation crucible 104 and the distribution pipe 106 are supported by the respective supports 102. FIG. 7B shows two distribution pipes 106 supported by the support 102. The support 102 is shown as being guided on a straight portion 534 of the looped track. According to some embodiments, which can be combined with other embodiments described herein, the actuator, driver, motor, driver belt, and / or driver chain are along a looped track, i.e. Support 102 may be provided to move along a straight portion 534 of the looped track and along a curved portion 533 of the looped track (see FIG. 11A).

  According to embodiments of the deposition apparatus described herein, a combination of translation of a source, such as a linear vapor distribution showerhead, and rotation of a source, such as a linear vapor distribution showerhead, for example, High evaporation source efficiency and high material utilization for display manufacture are possible, in which case high precision substrate masking is desired. The translational movement of the source allows high masking accuracy because the substrate and mask can remain stationary. The rotational movement allows for substrate exchange of one substrate, while another substrate is coated with material. This improves the material utilization because the idle time, i.e. the time for the evaporation source to evaporate the material without coating the substrate, is significantly reduced.

Embodiments described herein relate specifically to the deposition of metallic materials, for example, on large area substrates for OLED display manufacturing. According to some embodiments, a large-area substrate, or one or more carriers for supporting the substrate, i.e., large area carrier may have a size of at least 0.174M ² or at least 1.4 m ^2. Typically, the carrier size can be from about 1.4 m ² to about 8 m ² , more typically from about ² m ² to about 9 m ² , or even 12 m ² . Typically, a rectangular area is provided for a large area substrate as described herein, where the substrate is supported and a holding arrangement, apparatus and method according to embodiments described herein are provided. A carrier having a size. For example, a large area carrier that would correspond to the area of a single large area substrate, corresponding to the substrate of about ^{1.4m 2 (1.1m × 1.3m) GEN5} , about 4.29M ² substrate ( GEN 7.5 corresponding to 1.95 m × 2.2 m), GEN 8.5 corresponding to about 5.7 m ² substrate (2.2 m × 2.5 m), or about 8.7 m ² substrate (2.85 m) GEN10 corresponding to x3.05 m). Larger generations such as GEN11 and GEN12 and corresponding substrate areas can be implemented as well. According to an exemplary embodiment that can be combined with other embodiments described herein, the thickness of the substrate can be 0.1 to 1.8 mm, and the holding device, in particular the holding device, Can be adapted to the thickness of such a substrate. However, in particular the thickness of the substrate can be about 0.9 mm or less, such as 0.5 mm or 0.3 mm, etc., and the holding device, and in particular the holding device, is adapted to the thickness of such a substrate. Is done. Typically, the substrate can be made from any material suitable for material deposition. For example, the substrate is a group consisting of glass (eg, soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, composite material, carbon fiber material, or any other material or combination of materials that can be coated by a deposition process. Can be made from materials selected from

  In order to achieve good reliability and yield rates, the embodiments described herein keep the substrate stationary during the deposition of the metal material. A movable linear source is provided for uniform coating of large area substrates. After each deposition, the substrate needs to be replaced, and idle time is reduced compared to operations involving a new alignment process of the mask and substrate relative to each other. During idle time, the source is wasting material. Thus, having a second substrate that is easily aligned with the mask at the deposition location reduces idle time and increases material utilization.

  Embodiments described herein allow the mask to be held at an essentially constant temperature that is in a temperature range of 5 ° C. or less, or even in a temperature range of 1 ° C. or less. An evaporation source (or evaporation source array) is further provided that has reduced thermal radiation towards the deposition area, i.e. the substrate and / or mask, as possible. Furthermore, the outlets of adjacent distribution pipes can be provided close to each other, for example, at a distance of 25 mm or less, so the shape of the distribution pipe (single or multiple) with a small width on the discharge side. However, it reduces the thermal load on the mask and further improves the mixing of different metallic materials.

  According to exemplary embodiments that can be combined with other embodiments described herein, the evaporation source includes at least one evaporation crucible and at least one distribution pipe, eg, at least one linear vapor distribution shower. Including the head. However, the evaporation source can include two or three, finally four or five evaporation crucibles and corresponding distribution pipes. With the evaporation source including at least two of several distribution pipes, different metal materials can be evaporated in at least two of several crucibles, and thus different metal materials are One metal layer or metal alloy layer is formed on the substrate. Additionally or alternatively, similar metal materials can be evaporated in at least two of several crucibles, thus increasing the deposition rate.

  According to embodiments described herein, an evaporation source, a deposition apparatus, a method of operating an evaporation source and / or a deposition apparatus, and a method of manufacturing an evaporation source and / or deposition apparatus are configured for vertical deposition. That is, the substrate is supported in an essentially vertical orientation (eg, vertical ± 10 degrees) during layer deposition. Further, by a combination of rotation of the source, translation and evaporation direction, in particular rotation about an axis that is essentially perpendicular, eg, an axis that is parallel to the substrate orientation and / or the line extension direction of the source. %, Or higher material utilization is possible. This is an improvement of at least 30% compared to other systems.

  A movable and rotatable evaporation source in the processing chamber, i.e. in the vacuum chamber for layer deposition therein, allows for continuous or nearly continuous coating with high material utilization. In general, the embodiments described herein provide high deposition source efficiency (greater than 85%) by using a scan source approach with a 180 degree swivel mechanism to coat two substrates alternately. And enables high material utilization (over 50%). The source efficiencies described herein take into account the material loss that results from the vapor beam spreading over the size of the large area substrate to allow uniform coating of the entire area of the substrate to be coated. . The material utilization further takes into account losses that occur during the idle time of the evaporation source, i.e. during the time when the evaporation source cannot deposit the evaporated material on the substrate.

  Still further, according to embodiments described herein with respect to vertical substrate orientation, a small footprint of the deposition apparatus, and in particular, several deposition apparatuses for coating several layers of organic and metallic materials on the substrate. Enables a small footprint of the deposition system including. The apparatus described herein is configured for large area substrate processing or processing of multiple substrates in a large area carrier. Vertical orientation further allows for good and scalable substrate size generation, ie good scalability for current and future glass sizes.

  FIG. 12 shows a flowchart of a method 700 for depositing a metal material, such as a metal or metal alloy, with distribution pipes according to embodiments described herein. The distribution pipe can be placed in a vacuum tool for manufacturing organic light emitting diodes (OLEDs).

  According to aspects of the present disclosure, the method 700 includes, at block 710, evaporating a first metal or metal alloy with a first evaporation source. According to some embodiments, the method 700 further includes a block 720 that evaporates a second metal or metal alloy with a second evaporation source. According to embodiments described herein, the method 700 further includes, at block 730, forming a layer comprising a first metal or metal alloy evaporated on a first evaporation source on a substrate. According to an alternative embodiment described herein, block 730 of method 700 describes forming a layer comprising a second metal or metal alloy evaporated on a second evaporation source on a substrate. ing. According to yet another embodiment, block 730 of method 700 includes a layer comprising a mixture of a first metal or metal alloy and a second metal or metal alloy evaporated respectively with a first and second evaporation source. Is further formed on the substrate. According to an embodiment, the evaporated material of the first evaporation source may be silver (Ag). According to another embodiment, the evaporated material of the second evaporation source can be magnesium (Mg). The evaporated material of the first evaporation source, for example Ag, and the evaporated material of the second evaporation source, for example Mg, have a ratio of 1: 2 ≦ Ag: Mg ≦ 7: 1, in particular 1: 1 ≦ Ag: Evaporation can be performed at a ratio of Mg ≦ 7: 1, more specifically at a ratio of 1: 1 ≦ Ag: Mg ≦ 5: 1.

  According to the embodiments described herein, the substrate is coated with a metallic material in an essentially vertical position. The distribution pipe provides a source that extends essentially vertically. According to embodiments described herein, which can be combined with other embodiments described herein, essentially vertical refers to 20 ° or less, particularly when referring to substrate orientation, for example, It is understood that a deviation from the vertical direction of 10 ° or less is allowed. This deviation from the vertical direction can be used to reduce particle generation on the substrate or the layer deposited thereon. According to different embodiments that can be combined with other embodiments described herein, the evaporation source can be provided in a vacuum chamber on a track, such as a loop track or a linear guide. The linear guide trajectory is configured for the translational movement of the evaporation source. Drivers for translational motion can be provided in the evaporation source, in a trajectory or linear guide, in a vacuum chamber, or a combination thereof.

  While the above is directed to embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope of the invention is as follows: Determined by the claims.

Claims (15)

An evaporation source for a metal or metal alloy,
An evaporation crucible configured to evaporate the metal or metal alloy;
A distribution pipe having one or more outlets provided along the length of the distribution pipe, the distribution pipe being in fluid communication with the evaporating crucible,
The distribution pipe includes a first outer tube and a first inner tube;
An evaporation source, wherein the distribution pipe and the evaporation crucible are provided as one single piece.   The evaporation source according to claim 1, wherein the evaporation crucible further comprises a second outer tube and a second inner tube.   The evaporation source of claim 2, wherein the second outer tube and the second inner tube of the evaporation crucible are provided as part of the one single piece.   The evaporation source of claim 3, wherein the single part is provided by welding or sintering.   The distribution pipe further includes a first heating element disposed inside the first inner tube, and / or a second crucible is disposed inside the second inner tube. The evaporation source according to claim 1, further comprising: a heating element.   The evaporation source according to claim 1, wherein the evaporation crucible and the distribution pipe are made of molybdenum or tantalum.   The evaporation source according to any one of claims 1 to 6, wherein the one or more discharge ports are nozzles extending along an evaporation direction.   The evaporation source according to claim 7, wherein the evaporation direction is essentially horizontal.   The distribution pipe is a steam distribution showerhead including the one or more outlets, and in particular the vapor distribution showerhead is a linear steam distribution showerhead that provides a linear source for the metal or metal alloy vapor. The evaporation source according to any one of claims 1 to 8, wherein:   The evaporation source according to any one of claims 1 to 9, wherein the distribution pipe comprises an opening that can be sealed with a screw or bolt for filling the evaporation source or the evaporation material into the crucible. An evaporation source array for a metal or metal alloy comprising:
The first evaporation source according to any one of claims 1 to 10,
And at least a second evaporation source according to any one of claims 1 to 10,
At least a first outlet of the one or more outlets of the first evaporation source and at least a second outlet of the one or more outlets of the second evaporation source are 25 mm or less. An evaporation source array having a distance. The distribution pipe is rotatable around the axis during evaporation,
One or more supports for the distribution pipe, connectable to a first driver or including the first driver, wherein the first driver includes the one or more supports and the distribution pipe. The evaporation source array of claim 11, further comprising a support configured for translational movement of the evaporation source.   The method of operating an evaporation source array according to claim 11 or 12, wherein the evaporated material of the first evaporation source is Ag and the evaporated material of the second evaporation source is Mg.   The evaporation source according to claim 13, wherein the evaporated material of the first evaporation source and the evaporated material of the second evaporation source evaporate in a ratio of 1: 1≤Ag: Mg≤7: 1. How to manipulate the array.   The distribution pipe has a non-circular cross section perpendicular to the length of the distribution pipe, and has a main part corresponding to a part of a triangle, in particular the cross section perpendicular to the length of the distribution pipe The evaporation source according to any one of claims 1 to 10, wherein is a triangle with rounded corners and / or cut corners.

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