JP2018082038A - Wiring board with support plate and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board with a support plate that is easily mounted and a method of manufacturing the same.SOLUTION: A wiring board 10 with a support plate includes: a printed wiring board 11 having an F surface 11F having a pad 17 for mounting a semiconductor element and an S surface 11S on a side opposite to the F surface 11F; a first support plate 30 bonded to the S surface 11S via a first adhesive layer 33; and a second support plate 40 bonded to a surface of the first support plate 30 via a second adhesive layer 43, the surface facing an opposite side relative to the printed wiring board 11.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a wiring board with a supporting plate having a printed wiring board and a supporting plate that supports the printed wiring board, and a manufacturing method thereof.

  In the wiring board with a support plate of Patent Document 1, a printed wiring board is bonded only to one side of the support plate.

Japanese Patent Laying-Open No. 2015-2196 (paragraphs [0014] to [0015], FIG. 1)

  In the wiring board with a support plate of Patent Document 1, the warp of the support plate is large, and it is considered difficult to mount on the printed wiring board.

  The wiring board with a support plate of the present invention includes a printed wiring board having a first surface having a pad for mounting a semiconductor element and a second surface opposite to the first surface, and the printed wiring board. A first support plate bonded to the second surface via a first adhesive layer, and a second bond bonded to the surface of the first support plate facing away from the printed wiring board via the second adhesive layer And a support plate.

  The method for manufacturing a wiring board with a support plate according to the present invention includes preparing a printed wiring board having a first surface having a pad for mounting a semiconductor element and a second surface opposite to the first surface. Bonding a first support plate to the second surface of the printed wiring board via a first adhesive layer; and a second adhesive layer on a surface of the first support plate facing the side opposite to the printed wiring board. Adhering the second support plate via

Cross section of wiring board with support plate Sectional drawing which shows the manufacturing process of the wiring board with a support plate Cross section of semiconductor package Sectional drawing which shows the manufacturing process of a semiconductor package Sectional drawing which shows the manufacturing process of a semiconductor package

  The wiring board 10 with a support plate of this embodiment includes a printed wiring board 11 and a first support plate 30. The printed wiring board 11 has an F surface 11F and an S surface 11S on the front and back sides. Moreover, the 1st support plate 30 has F surface 30F and S surface 30S in the front and back. The S surface 11S of the printed wiring board 11 is superimposed on the F surface 30F of the support plate 30.

  The printed wiring board 11 has a plurality of insulating resin layers 13 and a plurality of conductor layers 14. The plurality of insulating resin layers 13 and the plurality of conductor layers 14 are alternately stacked. The conductor layers 14 adjacent to each other in the thickness direction of the printed wiring board 11 are connected by via conductors 15 that penetrate the insulating resin layer 13. The insulating resin layer 13 may be a prepreg containing an inorganic filler (a resin sheet obtained by impregnating a core material with a resin containing an inorganic filler), or a resin film that does not contain a core material and contains an inorganic filler. May be.

  Of the plurality of conductor layers 14, the conductor layer 14 exposed at the F surface 11 </ b> F constitutes a plurality of first pads 17. A solder resist layer 21 is laminated on the outermost conductor layer 14 disposed on the side closest to the S surface 11S among the plurality of conductor layers 14. An opening 22 is formed in the solder resist layer 21. The conductor layer 14 exposed by the opening 22 constitutes a plurality of second pads 16.

  The first support plate 30 is bonded to the S surface 11S of the printed wiring board 11 via the first adhesive layer 33. The first support plate 30 is formed by laminating metal layers 32 on the front and back of the insulating base 31. The insulating base 31 is made of an epoxy resin or BT (bismaleimide triazine) resin and glass cloth. The metal layer 32 is made of copper foil.

  The wiring board 10 with a support plate of the present embodiment further has a second support plate 40. The second support plate 40 is bonded to the S surface 30 </ b> S of the first support plate 30 via the second adhesive layer 43. The second support plate 40 is formed by laminating metal layers 42 on the front and back of the insulating base material 41. The insulating base 41 is made of an epoxy resin or BT (bismaleimide triazine) resin and glass cloth. The metal layer 42 is made of copper foil. The adhesive constituting the second adhesive layer 43 may be the same as or different from the adhesive constituting the first adhesive layer 33.

  In the present embodiment, the adhesive strength between the first adhesive layer 33 and the first support plate 30 is greater than the adhesive strength between the first adhesive layer 33 and the printed wiring board 11. Specifically, the peel strength when the F surface 30F of the first support plate 30 is peeled in the direction perpendicular to the first adhesive layer 33 (hereinafter referred to as “90-degree peel strength”) is the printed wiring board 11. This is larger than the 90-degree peel strength when the S surface 11S is peeled off in the direction perpendicular to the first adhesive layer 33. Note that the roughness of the F surface 30F of the first support plate 30 is greater than the roughness of the S surface 11S of the printed wiring board 11.

  In the present embodiment, the adhesive strength between the second adhesive layer 43 and the first support plate 30 is substantially the same as the adhesive strength between the second adhesive layer 43 and the second support plate 40. Specifically, the 90 degree peel strength of the second adhesive layer 43 with respect to the S surface 30S of the first support plate 30 is substantially the same as the 90 degree peel strength of the second adhesive layer 43 with respect to the F surface 40F of the second support plate 40. It is. The roughness of the S surface 30S of the first support plate 30 is substantially the same as the roughness of the F surface 40F of the second support plate 40.

  In the present embodiment, the thickness of the second support plate 40 is substantially the same as the thickness of the printed wiring board 11. Further, the first support plate 30 is thicker than the second support plate 40. Specifically, the thickness of the printed wiring board 11 and the second support plate 40 is 100 to 150 μm, the thickness of the first support plate 30 is 100 to 250 μm, and the first adhesive layer 33 and the second adhesive layer 43 are The thickness is 5 to 40 μm. The metal layer 32 of the first support plate 30 is thicker than the metal layer 42 of the second support plate 40. Specifically, the metal layer 32 has a thickness of 30 to 40 μm, and the metal layer 42 has a thickness of 10 to 20 μm.

The wiring board 10 with a support plate is manufactured as follows.
(1) As shown in FIG. 2, a printed wiring board 11, a first support plate 30 and a second support plate 40 are prepared. Here, the first support plate 30 is a copper-clad laminate in which copper foil is laminated on both the front and back surfaces of the insulating substrate 31. The second support plate 40 is a copper-clad laminate in which copper foil is laminated on both the front and back surfaces of the insulating base material 41.

  (2) A roughening process is performed on the F surface 30F and the S surface 30S of the first support plate 30 and the F surface 40F of the second support plate 40.

  (3) Hot press is performed, and the printed wiring board 11, the first support plate 30, and the second support plate 40 are laminated and integrated. Specifically, the S surface 11S of the printed wiring board 11 and the F surface 30F of the first support plate 30 are bonded with an adhesive, and the S surface 30S of the first support plate 30 and the F surface 40F of the second support plate 40 are bonded. Are bonded with an adhesive. The first adhesive layer 33 is formed by an adhesive between the printed wiring board 11 and the first support plate 30, and the second adhesive layer is formed by an adhesive between the first support plate 30 and the second support plate 40. 43 is formed. Thus, the wiring board 10 with a support plate is completed.

  FIG. 3 shows a semiconductor package 80 manufactured using the wiring board 10 with a support plate. The semiconductor package 80 includes a printed wiring board 11 of the wiring board 10 with a support plate and a semiconductor element 81. The semiconductor element 81 is mounted on the F surface 11F of the printed wiring board 11. A plurality of terminals 81T provided in the semiconductor element 81 are connected to the conductor layer 14 exposed on the F surface 11F of the printed wiring board 11 via the solder balls 82. The semiconductor element 81 is sealed with a mold resin 83.

The semiconductor package 80 is manufactured as follows.
(1) As shown in FIG. 4, the semiconductor element 81 is mounted on the F surface 11 </ b> F of the printed wiring board 11 in the wiring board 10 with the support plate. Specifically, the solder ball 82 mounted on the terminal 81T of the semiconductor element 81 is connected to the pad 17 exposed on the F surface 11F of the printed wiring board 11. Then, the semiconductor element 81 is sealed with the mold resin 83 and fixed to the printed wiring board 11.

  (2) As shown in FIG. 5, the first support substrate 30 is peeled off from the printed wiring board 11. At this time, the first adhesive layer 33 is peeled off from the printed wiring board 11 together with the first support board 30. Thus, the semiconductor package 80 is completed.

Next, the effect of this embodiment is demonstrated.
The wiring board 10 with a support plate of the present embodiment is bonded not only to the first support plate 30 bonded to the printed wiring board 11 but also to the S surface 11S facing the opposite side of the printed wiring board 11 in the first support plate 33. The second support plate 40 is provided. Thereby, in the wiring board 10 with a support plate, since the curvature of the 1st support plate 30 is suppressed, it becomes easy to mount the semiconductor element 11 on the printed wiring board 11. Further, the reliability of mounting on the printed wiring board 11 can be improved. Moreover, since the thickness of the second support plate 40 is substantially the same as the thickness of the printed wiring board 11, it becomes possible to improve the symmetry of the structure between the front and back of the first support plate 30. 30 warpage can be further suppressed.

  In this embodiment, the adhesive strength between the first adhesive layer 33 and the first support plate 30 is greater than the adhesive strength between the first adhesive layer 33 and the printed wiring board 11. Thereby, in this embodiment, when the 1st support board 30 is peeled from the printed wiring board 11, the 1st contact bonding layer 33 becomes easy to peel from the printed wiring board 11 with the 1st support board 30 easily.

[Other Embodiments]
(1) In the above embodiment, if the thermal expansion coefficient of the printed wiring board 11 and the thermal expansion coefficient of the second support board 40 are substantially the same, the thickness of the second support board 40 is different from the thickness of the printed wiring board 11. May be.

  (2) In the above embodiment, the adhesive strength between the second adhesive layer 43 and the first support plate 30 may be different from the adhesive strength between the second adhesive layer 43 and the second support plate.

  (3) In the above embodiment, the thickness of the metal layer 32 of the first support plate 30 may be substantially the same as the thickness of the metal layer 42 of the second support plate 40.

DESCRIPTION OF SYMBOLS 10 Wiring board with support plate 11 Printed wiring board 17 Pad 30 1st support plate 33 1st contact bonding layer 40 2nd support plate 43 2nd contact bonding layer

Claims (6)

A printed wiring board having a first surface having a pad for mounting a semiconductor element and a second surface opposite to the first surface;
A first support plate adhered to the second surface of the printed wiring board via a first adhesive layer;
A wiring board with a supporting plate, comprising: a second supporting plate bonded to a surface of the first supporting plate facing away from the printed wiring board through a second adhesive layer. A wiring board with a support plate according to claim 1,
The thickness of the second support plate is substantially the same as the thickness of the printed wiring board. A wiring board with a support plate according to claim 1 or 2,
The adhesive strength between the first adhesive layer and the first support plate is greater than the adhesive strength between the first adhesive layer and the printed wiring board. A wiring board with a support plate according to claim 3,
The roughness of the surface of the first support plate facing the printed wiring board is greater than the roughness of the second surface of the printed wiring board. Providing a printed wiring board having a first surface having a pad for mounting a semiconductor element and a second surface opposite to the first surface;
Bonding a first support plate to the second surface of the printed wiring board via a first adhesive layer;
Adhering a second support plate to a surface of the first support plate facing away from the printed wiring board via a second adhesive layer. It is a manufacturing method of the wiring board with a support board according to claim 5,
Before the first support plate is bonded to the second surface of the printed wiring board, the surface of the first support plate facing the printed wiring board is roughened,
A method of manufacturing a wiring board with a support plate, wherein the roughening treatment makes the adhesive strength between the first adhesive layer and the first support plate greater than the adhesive strength between the first adhesive layer and the printed wiring board.

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