JP2013018065A - 薄板状ワークの研削方法及び両頭平面研削盤 - Google Patents
薄板状ワークの研削方法及び両頭平面研削盤 Download PDFInfo
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- JP2013018065A JP2013018065A JP2011152022A JP2011152022A JP2013018065A JP 2013018065 A JP2013018065 A JP 2013018065A JP 2011152022 A JP2011152022 A JP 2011152022A JP 2011152022 A JP2011152022 A JP 2011152022A JP 2013018065 A JP2013018065 A JP 2013018065A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】キャリア4に装着された薄板状のワークWを一対の静圧パッド1により非接触で静圧支持し、キャリア4を介してワークWを回転させながら、一対の研削砥石3によりワークWの両面を研削する両頭平面研削盤において、キャリア4の外周のキャリアリング5を非接触で静圧支持する静圧キャリアガイド6a,6bを周方向に複数個備える。キャリアリング5は円筒面状の外周面12を有し、その外周面12に近接して各静圧キャリアガイド6a,6bを略等配に配置する。静圧キャリアガイド6a,6bは固定しても良いし、フローティング可能にしても良い。
【選択図】図3
Description
3 研削砥石
4 キャリア
5 キャリアリング
6a,6b 静圧キャリアガイド
12 外周面
15a,15b フローティング軸
16a,16b 固定手段
17a,17b 規制手段
19 駆動手段
21 ピン孔
22 静圧面
29 供給源
33 枢軸
34 支持アーム
47 ストッパー手段(隙間調整手段)
W ワーク
Claims (9)
- キャリアに装着された薄板状ワークを一対の静圧パットにより非接触で静圧支持し、前記キャリアを介して前記ワークを回転させながら、一対の研削砥石により前記ワークの両面を研削するに際し、前記キャリアの外周のキャリアリングを周方向に複数個の静圧キャリアガイドにより非接触で静圧支持することを特徴とする薄板状ワークの研削方法。
- キャリアに装着された薄板状ワークを一対の静圧パットにより非接触で静圧支持し、前記キャリアを介して前記ワークを回転させながら、一対の研削砥石により前記ワークの両面を研削する両頭平面研削盤において、前記キャリアの外周のキャリアリングを非接触で静圧支持する静圧キャリアガイドを周方向に複数個備えたことを特徴とする両頭平面研削盤。
- 前記キャリアリングは円筒面状の外周面を有し、該外周面に近接して前記各静圧キャリアガイドを略等配に配置したことを特徴とする請求項2に記載の両頭平面研削盤。
- 前記静圧キャリアガイドは固定であることを特徴とする請求項2又は3に記載の両頭平面研削盤。
- 前記静圧キャリアガイドはフローティング可能であることを特徴とする請求項2又は3に記載の両頭平面研削盤。
- 前記キャリアリングの回転中心と略平行なフローティング軸により前記各静圧キャリアガイドを枢支し、該各静圧キャリアガイドに、前記キャリアリングの外周面との間に静圧流体を供給する静圧ポケットを前記フローティング軸に対して前記キャリアリングの回転方向に略対称に備えたことを特徴とする請求項2〜5の何れかに記載の両頭平面研削盤。
- 前記キャリアリングの回転中心と略平行な枢軸により揺動自在に枢支され且つ少なくとも一部の前記静圧キャリアリングを前記キャリアリングに対して遠近方向に移動可能に支持する支持アームと、該支持アームを前記枢軸廻りに回動させる駆動手段と、前記支持アームを所定位置に停止させるストッパー手段とを備えたことを特徴とする請求項2〜6の何れかに記載の両頭平面研削盤。
- 前記静圧キャリアガイドは固定状態と、前記キャリアリングの回転中心と略平行なフローティング軸廻りにフローティングするフローティング状態とに変更可能であることを特徴とする請求項2〜7の何れかに記載の両頭平面研削盤。
- 前記キャリアリングの外周に略等配に配置された3個以上の前記静圧キャリアガイドを備え、該3個以上の静圧キャリアガイドの内、少なくとも1個の前記キャリアガイドの位置を前記キャリアリングの略直径方向に調整して前記3個以上の静圧キャリアガイドを静圧面と前記キャリアリングの外周面との隙間を調整する隙間調整手段を備えたことを特徴とする請求項2〜8の何れかに記載の両頭平面研削盤。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011152022A JP5627114B2 (ja) | 2011-07-08 | 2011-07-08 | 薄板状ワークの研削方法及び両頭平面研削盤 |
| SG2012046975A SG187316A1 (en) | 2011-07-08 | 2012-06-22 | Method for grinding thin sheet-like workpiece and double-end surface grinder |
| KR1020120069087A KR101911553B1 (ko) | 2011-07-08 | 2012-06-27 | 박판형 워크의 연삭 방법 및 양두 평면 연삭기 |
| EP12175279.4A EP2543475B1 (en) | 2011-07-08 | 2012-07-06 | Method for grinding thin sheet-like workpiece and double-end surface grinder |
| TW101124333A TWI604918B (zh) | 2011-07-08 | 2012-07-06 | 薄板狀工件之研磨方法及雙面平面磨床 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011152022A JP5627114B2 (ja) | 2011-07-08 | 2011-07-08 | 薄板状ワークの研削方法及び両頭平面研削盤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013018065A true JP2013018065A (ja) | 2013-01-31 |
| JP2013018065A5 JP2013018065A5 (ja) | 2013-09-26 |
| JP5627114B2 JP5627114B2 (ja) | 2014-11-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011152022A Active JP5627114B2 (ja) | 2011-07-08 | 2011-07-08 | 薄板状ワークの研削方法及び両頭平面研削盤 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2543475B1 (ja) |
| JP (1) | JP5627114B2 (ja) |
| KR (1) | KR101911553B1 (ja) |
| SG (1) | SG187316A1 (ja) |
| TW (1) | TWI604918B (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014008594A (ja) * | 2012-07-03 | 2014-01-20 | Shin Etsu Handotai Co Ltd | 両頭研削装置及びワークの両頭研削方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104259984A (zh) * | 2014-09-18 | 2015-01-07 | 洛阳巨优机床有限公司 | 一种往复式双端面磨床往复送料板一浮一定式装置 |
| CN104369058A (zh) * | 2014-11-27 | 2015-02-25 | 石家庄轴设机电设备有限公司 | 滚子双端面磨床支撑及其使用方法 |
| CN115741453B (zh) * | 2022-11-30 | 2024-02-27 | 大连理工大学 | 一种多传感器融合的智能双面研磨机 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4940279B1 (ja) * | 1965-07-23 | 1974-11-01 | ||
| JP2002036078A (ja) * | 2001-06-25 | 2002-02-05 | Koyo Mach Ind Co Ltd | 薄板円板状ワークの両面研削装置 |
| JP2005205528A (ja) * | 2004-01-22 | 2005-08-04 | Koyo Mach Ind Co Ltd | 両頭平面研削装置 |
| JP2005262343A (ja) * | 2004-03-16 | 2005-09-29 | Sumitomo Heavy Ind Ltd | ワーク保持装置及び両面加工装置 |
| JP2009279704A (ja) * | 2008-05-22 | 2009-12-03 | Shin Etsu Handotai Co Ltd | 両頭研削装置及びウェーハの製造方法 |
| JP2010042488A (ja) * | 2008-08-15 | 2010-02-25 | Mori Seiki Co Ltd | ワーク受け及びこれを備えた研削盤 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3673904B2 (ja) | 1996-12-03 | 2005-07-20 | 光洋機械工業株式会社 | 薄板円板状ワークの両面研削装置 |
| JP3702379B2 (ja) | 1996-12-13 | 2005-10-05 | 光洋機械工業株式会社 | 薄板円板状ワークの両面研削装置 |
-
2011
- 2011-07-08 JP JP2011152022A patent/JP5627114B2/ja active Active
-
2012
- 2012-06-22 SG SG2012046975A patent/SG187316A1/en unknown
- 2012-06-27 KR KR1020120069087A patent/KR101911553B1/ko active Active
- 2012-07-06 TW TW101124333A patent/TWI604918B/zh active
- 2012-07-06 EP EP12175279.4A patent/EP2543475B1/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4940279B1 (ja) * | 1965-07-23 | 1974-11-01 | ||
| JP2002036078A (ja) * | 2001-06-25 | 2002-02-05 | Koyo Mach Ind Co Ltd | 薄板円板状ワークの両面研削装置 |
| JP2005205528A (ja) * | 2004-01-22 | 2005-08-04 | Koyo Mach Ind Co Ltd | 両頭平面研削装置 |
| JP2005262343A (ja) * | 2004-03-16 | 2005-09-29 | Sumitomo Heavy Ind Ltd | ワーク保持装置及び両面加工装置 |
| JP2009279704A (ja) * | 2008-05-22 | 2009-12-03 | Shin Etsu Handotai Co Ltd | 両頭研削装置及びウェーハの製造方法 |
| JP2010042488A (ja) * | 2008-08-15 | 2010-02-25 | Mori Seiki Co Ltd | ワーク受け及びこれを備えた研削盤 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014008594A (ja) * | 2012-07-03 | 2014-01-20 | Shin Etsu Handotai Co Ltd | 両頭研削装置及びワークの両頭研削方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130006303A (ko) | 2013-01-16 |
| TWI604918B (zh) | 2017-11-11 |
| KR101911553B1 (ko) | 2018-10-24 |
| JP5627114B2 (ja) | 2014-11-19 |
| SG187316A1 (en) | 2013-02-28 |
| TW201313386A (zh) | 2013-04-01 |
| EP2543475B1 (en) | 2019-03-27 |
| EP2543475A3 (en) | 2017-01-04 |
| EP2543475A2 (en) | 2013-01-09 |
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