JP2018181735A - プレスフィット端子、電子装置、及びコネクタ - Google Patents

プレスフィット端子、電子装置、及びコネクタ Download PDF

Info

Publication number: JP2018181735A
Authority: JP; Japan
Prior art keywords: press; hole; film; fit terminal; elastic
Prior art date: 2017-04-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP2017083104A

Other languages

Inventor

謙次越智

Kenji Ochi

謙次越智

巧塩見

Takumi Shiomi

巧塩見

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Denso Corp

Original Assignee

Denso Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-04-19

Filing date

2017-04-19

Publication date

2018-11-15

2017-04-19 Application filed by Denso Corp filed Critical Denso Corp

2017-04-19 Priority to JP2017083104A priority Critical patent/JP2018181735A/ja

2018-11-15 Publication of JP2018181735A publication Critical patent/JP2018181735A/ja

Status Pending legal-status Critical Current

Links

238000003780 insertion Methods 0.000 claims abstract description 41
230000037431 insertion Effects 0.000 claims abstract description 41
RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 20
230000005489 elastic deformation Effects 0.000 claims abstract description 16
238000006243 chemical reaction Methods 0.000 claims abstract description 10
239000000758 substrate Substances 0.000 claims description 57
238000007747 plating Methods 0.000 claims description 40
239000000463 material Substances 0.000 claims description 38
-1 imidazole compound Chemical class 0.000 claims description 7
239000011347 resin Substances 0.000 claims description 6
229920005989 resin Polymers 0.000 claims description 6
239000011248 coating agent Substances 0.000 abstract description 3
238000000576 coating method Methods 0.000 abstract description 3
150000001875 compounds Chemical class 0.000 abstract 1
230000004907 flux Effects 0.000 abstract 1
230000002401 inhibitory effect Effects 0.000 abstract 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
238000005275 alloying Methods 0.000 description 6
230000000052 comparative effect Effects 0.000 description 6
238000010438 heat treatment Methods 0.000 description 6
238000000034 method Methods 0.000 description 5
229910052802 copper Inorganic materials 0.000 description 4
230000000694 effects Effects 0.000 description 4
238000004519 manufacturing process Methods 0.000 description 4
229910052751 metal Inorganic materials 0.000 description 4
239000002184 metal Substances 0.000 description 4
230000003647 oxidation Effects 0.000 description 4
238000007254 oxidation reaction Methods 0.000 description 4
238000012986 modification Methods 0.000 description 3
230000004048 modification Effects 0.000 description 3
229910000881 Cu alloy Inorganic materials 0.000 description 2
229910045601 alloy Inorganic materials 0.000 description 2
239000000956 alloy Substances 0.000 description 2
229910052782 aluminium Inorganic materials 0.000 description 2
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
239000007769 metal material Substances 0.000 description 2
229910052759 nickel Inorganic materials 0.000 description 2
238000007790 scraping Methods 0.000 description 2
229910052709 silver Inorganic materials 0.000 description 2
229910052718 tin Inorganic materials 0.000 description 2
238000013459 approach Methods 0.000 description 1
239000012141 concentrate Substances 0.000 description 1
239000004020 conductor Substances 0.000 description 1
239000000470 constituent Substances 0.000 description 1
230000017525 heat dissipation Effects 0.000 description 1
238000007654 immersion Methods 0.000 description 1
239000011810 insulating material Substances 0.000 description 1
239000000203 mixture Substances 0.000 description 1
238000000465 moulding Methods 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
230000000149 penetrating effect Effects 0.000 description 1
230000002093 peripheral effect Effects 0.000 description 1
238000004080 punching Methods 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1

Images