JP2018186264A - Light emitting device and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device capable of further increasing a luminous flux and a method for manufacturing the same. A light emitting element (1), a light emitting member (2) provided on an upper surface of the light emitting element (1), and a light reflecting covering member (3) covering a side surface of the light emitting element (1) and a side surface of the light emitting member (2). In the apparatus, the covering member 3 covers the side surface of the light emitting element 1 and the side surface of the translucent member 2, and includes a first light reflecting material and a fluorine-based first resin, and a first covering member 3a and a first. A light emitting device that covers a covering member 3a and includes a second light reflecting material and a second covering member 3b containing a second resin. In this light emitting device, it is preferable that the difference in refractive index between the first light reflector and the first resin is larger than the difference in refractive index between the second light reflector and the second resin. [Selection diagram] FIG. 1B

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

2. Description of the Related Art Conventionally, in a light-emitting device, a light-reflecting material disposed around a light-emitting element has been made of a resin obtained by adding a light-reflective filler to a light-transmitting resin (Patent Document 1). ).
In addition, a light-emitting device is described in which a package is formed using a resin material containing 46% by weight or more of a light-reflective filler in a resin, and an LED is mounted in a recess of the package (Patent Document 2). Therefore, a light emitting device having excellent light extraction efficiency is demanded.

JP 2012-243822 A JP 2010-047773 A

  An object of this invention is to provide the light-emitting device which was more excellent in light extraction efficiency, and its manufacturing method.

One embodiment of the present invention
A light emitting element;
A translucent member provided on the upper surface of the light emitting element;
A light-emitting device comprising: a light-reflective coating member that covers a side surface of the light-emitting element and a side surface of the translucent member;
The covering member covers a side surface of the light emitting element and a side surface of the translucent member, covers a first covering member including a first light reflecting material and a fluorine-based first resin, and the first covering member, A second covering member including a second light reflecting material and a second resin, wherein a difference in refractive index between the first light reflecting material and the first resin is a difference in refractive index between the second light reflecting material and the second resin. Larger light emitting device.
Other embodiments of the invention include:
A light emitting element;
A translucent member provided on the upper surface of the light emitting element;
A light-emitting device comprising: a light-reflective coating member that covers a side surface of the light-emitting element and a side surface of the translucent member;
The covering member covers a side surface of the light emitting element and a side surface of the translucent member, covers a first covering member including a first light reflecting material and a fluorine-based first resin, and the first covering member, And a second covering member including a second light reflecting material and a second resin.
Yet another embodiment of the present invention provides:
A first mixture containing a first light reflecting material and a fluorine-based first resin is disposed around the light emitting element,
Heating the first mixture to form a first covering member in contact with the light emitting element;
A method for manufacturing a light-emitting device, comprising filling a second mixture containing a second light reflecting material and a second resin around the first covering member to form a second covering member that covers the first covering member. It is.

  According to one embodiment of the present invention, it is possible to provide a light emitting device that realizes further increase in luminous flux and a method for manufacturing the same.

It is a schematic plan view of the light-emitting device of this Embodiment. It is a schematic sectional drawing in the IB-IB line | wire of FIG. 1A. It is an enlarged view of the principal part of FIG. 1B. It is a schematic sectional process drawing for demonstrating the manufacturing method of the light-emitting device of FIG. 1A. It is a schematic sectional process drawing for demonstrating the manufacturing method of the light-emitting device of FIG. 1A. It is a schematic sectional process drawing for demonstrating the manufacturing method of the light-emitting device of FIG. 1A. It is a schematic sectional process drawing for demonstrating the manufacturing method of the light-emitting device of FIG. 1A.

  In the present application, the size and positional relationship of members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, the same name and code | symbol show the same or the same member in principle.

[Light Emitting Device 10]
For example, as illustrated in FIGS. 1A and 1B, the light emitting device 10 according to the present embodiment includes a light emitting element 1, a translucent member 2 provided on an upper surface of the light emitting element 1, a side surface of the light emitting element 1, and a translucent member 2. And a light-reflective coating member 3 that covers the side surfaces of the glass plate. Here, the upper surface means a light extraction surface of the light emitting element. The covering member covers the side surface of the light emitting element and the side surface of the translucent member, covers the first covering member including the first light reflecting material and the fluorine-based first resin, the first covering member, and the second covering member. A second covering member including a light reflecting material and a second resin. The refractive index difference between the first light reflecting material and the first resin is preferably larger than the refractive index difference between the second light reflecting material and the second resin.
When the first covering portion including the first light reflecting material and the first resin having a larger refractive index difference covers the side surface of the light emitting element, the second light reflecting material and the second light reflecting material having the smaller refractive index difference than the second light reflecting material and the second light reflecting material. The second covering portion including the resin can more easily reflect the light emitted from the light emitting element than that covering the side surface of the light emitting element. As a result, light leakage from the covering member can be suppressed, and in the light emitting device 10 in which the upper surface of the translucent member 2 is the light extraction surface, a light emitting device with more excellent light extraction efficiency can be obtained.

(Coating member 3)
The covering member 3 covers the side surface of the light emitting element 1 and the side surface of the translucent member 2. The covering member 3 may cover the lower surface of the light emitting element 1.
The covering member 3 preferably has high light reflectivity. For example, the reflectance with respect to light emitted from a light emitting element described later is 60% or more, 70% or more, 75% or more, 80% or more, or 85% or more. It is preferable.

The covering member 3 includes a first covering member 3a including a first light reflecting material and a fluorine-based first resin, and a second covering covering the first covering member 3a and including the second light reflecting material and the second resin. And a member 3b. Then, the refractive index difference between the first light reflecting material and the fluorine-based first resin constituting the first covering member 3a, and the refractive index difference between the second light reflecting material and the second resin constituting the second covering member 3b. It is preferable that the light reflecting material and the resin are combined so as to have a magnitude relationship between them.
The refractive index difference between the first light reflecting material constituting the first covering member 3a and the fluorine-based first resin is larger than the refractive index difference between the second light reflecting material constituting the second covering member 3b and the second resin. It is preferable.

Examples of the first light reflecting material and the second light reflecting material include titanium oxide, zirconia, aluminum oxide, and silicon oxide. These can be used alone or in combination of two or more. The first light reflecting material and the second light reflecting material may be the same in whole or in part, or in whole or in part. These light reflecting materials can be contained in the resin at 5 to 50% by weight. The 1st light reflection material and the 2nd light reflection material may be contained with the same content rate in the 1st coating member 3a and the 2nd coating member 3b, and may be contained with a different content rate. Especially, it is preferable that the content rate of the 1st light reflection material in the 1st coating member 3a is larger than the content rate of the 2nd light reflection material in the 2nd coating member 3b. Thereby, it becomes possible to make the light reflectance in the 1st covering member higher. That is, since more light can be reflected at a position closer to the light source and the light emitting surface in the covering member 3, light leakage from the covering member 3 can be effectively suppressed.
The content of the first light reflecting material in the first covering member 3a is, for example, about 45 to 90% by weight. The content of the second light reflecting material in the second covering member 3b is, for example. It is about 20 to 45% by weight.

  As for 1st resin and 2nd resin, resin itself may have light reflectivity and does not need to have it. Further, it may be a thermoplastic resin or a thermosetting resin. However, it is preferable that both the first resin and the second resin are thermoplastic resins, or that both the first resin and the second resin are thermosetting resins. This is because of the ease of manufacturing the light emitting device.

  The first resin is a fluorine-based resin, that is, a resin containing a fluorine atom, and may be a fully fluorinated resin, a partially fluorinated resin, or a fluorinated resin copolymer as long as it contains a fluorine atom. For example, polytetrafluoroethylene (PTFE), polychlorotrifluoroethylene (PCTFE, CTFE), perfluoroalkoxy fluororesin or a copolymer thereof with perfluoroalkyl vinyl ether, hexafluoropropylene, ethylene, etc., tetrafluoroethylene-6 Propylene fluoride copolymer (FEP), ethylene / tetrafluoroethylene copolymer (ETFE), ethylene / chlorotrifluoroethylene copolymer (ECTFE), polyvinylidene fluoride (PVDF), polyvinyl fluoride (PVF), etc. Is mentioned.

  The second resin may be a fluorine-based resin or may not be a fluorine-based resin. Those known in the art can be used. For example, in addition to the above-mentioned resins containing fluorine atoms, thermosetting resins such as silicone resins, silicone-modified resins, epoxy resins, phenol resins, urethane resins, oxetane resins, acrylic resins, polycarbonates, polyimide resins, polyphthalamides, etc. It is done. The second resin may be the same as the first resin, but is preferably different. Among these, the second resin is more preferably a silicone resin. When a silicone resin is used for the second resin, it is preferable to use a thermosetting resin as the fluorine resin used for the first resin, similar to the silicone resin.

In the first covering member 3a, for example, the refractive index difference between the first resin and the first light reflecting material is preferably 0.4 to 1.4 with respect to light emitted from a light emitting element described later.
In the second covering member 3b, for example, the refractive index difference between the second resin and the second light reflecting material is preferably 0.1 to 1.3 with respect to light emitted from a light emitting element described later.
The refractive index difference in the first covering member 3a is preferably 0.1 to 1.5 larger and more preferably 0.1 to 1.3 larger than the refractive index difference in the second covering member 3b.

Regardless of whether the refractive index difference between the first light reflecting material and the first resin is larger than the refractive index difference between the second light reflecting material and the second resin, the first resin and the second resin are the same resin. The first light reflecting material may be the same light reflecting material as the second light reflecting material. For example, as long as the refractive index difference between the first light reflecting material and the first resin is larger than the refractive index difference between the second light reflecting material and the second resin, the first resin and the second resin are the same. Resin may be sufficient and the 1st light reflection material may be the same light reflection material as a 2nd light reflection material.
In one embodiment, it is preferable that the first light reflecting material and the second light reflecting material are the same material, and the refractive index of the first resin is lower than the refractive index of the second resin.
In another embodiment, the first resin and the second resin may be the same resin, and the refractive index of the first light reflecting material may be lower than the refractive index of the second light reflecting material.

The first covering member 3a preferably covers at least part or all of the side surface of the light emitting element 1 and part or all of the side surface of the translucent member 2, and covers all of these side surfaces. Furthermore, it is preferable that the first covering member 3a covers a part or the whole of the lower surface of the light emitting element. When the planar area of the translucent member 2 is larger than the planar area of the light emitting element as described later, It is preferable that a part of the lower surface of the translucent member is further covered. The coating here may be a coating through another member, but is preferably a coating in contact with the light emitting element.
It is preferable that the 2nd coating | coated member 3b coat | covers the side surface of the light emitting element 1, and the side surface of the translucent member 2 via the 1st coating | coated member 3a. The second covering member 3b preferably further covers a part or the whole of the lower surface of the light emitting element via the first covering member 3a. As described later, the light-transmitting member 2 has a flat area. When it is larger than the plane area of the light emitting element, it is preferable that a part of the lower surface of the translucent member is further covered via the first covering member 3a.

  The first covering member 3a and the second covering member 3b, in particular, the first covering member 3a are mounted so that the upper surface of the mounting substrate is not exposed when the light emitting element is mounted on the mounting substrate, as will be described later. It is preferable that the upper surface of the substrate is in contact with the coating.

As for thickness Ta (FIG. 1) of the 1st coating | coated member 3a which coat | covers the side surface of the translucent member 2, 0.1-50 micrometers is mentioned.
As for thickness Tb (FIG. 1) of the 2nd coating | coated member 3b which coat | covers the side surface of the translucent member 2, 100-1000 micrometers is mentioned. The thickness of the first covering member 3a and the second covering member 3b may be uniform in all, but may be partially thicker or thinner.
The first covering member 3a is preferably thicker. In the light emitting device 10 according to the present embodiment, since the covering member 3 includes the first covering member 3a, it is possible to suppress light incident on the second covering member 3b, and the thickness of the second covering member 3b is made thinner. can do. Furthermore, the luminance difference between the light emitting portion (that is, the upper surface of the light transmitting member 2) and the non-light emitting portion (that is, the upper surface of the covering member 3) on the light emitting surface of the covering member 3 light emitting device 10 can be made clearer.

(Light emitting element 1)
Examples of the light emitting element include a semiconductor light emitting element such as a light emitting diode. The light emitting element 1 includes a semiconductor stacked body and a pair of electrodes. The semiconductor stacked body includes three semiconductor layers, a first conductivity type semiconductor layer (for example, an n-type semiconductor layer), a light emitting layer (active layer), and a second conductivity type semiconductor layer (for example, a p-type semiconductor layer). The semiconductor layer can be formed from a semiconductor material such as a III-V group compound semiconductor or a II-VI group compound semiconductor, for example. Specifically, a nitride-based semiconductor material such as In _X Al _Y Ga _1-XY N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) (for example, InN, AlN, GaN, InGaN, AlGaN, InGaAlN, etc.) ) Can be used. Such a semiconductor laminate is usually a light-transmitting insulating material such as sapphire (Al ₂ O ₃ ) or spinel (MgAl ₂ O ₄ ), or a semiconductor material that transmits light from the semiconductor laminate (for example, (Nitride-based semiconductor material) is formed on a substrate. Ultimately, such a substrate may or may not be removed from the semiconductor stack.

The pair of electrodes may be formed on one surface of the semiconductor stacked body, or may be formed on both surfaces of the semiconductor stacked body. Especially, it is preferable that a pair of electrode is formed in one surface of a semiconductor laminated body. As a result, the entire surface can be bonded to the translucent member with the surface on which the electrode is not disposed as the main light extraction surface, and the light extraction efficiency can be improved. The pair of electrodes can be formed using a good electric conductor, and examples thereof include a single layer film or a laminated film of a metal such as Cu, Au, Ag, Ni, and Sn.
Each of the semiconductor laminate and the electrode can have an arbitrary shape. For example, in a plan view, a circle, an ellipse, a triangle, a quadrangle, a polygon such as a hexagon, and the like can be given.

  The light emitting element 1 may not be mounted on the mounting substrate, but is preferably mounted on the mounting substrate. When mounted on a mounting substrate, flip-chip mounting is preferable from the viewpoint of light extraction described above.

  When the light emitting element 1 is mounted on the mounting substrate 4, the first covering member 3 a can be disposed between the light emitting element 1 and the mounting substrate 4. Specifically, the first covering member 3 a covers the lower surface of the light emitting element 1 and the upper surface of the mounting substrate 4 in the space between the light emitting element 1 and the mounting substrate 4. At this time, in the space between the light emitting element 1 and the mounting substrate 4, the first covering member 3 a that covers the lower surface of the light emitting element 1 and the first covering member 3 a that covers the upper surface of the mounting substrate 4 are further inserted. It is preferable that 2 covering members 3b are arranged.

(Translucent member 2)
The light transmissive member 2 is disposed on the upper surface of the light emitting element 1 and preferably transmits 60% or more, 65% or more, 70% or more, or 80% or more of the light emitted from the light emitting element 1.
The translucent member 2 can be formed of a translucent material such as a translucent resin, glass, or ceramic. As the light-transmitting resin, a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin, or a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin, or a polynorbornene resin can be used. In particular, a silicone resin excellent in light resistance and heat resistance is suitable. Since the light transmissive member preferably has a high light transmittance, it is usually preferable that no additive that reflects, absorbs, or scatters light be added. For example, various fillers may be added in order to adjust the refractive index of the translucent member or to adjust the viscosity of the translucent member before curing.

The translucent member 2 can contain a wavelength converting substance. As the translucent member 2 containing a wavelength conversion substance, it is preferable to use a material formed by containing a wavelength conversion substance in a sintered body of a wavelength conversion substance, the above-described translucent resin, glass, ceramics, or the like. Examples of the wavelength converting substance include oxide-based, sulfide-based, and nitride-based wavelength converting substances. Specifically, when a gallium nitride-based light emitting device that emits blue light is used as the light emitting device, YAG-based, LAG-based, yellow-green light-emitting SiAGON-based (β sialon), SGS wavelength that absorbs blue light. Wavelength conversion materials such as conversion materials, red light emitting SCASN, CASN, manganese-activated potassium fluorosilicate wavelength conversion materials (KSF wavelength conversion materials; K ₂ SiF ₆ : Mn), sulfide wavelength conversion materials These may be used alone or in combination.
A wavelength conversion substance can be contained at 2 to 50 weight% with respect to a translucent member, for example.
The translucent member 2 may contain various fillers such as a light diffusing substance, in addition to the wavelength converting substance.

  The translucent member 2 is preferably at least as large as, or larger than, the outer shape of the upper surface of the light emitting element 1 in a plan view of the light emitting device 10. For example, in a plan view, the outer shape of the translucent member 2 can be a desired shape such as a polygon such as a circle, an ellipse, a square, or a rectangle. The translucent member 2 preferably has a thickness of 50 to 300 μm, for example.

[Method of manufacturing light emitting device]
For example, as shown in FIGS. 2A to 2D, the method for manufacturing the light emitting device of the present embodiment is
A first mixture 3X including a first light reflecting material and a fluorine-based first resin is disposed around the light emitting element 1,
The first mixture 3X is heated to form a first covering member 3a in contact with the light emitting element 1,
Filling a second mixture containing the second light reflecting material and the second resin around the first covering member 3a to form the second covering member 3b covering the first covering member 3a.
In addition to the steps described above, it is preferable to further include a step of mounting the light emitting element 1 on the mounting substrate 4 and disposing the translucent member 2 on the upper surface of the light emitting element.

(Preparation of light emitting element)
The light emitting element 1 is prepared. The light emitting element 1 is preferably mounted on a mounting substrate, for example. The mounting substrate preferably has a pair of wiring layers corresponding to the electrodes of the light emitting element on the insulating base material. The base material is preferably formed of a material with good heat dissipation, such as glass, resin (including fiber reinforced resin), resin (including fiber reinforced resin), ceramics, glass, metal, paper, and the like. Can be configured. Examples of the resin include an epoxy resin, a glass epoxy resin, a bismaleimide triazine (BT) resin, and a polyimide resin. Examples of the ceramic include aluminum oxide, aluminum nitride, zirconium oxide, zirconium nitride, titanium oxide, titanium nitride, or a mixture thereof. Examples of the metal include copper, iron, nickel, chromium, aluminum, silver, gold, titanium, and alloys thereof. If the base material is a flexible substrate (flexible substrate), it may be formed using polyimide, polyethylene terephthalate, polyethylene naphthalate, liquid crystal polymer, cycloolefin polymer, or the like.

  The wiring layer is formed on at least the upper surface of the base material, and may also be formed on the inside, the side surface, and / or the lower surface of the base material. The wiring layer can be formed of copper, iron, nickel, tungsten, chromium, aluminum, silver, gold, titanium, palladium, rhodium, or an alloy thereof. A single layer or a multilayer of these metals or alloys may be used. In particular, copper or a copper alloy is preferable from the viewpoint of heat dissipation.

  The light-emitting element can be flip-chip mounted by connecting a pair of electrodes to a corresponding pair of wiring layers by a conductive member. Conductive members include gold, silver, copper bumps, silver, gold, copper, platinum, aluminum, metal powder including resin binder and resin binder, tin-bismuth, tin-copper, tin-silver And solder such as gold and tin, and brazing materials such as low melting point metals.

  Before and after mounting the light emitting element on the mounting substrate, it is preferable to place the light transmitting member on the upper surface of the light emitting element. The light transmissive member can be fixed to the upper surface of the light emitting element with a light transmissive adhesive, for example. As the adhesive, an adhesive composed of a resin or the like known in the art can be used. In addition, for bonding between the light emitting element and the translucent member, direct bonding such as pressure bonding, sintering, surface activated bonding, atomic diffusion bonding, and hydroxyl bonding can be employed.

(Arrangement of the first mixture)
A first mixture is prepared in advance. The first mixture includes a first light reflecting material and a fluorine-based first resin. The first mixture can be prepared by adding the first light reflecting material to the fluorine-based first resin and stirring. The first resin is preferably used as a slurry or solution using an appropriate solvent such as an organic solvent. The content of the first resin contained in the slurry or solution is preferably about 5 to 20% by weight. The content of the first light reflecting material contained in the first mixture is preferably 10 to 30% by weight. In order to adjust the viscosity, an additive such as a filler may be further added to the first mixture.

  As shown in FIG. 2B, the first mixture 3X is disposed around the light emitting element 1. Depending on the viscosity of the first mixture 3X and the like, for example, as shown in FIG. 2A, it is preferable to arrange a frame 5 for blocking the first mixture 3X in a region surrounding the light emitting element 1. The first mixture 3X may be applied around the light emitting element 1 using a dispenser or the like, or may be applied around the light emitting element 1 by spraying or the like. The first mixture 3X disposed around the light emitting element 1 is disposed around the light emitting element so that the upper surface of the first mixture 3X is raised, for example, as shown in FIG. It is preferable to do. Moreover, it is preferable to arrange the frame body 5 or apply it around the light emitting element 1 so that the thickness (for example, T in FIG. 2B) of the first mixture 3X on the side surface of the light emitting element is 100 to 1000 μm. . The first mixture 3X is preferably not applied to the upper surface of the light emitting element 1. The first mixture 3X is also disposed between the light emitting element 1 and the mounting substrate 4. Further, when the translucent member 2 is disposed on the upper surface of the light emitting element 1, it is preferable that the first mixture 3 </ b> X is not applied to the upper surface of the translucent member 2. However, when the first mixture 3X is applied to the upper surface of the light emitting element or the upper surface of the translucent member, the first mixture 3X or the first covering member 3a existing on these upper surfaces can be completely removed in a subsequent step. Good. The removal can be performed by a method known in the art, for example, high-pressure water washing after forming the second covering member.

(Formation of the first covering member 3a)
Next, the first mixture 3 </ b> X disposed around the light emitting element 1 is heated. The heating here is performed together with the light emitting element 1. Examples of the heating method include heating by hot plate or laser light irradiation, heating by introducing into an oven, and the like. The temperature of heating can be suitably adjusted according to the kind of 1st resin to be used, for example, 60-300 degreeC is mentioned, 80-200 degreeC is preferable. Moreover, the heating time is 1 to 5 hours, for example. By such heating, the first covering member 3a is fired as shown in FIG. 2C. When the translucent member 2 is disposed on the light emitting element 1, the first mixture 3X contracts while adhering to the light emitting element 1 and the translucent member 2, and contacts and covers these side surfaces and the like. The first covering member 3a can be formed. The first covering member 3a is thinner than the first mixture 3X (for example, M in FIG. 2C) as the first mixture 3X contracts during curing. In this case, when the light emitting element 1 is mounted on the mounting substrate 4, the first mixture applied on the mounting substrate 4 contracts by heating so as to be in close contact with the mounting substrate and covers the upper surface thereof. Will be.

When the upper end of the side surface of the light emitting element or the translucent member is disposed on the light emitting element, the upper end of the side surface of the translucent member may be thinned or exposed in some cases due to the shrinkage of the first resin. . On the other hand, when the first mixture is arranged as described above, such a thinning or exposure can be prevented by arranging the first mixture so that the upper surface of the first mixture is raised.
For example, the shrinkage of the first mixture is caused by volatilization of the solvent contained in the first resin. That is, by heating the first mixture containing the first resin in a slurry or solution using a solvent, the solvent in the first mixture is volatilized and the volume of the first mixture is reduced. Then, the first light reflecting material and the first resin are in close contact with the light emitting element 1 and the light transmitting member 2 so as to contract as the solvent evaporates.
By using the first resin in the form of a slurry or solution using a solvent, more first light reflecting material can be contained in the first mixture. Then, by first curing the first resin while volatilizing the solvent, it is possible to form the first covering member containing the first light reflecting material in a high content. Here, the high content means that the content of the first light reflecting material in the first covering member is, for example, 50% by weight or more.

  As shown in FIG. 1C, the first covering member preferably has irregularities on the surface. The first covering member having irregularities on the surface can be formed by including a high content of the first light reflecting material. That is, it is preferable that the first covering member includes the first light reflecting material with a high content and has unevenness caused by the first light reflecting material. Thereby, adhesiveness with the 2nd coating | coated member 3b mentioned later can be improved.

  The frame 5 may be removed after forming the first covering member or after forming the second covering member.

(Formation of second covering member 3b)
As shown in FIGS. 1A and 1B, a second covering member 3b is disposed around the first covering member. The second covering member 3b that covers the first covering member is formed by filling and curing a second mixture containing the second light reflecting material and the second resin.
A 2nd mixture can be prepared using the method similar to preparation of a 1st mixture, for example.
For filling the second mixture, various methods such as application using a dispenser, application by spraying, application by printing, and the like can be used.
The second mixture is preferably not applied to the upper surface of the light-emitting element 1 or when the light-transmitting member 2 is disposed on the upper surface of the light-emitting element 1. When applied to the upper surface of the light emitting element or the upper surface of the translucent member, the second mixture or the second covering member 3b existing on these upper surfaces may be removed in a subsequent step. The removal can be performed by a method known in the art, such as high-pressure water washing.

  The upper surface of the second covering member 3b is preferably substantially flush with the upper surface of the translucent member 2. Thereby, even if the first covering member 3a is retracted from above the side surface of the translucent member 2 due to contraction, the second covering member 3b reliably covers the side surface of the translucent member 2. Thereby, the light leakage from the side of the translucent member 2 can be prevented, the light extraction efficiency from the light emitting element can be improved, and the light flux extracted from the light emitting element can be increased.

  The second covering member 3b can be cured using a method known in the art, such as thermosetting, depending on the type of the second resin to be used.

In such a configuration, that is, the side surface of the light emitting element or the like is covered with the first covering member, and the first covering member is further covered with the second covering member, so that the light is emitted from the light emitting element. Light can be effectively reflected. Moreover, when the 1st coating | coated member with a larger refractive index difference is arrange | positioned in contact with a light emitting element, it can reflect more effectively. As a result, light leakage from the side surface of the light emitting element can be effectively prevented. As a result, the luminous flux emitted from the light extraction surface can be further increased.
In particular, when a covering member is configured using a resin and a light reflecting material having a large refractive index difference, generally, since the shrinkage caused by the curing of the resin is large, it may be disposed at an appropriate thickness or size. Although it is difficult, as described above, the light emitted from the light emitting element can be obtained by arranging the second covering member so as to cover the first covering member using the resin and the light reflecting material having a larger refractive index difference. The first covering member ensures the reflection of the light and the second covering member further ensures the appropriate thickness and size at an appropriate place, and by causing both to work cooperatively, In the case where a light-transmitting member is arranged on the upper surface of the light-emitting element serving as the light extraction surface and the light-emitting element is disposed on the upper surface of the light-emitting element, light flux extracted from the upper surface of the light-transmitting member can be increased. .

DESCRIPTION OF SYMBOLS 1 Light emitting element 2 Translucent member 3 Coating | coated member 3a 1st coating | coated member 3b 2nd coating | coated member 3X 1st mixture 4 Mounting board 5 Frame 10 Light-emitting device

Claims (18)

A light emitting element;
A translucent member provided on the upper surface of the light emitting element;
A light-emitting device comprising: a light-reflective coating member that covers a side surface of the light-emitting element and a side surface of the translucent member;
The covering member covers a side surface of the light emitting element and a side surface of the translucent member, covers a first covering member including a first light reflecting material and a fluorine-based first resin, and the first covering member, A second covering member including a second light reflecting material and a second resin, wherein a difference in refractive index between the first light reflecting material and the first resin is a difference in refractive index between the second light reflecting material and the second resin. Larger light emitting device.   The light emitting device according to claim 1, wherein the first covering member covers a lower surface of the light emitting element.   3. The light emitting device according to claim 1, wherein a refractive index difference between the first light reflecting material and the first resin is larger than a refractive index difference between the second light reflecting material and the second resin.   The light emission according to any one of claims 1 to 3, wherein the first light reflection material and the second light reflection material are the same material, and a refractive index of the first resin is lower than a refractive index of the second resin. apparatus.   The light emitting device according to any one of claims 1 to 4, wherein the second resin is a silicone resin.   The light emitting device according to claim 1, wherein the first covering member is thinner than the second covering member.   The light emitting device according to claim 1, wherein the light emitting element is mounted on a substrate, and the first covering member is disposed in contact with the substrate.   The light emitting device according to any one of claims 1 to 7, wherein a content of the first light reflecting material in the first covering member is larger than a content of the second light reflecting material in the second covering member. .   The light-emitting device according to claim 1, wherein the translucent member includes a wavelength conversion substance. A first mixture containing a first light reflecting material and a fluorine-based first resin is disposed around the light emitting element,
Heating the first mixture to form a first covering member in contact with the light emitting element;
A method for manufacturing a light-emitting device, comprising filling a second mixture containing a second light reflecting material and a second resin around the first covering member to form a second covering member that covers the first covering member. .   The method of manufacturing a light emitting device according to claim 10, wherein the first resin is a slurry or a solution using a solvent.   The manufacturing method of the light-emitting device according to claim 10 or 11, wherein a frame is provided around the light-emitting element, and the first mixture is disposed in the frame.   The light transmitting member is placed on the upper surface of the light emitting element before the first mixture is disposed, and the first mixture is disposed on a side surface of the light emitting element and a side surface of the light transmitting member. The manufacturing method of the light-emitting device of any one of these.   The light emission according to any one of claims 10 to 13, wherein the first light reflecting material and the second light reflecting material are the same material, and the refractive index of the first resin is lower than the refractive index of the second resin. Device manufacturing method.   The method for manufacturing a light emitting device according to claim 10, wherein the second resin is a silicone-based resin.   The method for manufacturing a light emitting device according to claim 10, wherein the second covering member is formed thicker than the first covering member.   Furthermore, the manufacturing method of the light-emitting device of any one of Claim 11 to 16 which mounts the said light emitting element on a board | substrate, and arrange | positions the said 1st mixture on the said board | substrate. A light emitting element;
A translucent member provided on the upper surface of the light emitting element;
A light-emitting device comprising: a light-reflective coating member that covers a side surface of the light-emitting element and a side surface of the translucent member;
The covering member covers a side surface of the light emitting element and a side surface of the translucent member, covers a first covering member including a first light reflecting material and a fluorine-based first resin, and the first covering member, A light emitting device comprising: a second light reflecting material and a second covering member including a second resin.