JP2012038624A - Lighting device - Google Patents

Abstract

An illumination device capable of reducing the amount of heat transmitted to a ceiling is provided.
A lighting device includes a chassis, a globe that is attached to the chassis and has an opening, an outer cover that covers the opening, and the like. The chassis 1 is the upper surface side (ceiling side) of the lighting device 100, and the globe 8 and the outer cover 9 are the lower surface side of the lighting device 100. The light source holding unit 3 is made of metal such as iron or aluminum, and also serves as a heat conductor that conducts heat from the LED module 2 that is a heating element to the chassis 1 and the outer cover 9. The chassis 1 and the outer cover 9 are thermally connected to the light source holding unit 3 to which the LED module 2 is fixed, and the thermal emissivity of the outer cover 9 is larger than the thermal emissivity of the chassis 1.
[Selection] Figure 3

Description

  The present invention relates to an illumination device including a light emitting diode (hereinafter referred to as “LED”) as a light source.

  2. Description of the Related Art Conventionally, lighting devices including light sources such as incandescent bulbs and fluorescent lamps have been used as lighting devices used for indoor lighting such as houses. On the other hand, with recent increase in brightness of LEDs, various lighting devices have been proposed that include LEDs having characteristics such as small size, low power consumption, and long life instead of conventional light sources (for example, patent documents). 1).

  FIG. 8 is a schematic cross-sectional view of a conventional lighting device. As shown in FIG. 8, the lighting fixture disclosed in Patent Document 1 includes a fixture main body (chassis) 510, semiconductor light emitting elements (light sources) 521 disposed on outer edges 514 and 515 of the fixture main body 510, and semiconductor light emission. A lens body 530 that is disposed facing the light emitting direction of the element 521 and controls the light traveling direction of the semiconductor light emitting element 521 mainly in a parallel direction, and faces the semiconductor light emitting element 521 toward the substantially central portion of the instrument body 510. And a globe 550 that covers the semiconductor light emitting element 521 and the reflector 540 and increases in transmittance from the outer edge toward the center. The instrument main body 510 is provided with an adapter 512 that engages with the hook ceiling 511 at a substantially central portion.

  The lighting fixture disclosed in Patent Document 1 attaches the fixture main body 510 to the fixture mounting surface A by engaging the adapter 512 with a hook ceiling 511 provided on the fixture mounting surface A such as a ceiling surface of a house or the like. This is a so-called ceiling light. When the semiconductor light emitting element 521 of the lighting fixture is turned on, the light emitted from the semiconductor light emitting element 521 is emitted by the lens body 530 toward the substantially parallel direction, that is, the inclined reflector 540, and further the reflector. The light is reflected at 540 and enters the globe 550. Since the globe 550 has a higher transmittance from the outer edge portion toward the center portion, it is possible to increase the diffusibility only at the outer edge portion in the vicinity of the semiconductor light emitting element 521 where luminance unevenness is likely to occur and increase the transmittance at other portions. it can. As a result, the light emitted from the globe 550 becomes substantially uniform illumination light with reduced luminance unevenness as a whole.

JP 2008-300203 A

  However, when an LED is used as a light source, the heat generation of the light source is greater than when an incandescent bulb or a fluorescent lamp is used as the light source. For this reason, in the ceiling light using LEDs, the amount of heat transmitted to the ceiling, which is the mounting surface, increases, and the ceiling temperature may exceed the heat resistance temperature.

  Comparing the heat generation of the LED with other light sources, incandescent light bulbs convert about 5-10% of the input power into visible light and about 72% into infrared light. 18-23%. In addition, in the fluorescent lamp, about 22% of the input power is converted into visible light and about 36% is converted into infrared light, so the heat generation in the light source is about 42% of the input power. On the other hand, in the LED, about 15 to 30% of the input power is converted to visible light and hardly converted to infrared light, and thus the heat generation of the LED is as large as about 70 to 85% of the input power. In addition, in order to supply power to the LED, a power supply board on which a power supply component for converting alternating current into direct current is mounted, and heat is also generated from the power supply board.

  For example, in the lighting fixture disclosed in Patent Document 1, the semiconductor light emitting element 521 is disposed in the fixture main body 510, but is separated from the globe 550, so that the semiconductor light emitting element 521 generates a large amount of heat. It is considered that the portion is transmitted to the instrument body 510 by heat conduction. Moreover, the space | interval of the clearance gap between the instrument main body 510 and the instrument attachment surface A is small compared with the length dimension (For example, the outer dimension of the instrument main body along the clearance gap between the instrument main body 510 and the instrument attachment surface A). For this reason, there is little air flow between the periphery of the lighting device and the gap. For this reason, the cooling effect on the upper surface of the instrument body 510 by air is small, and most of the heat generated by the semiconductor light emitting element 521 is considered to be transmitted to the instrument mounting surface A via the instrument body 510.

  In order to obtain a luminous flux equivalent to that of a lighting device using a conventional fluorescent lamp, it is necessary to supply desired power to the semiconductor light emitting element 521 even in the lighting apparatus described in Patent Document 1, and the semiconductor light emitting element 521 emits light. Heat may be transmitted from the instrument body 510 to the ceiling, and the ceiling temperature may exceed the heat resistance temperature.

  On the other hand, if the mounting interval between the mounting surface of the lighting fixture and the fixture main body is increased, the flow of air between the periphery of the lighting fixture and the gap increases, the cooling effect of the upper surface of the fixture main body 510 by the air increases, and the ceiling The amount of heat transmitted can be reduced. However, in general ceiling lights and the like, it is desired that the distance between the mounting surface of the lighting fixture and the fixture main body 510 is small in appearance, so there is a measure for changing the spacing between the mounting surface of the lighting fixture and the fixture main body 510. It is difficult to implement.

  Further, if the semiconductor light emitting element 521 is disposed on both the instrument body 510 and the globe 550, the heat generated by the semiconductor light emitting element 521 is transmitted to both the instrument body 510 and the globe 550, but the globe 550 is made of a transparent member. Usually, the thermal conductivity is low, and the effect of reducing the amount of heat transmitted to the ceiling is very small.

  This invention is made | formed in view of the said subject, and it aims at providing the illuminating device which can reduce the calorie | heat amount transmitted to a ceiling.

  The lighting device according to the present invention includes a chassis, a translucent cover attached to the chassis and having an opening, a cover covering the opening, and a space between the chassis, the translucent cover, and the cover. In the lighting device including the light source unit provided, the light source unit is fixed, and includes a heat radiating member thermally connected to the chassis and the cover cover, and the heat emissivity of the cover cover is the heat emissivity of the chassis. It is characterized by being larger.

  The illumination device according to the present invention includes a power supply board on which a power supply component that supplies power to the light source unit is mounted, and the power supply board is thermally connected to the heat dissipation member.

  In the lighting device according to the present invention, the thermal emissivity of the chassis is 0.1 or less, and the thermal emissivity of the cover cover is 0.8 to 0.95.

  The illuminating device according to the present invention is characterized in that a reflective coating is applied to a surface of the chassis.

  The illuminating device according to the present invention is characterized in that the chassis is made of metal and the surface thereof is polished.

  The illumination device according to the present invention is characterized in that the cover cover is made of synthetic resin.

  The illuminating device according to the present invention is characterized in that the cover cover is provided with a radioactive coating on the surface.

  The lighting device according to the present invention is characterized in that the cover cover is anodized aluminum or aluminum alloy.

  The lighting device according to the present invention includes a metal inner cover that covers an internal part in the opening, and the cover cover is detachable and thermally connected to the inner cover. Further, the heat radiation member is thermally connected.

  In the present invention, the chassis and the cover cover are thermally connected to the heat dissipation member to which the light source unit is fixed, and the thermal emissivity of the cover cover is greater than the thermal emissivity of the chassis. Thermal radiation refers to a process or radiation in which an object radiates heat as an electromagnetic wave, and the thermal emissivity is a ratio when a black body is 1. Compared to the case where the thermal emissivity of the chassis and the surface of the transmission cover forming the lower surface of the lighting device is equal, if the thermal emissivity of the chassis is smaller, the radiant heat from the upper surface side of the lighting device is reduced and the amount of heat transmitted to the ceiling Can reduce the temperature rise of the ceiling. When the thermal emissivity of the cover cover increases, the radiant heat from the lower surface side of the lighting device increases. Since the total amount of heat generated from the light source unit, which is a heat source, is constant, the amount of heat transmitted to the ceiling is reduced by the amount of heat radiation from the lower surface side.

  In the present invention, a power supply board on which a power supply component that supplies power to the light source unit is mounted, and the power supply board is thermally connected to the heat dissipation member. Thus, more heat generated from the power supply component can be radiated from the cover cover than from the chassis.

  In the present invention, the thermal emissivity of the chassis is 0.1 or less, and the thermal emissivity of the cover cover is 0.8 to 0.95. In order to reduce the thermal emissivity of the chassis to 0.1 or less, for example, a reflective coating is applied to the surface of the chassis, or a surface of a metal chassis such as aluminum or iron is polished. Can do. Moreover, in order to make the thermal emissivity of the cover cover 0.8 to 0.95, it is realized by making the cover cover material made of synthetic resin, applying a radioactive coating to the surface, or applying an alumite treatment. can do. By setting the thermal emissivity of the chassis to 0.1 or less and the thermal emissivity of the cover cover from 0.8 to 0.95, the heat radiation from the chassis is suppressed and the heat radiation from the cover cover is promoted. Therefore, the amount of heat transferred to the ceiling can be reduced.

  In the present invention, the chassis has a reflective coating on the surface. Thereby, the thermal emissivity of a chassis can be 0.1 or less, and the thermal radiation from a chassis can be suppressed.

  In the present invention, the chassis is made of metal (for example, aluminum, iron, etc.), and the surface is polished. Thereby, the thermal emissivity of a chassis can be 0.05 or less, and the thermal radiation from a chassis can further be suppressed.

  In the present invention, the cover cover is made of synthetic resin (for example, polycarbonate, polyester, polystyrene, etc.). Thereby, the thermal emissivity of a cover cover can be 0.8 or more, and the thermal radiation from a cover cover can be promoted.

  In the present invention, the cover cover has a radioactive coating on the surface. Thereby, the thermal emissivity of a cover cover can be made into 0.9 or more, and the heat radiation from a cover cover can further be accelerated | stimulated.

  In the present invention, the cover cover is anodized aluminum or aluminum alloy. Thereby, the thermal emissivity of the cover cover can be set to about 0.95, and the heat radiation from the cover cover can be further promoted.

  In the present invention, the opening is provided with a metal inner cover that covers the internal components, and the cover is detachable and thermally connected to the inner cover, and the heat radiating member is heated on the inner cover. Connected. As a result, even when a translucent cover is provided on the lower surface of the lighting device, the cover cover and the heat radiating member are thermally connected via the inner cover, and the heat of the light source unit or the power supply board is covered to the cover. It is possible to conduct heat and radiate heat from the cover cover.

  According to the present invention, by making the thermal emissivity of the cover cover larger than the thermal emissivity of the chassis, the radiant heat from the chassis side of the lighting device is reduced, and the amount of heat transmitted to the ceiling is reduced. Can be suppressed.

1 is a schematic external perspective view of a lighting device according to Embodiment 1. FIG. 1 is a schematic exploded perspective view of a lighting device according to Embodiment 1. FIG. FIG. 3 is a schematic cross-sectional view of the lighting device according to the first embodiment. FIG. 3 is a schematic cross-sectional view of a central portion of the lighting device according to the first embodiment. FIG. 3 is an explanatory diagram showing an arrangement of main parts of the lighting device according to the first embodiment. FIG. 3 is a schematic diagram of an LED module of the lighting device according to the first embodiment. FIG. 6 is a schematic cross-sectional view of a lighting device according to a second embodiment. It is typical sectional drawing of the conventional illuminating device.

(Embodiment 1)
Hereinafter, the present invention will be described with reference to the drawings showing embodiments thereof, taking as an example an illuminating device (for example, a ceiling light) that is detachably attached to a member to be attached such as a hook ceiling body provided on a ceiling. In addition, the illuminating device 100 of this Embodiment is not limited to a ceiling light.

  FIG. 1 is a schematic external perspective view of the lighting device 100 according to the first embodiment, FIG. 2 is a schematic exploded perspective view of the lighting device 100 according to the first embodiment, and FIG. 3 is a lighting device according to the first embodiment. 4 is a schematic cross-sectional view of 100, and FIG. 4 is a schematic cross-sectional view of a central portion of the illumination device 100 of the first embodiment. FIG. 4 is a partially enlarged view of FIG.

  As shown in FIG. 1, a lighting device 100 according to the present embodiment includes a chassis 1, a globe 8 as a translucent cover that is attached to the chassis 1 and has an opening, and an outer cover 9 as a cover that covers the opening. Etc. On the chassis 1 side of the lighting device 100 (that is, the upper surface side of the lighting device 100), a ceiling as a mounting surface to which the lighting device 100 is attached is opposed. The lighting device 100 is attached to the ceiling via an adapter 16 described later. That is, the chassis 1 is the upper surface side of the lighting device 100, and the globe 8 and the outer cover 9 are the lower surface side of the lighting device 100.

  As shown in FIGS. 2 and 3, the chassis 1 includes a disk-shaped base portion 11 having a circular hole in the center, a continuous portion 12 continuously provided in a direction intersecting with an outer edge portion of the base portion 11, A wide annular portion 13 that is connected to the outer edge portion of the portion 12 and is parallel to the base portion 11, a peripheral wall portion 14 that is erected on the annular portion 13, and the like.

  The chassis 1 is made of a metal such as aluminum or iron, and a heat sink that dissipates heat from a power source board 61 on which an LED module 2 as a light source unit described later and a power supply component 62 for supplying power to the LED module 2 are mounted. It also has the function as

  By applying a surface treatment for reducing the emissivity to the upper surface 11b of the chassis 1, the thermal emissivity of the chassis 1 is reduced. For example, a material having low emissivity (high reflectivity) such as reflective coating is applied to the surface 11b. Thereby, the thermal emissivity of the chassis 1 can be made 0.1 or less, for example. Thermal radiation refers to a process or radiation in which an object radiates heat as an electromagnetic wave, and the thermal emissivity is a ratio when a black body is 1. Further, when the transmittance is zero with an opaque member, emissivity = 1−reflectance.

  Further, instead of applying the reflective coating to the surface 11b of the chassis 1, the surface roughness can be reduced by mechanical means such as polishing the surface 11b of the chassis 1. By polishing the surface 11b, the thermal emissivity of the chassis 1 can be reduced to about 0.05, and the thermal emissivity can be further reduced.

  As shown in FIG. 3, an adapter 16 can be attached to the attachment hole of the base 11 of the chassis 1. The adapter 16 has a flat cylindrical shape, and has a hook blade that engages with an engagement hole of a hook sealing body (not shown) provided on the ceiling, and a connector that is connected to a power source, on one end side.

  The adapter 16 is electrically and mechanically connected to the hook sealing body by engaging the hook blade with the engagement hole of the hook sealing body. By attaching the chassis 1 to the adapter 16, the chassis 1 is attached to the ceiling as an attachment surface.

  A light source holding part 3 as a heat radiating member to which the LED module 2 is fixed is attached to one surface 11 a of the base part 11 of the chassis 1. That is, the light source holding unit 3 has a function of fixing and holding the LED module 2 and radiating heat generated by the LED module 2.

  FIG. 5 is an explanatory diagram showing the arrangement of the main parts of the lighting device 100 of the first embodiment, and FIG. 6 is a schematic diagram of the LED module 2 of the lighting device 100 of the first embodiment. As shown in FIG. 6, the LED module 2 includes a rectangular plate-shaped LED substrate 21, a plurality of LEDs 22 mounted on the LED substrate 21, and the like.

  The LED substrate 21 is made of a metal such as iron or aluminum, and also serves as a heat conductor that conducts heat generated by the LED 22 to the light source holding unit 3. In addition, in order to approximate the thermal expansion coefficient of the synthetic resin in the case outside the LED 22, the LED substrate 21 is more preferably made of iron.

  Hereinafter, the internal structure of the illumination device 100 will be described with reference to FIGS.

  As shown in FIG. 4, the light source holder 3 is a rectangular plate-like holding plate 32 to which the LED module 2 is attached, and is erected on one side of the long side of the holding plate 32, and is attached to the base 11 of the chassis 1. A fixing part 31 to be fixed and a holding part 33 that is provided in parallel on the other side of the long side of the holding plate part 32 (opposite side of the fixing part 31) facing the fixing part 31 and holds a power supply cover 60 described later. , An engaging claw 34 for holding a power supply board 61 described later, an engaging claw 35 for holding a control board 7 described later, and the like.

  On the holding plate portion 32, the LED module 2 is mounted on the non-mounting surface of the LED substrate 21 (the surface opposite to the surface on which the LEDs 22 are mounted) so that the longitudinal direction of the LED substrate 21 is the longitudinal direction of the holding plate portion 32. It is fixed with. The light source holding unit 3 is made of a metal such as iron or aluminum, and also serves as a heat conductor that conducts heat from the LED module 2 that is a heating element to the chassis 1 and the power supply cover 60.

  As shown in FIGS. 2 and 4, the light source holding unit 3 is configured so that the surface on which the LED module 2 of the holding plate unit 32 is attached is outside and the holding plate unit 32 forms a regular octagonal peripheral wall. The base portion 11 of the chassis 1 is fixed to the fixing portion 31 with a substantially equal distribution in the circumferential direction. In addition, between the adjacent light source holding parts 3, it fixes and connects with a screw | thread etc.

  By attaching the fixing portion 31 of the light source holding portion 3 to the chassis 1 as described above, the LED module 2 is held so that the LED substrate 21 is substantially perpendicular to the radial direction of the chassis 1. As shown in FIG. The LED modules 2 are arranged on the chassis 1 in the shape of a regular octagon. When the LED module 2 is turned on, the light emitted from the LED module 2 is emitted radially from the center of the base 11 of the chassis 1 toward the outer edge.

  As shown in FIG. 2, the chassis 1 is provided with a reflection sheet 4 made of synthetic resin that reflects light from the LED module 2. The reflection sheet 4 includes a disc portion 41 having an octagonal hole in the center, a peripheral wall portion 42 standing on the outer peripheral edge of the disc portion 41, and the like.

  As shown in FIGS. 3 and 4, the disc portion 41 has the lower surface 41 a curved so as to be gradually concave from the center portion toward the outer edge portion. The reflective sheet 4 is attached to the chassis 1 so that the surface on the opposite side of the lower surface 41 a faces the chassis 1.

  As shown in FIGS. 2 and 4, a top plate reflection sheet 5 that reflects light from the LED module 2 toward the reflection sheet 4 is provided on the inner surface (inner surface) of the holding unit 33 of the light source holding unit 3. It is. The top plate reflection sheet 5 is made of a synthetic resin and has a disk shape having an octagonal hole in the center. The top plate reflection sheet 5 is fixed to the inner surface of the holding part 33 of the light source holding part 3, and is attached to the opposite side of the reflection sheet 4 with the LED module 2 in between.

  As shown in FIGS. 2 and 4, a power supply unit 6 is disposed in a portion surrounded by two light source holding units 3 in the base 11 of the chassis 1. The power supply unit 6 is mounted on a substantially C-shaped power supply board 61, a power supply board 61, a rectifier circuit that rectifies a current supplied from an AC power supply (AC power supply), and a voltage that converts the rectified voltage into a predetermined voltage. A power supply component 62 such as a conversion circuit is provided.

  The power supply board 61 is disposed between the power supply board support part 63 and the holding plate part 32 of the light source holding part 3. The power supply board 61 is thermally connected to the light source holding unit 3.

  The power supply board support portion 63 is semicircular in plan view and is attached to the peripheral edge portion of the attachment hole of the base portion 11 of the chassis 1. An engagement recess 63 a that engages with the adapter 16 is formed on the inner surface of the power supply substrate support 63. On the outer surface of the power supply board support part 63, a holding part 63b for holding the power supply board 61 of the power supply part 6 is provided. In the power supply unit 6, the power supply board 61 is held by the engaging claw 34 of the light source holding part 3 and the holding part 63 b of the power supply board support part 63 and held by the base 11 of the chassis 1. Between the power supply unit 6 and the base 11 of the chassis 1, an insulating sheet 64 is held by the light source holding unit 3 and the power supply substrate support unit 63.

  As shown in FIGS. 2 and 4, a rectangular control board 7 is provided with a control board support 73 on the base 11 on the opposite side of the power supply 6 with the adapter 16 positioned in the center of the lighting device 100 in between. Is provided. On the control board 7, electronic components such as a control microcomputer (not shown) and dimming circuit components are mounted.

  The control board support part 73 includes an engagement recess 73a that engages with the adapter 16 on the inner surface, and a cylindrical support cylinder 73b that supports the control board 7 on the outer surface. The control board 7 is held on the base 11 of the chassis 1 by supporting the control board 7 by the engaging claws 35 of the light source holding part 3 and the support cylinder 73 b of the control board support part 73. The control board 7 is provided with a receiving unit 75 that receives a signal from a remote controller (remote operation terminal device).

  As described above, by attaching the power supply unit 6 and the control board 7 to the two light source holding units 3, the power supply board support unit 63, and the control board support unit 73 that are connected so as to form a regular octagonal peripheral wall. The LED module 2, the power supply unit 6 and the control board 7 can be integrated, and a compact unit can be formed.

  As shown in FIG. 2, the power supply unit 6 is electrically connected to the LED module 2 by electric wires 66 and 67. The LED modules 2 are electrically connected by an electric wire 69. The power supply unit 6 is electrically connected to the control board 7 by an electric wire 68.

  As shown in FIG. 4, a control unit 6 and a control board 7 are accommodated in a space formed by the base 11 of the chassis 1 and the light source holding unit 3, and internal components such as the control unit 6 and the control board 7 are It is covered with a power supply cover 60 as a metal inner cover.

  The power supply cover 60 includes a disc-shaped lid portion 60a having a circular hole in the center, a peripheral wall portion 60b erected on the inner edge of the lid portion 60a, and a lid portion 60a from the opposite side of the lid portion 60a of the peripheral wall portion 60b. And an annular portion 60c that is provided in parallel with the annular portion 60c. In the power supply cover 60, the annular portion 60 c is placed on the power supply substrate support portion 63 and the control substrate support portion 73, and the outer edge portion of the lid portion 60 a is fixed to the holding portion 33 of the light source holding portion 3 with screws or the like.

  As described above, the chassis 1 to which the LED module 2, the power supply unit 6, the control board 7, and the power supply cover 60 are attached is provided with a light diffusing globe 8 that covers the LED module 2 and the reflection sheet 4.

  As shown in FIGS. 2 and 3, the globe 8 includes a disk-shaped annular portion 81 having a circular hole in the center, a peripheral wall portion 82 erected on the outer peripheral edge of the annular portion 81, and the like. The globe 8 is attached to the peripheral wall portion 14 of the chassis 1 by a peripheral wall portion 82. Since the LED module 2 is accommodated in the space formed by the globe 8, the light source holding unit 3, and the chassis 1, only the LED module 2 can be sealed.

  As shown in FIG. 4, a disc-shaped outer cover 9 is detachably attached to the lid portion 60 a of the power supply cover 60. The outer cover 9 is provided with a circular hole for receiving a signal from the remote controller, and a cover 90 is fitted in the hole.

  The outer cover 9 is made of a synthetic resin such as polycarbonate, polyester, or polystyrene. Thereby, the thermal emissivity of the outer cover 9 can be 0.8 or more.

  The outer cover 9 is not limited to being made of synthetic resin. Surface treatment for increasing the emissivity can also be applied to the lower surface side (surface facing the floor surface) of the outer cover 9. For example, the surface of the outer cover 9 made of synthetic resin or metal may be subjected to radioactive coating (a material having a high emissivity is applied). Thereby, the thermal emissivity of the outer cover 9 can be made 0.9 or more.

  Further, the outer cover 9 can be made of anodized aluminum or aluminum alloy (so-called alumite treatment). Thereby, the thermal emissivity of the cover cover can be set to about 0.95.

  By configuring the outer cover 9 as described above, the thermal emissivity of the outer cover can be about 0.8 to 0.95, compared with the thermal emissivity of the chassis 1 (0.1 or less). The thermal emissivity of the outer cover 9 can be increased.

  The lighting device body assembled as described above is attached to the adapter 16 so that the surface 11b side of the base 11 of the chassis 1 is on the ceiling side, and the connector of the adapter 16 and the connector connected to the power supply unit 6 are connected. After that, the outer cover 9 is attached to the lighting device main body. The lighting device main body can be attached to and removed from the ceiling by removing the outer cover 9, and since it is not necessary to remove the globe 8 and the like, the internal components such as the LED module 2 can be kept sealed. .

  In the lighting device 100 attached to the ceiling, the power supply unit 6 is connected to a commercial power supply (AC voltage) via the adapter 16 and the hooking ceiling body. When the power-on switch is turned on with the lighting device 100 mounted on the ceiling, an AC voltage is applied to the power supply unit 6, and predetermined DC voltage and DC current converted by the power supply unit 6 are supplied to the LED module 2. The LED 22 of the LED module 2 is turned on.

  Light is emitted from the LED module 2 in the direction from the center of the lighting device 100 toward the outer edge, in other words, from the center of the chassis 1 toward the outer edge, and the light is reflected by the reflection sheet 4 and the top plate reflection sheet 5. The irradiation is mainly performed in the direction intersecting the light emitting direction of the LED module 2 (direction intersecting the ceiling surface). The light reflected by the reflection sheet 4 and the top plate reflection sheet 5 is incident on the inner surface 81 a of the globe 8 and is emitted from the outer surface 81 b of the globe 8 to the outside of the illumination device 100 while diffusing inside the globe 8.

  Most of the heat generated in the LED module 2 is transmitted to the light source holding unit 3 that is a heat radiating member, is transmitted through the light source holding unit 3 by heat conduction, and is thermally connected to the light source holding unit 3 and the power source cover 60. It is transmitted to. Further, the heat transmitted to the power supply cover 60 is transmitted to the outer cover 9 that is thermally connected to the power supply cover 60.

  As described above, in the present embodiment, the chassis 1 and the outer cover 9 are thermally connected to the light source holding unit 3 to which the LED module 2 is fixed, and the thermal emissivity of the outer cover 9 is greater than the thermal emissivity of the chassis 1. large. Compared with the case where the thermal emissivity of the upper side surface and the lower side surface of the lighting device is equal, when the thermal emissivity of the chassis 1 becomes smaller, the radiant heat from the upper surface side of the lighting device 100 decreases and the amount of heat transmitted to the ceiling decreases. Therefore, the temperature rise of the ceiling can be suppressed. Further, when the thermal emissivity of the outer cover 9 increases, the radiant heat from the lower surface side of the lighting device 100 increases. Since the total amount of heat generated from the LED module 2 as a heat source is constant, the amount of heat transmitted to the ceiling can be reduced by the amount of heat radiation from the lower surface side.

  In the present embodiment, since the power supply substrate 61 on which the power supply component for supplying power to the LED module 2 is mounted is thermally connected to the light source holding unit 3 as a heat radiating member, the heat generated from the power supply component is also reduced. More radiation can be emitted from the outer cover 9 than radiation from the chassis 1.

  Moreover, in this Embodiment, the thermal emissivity of the chassis 1 is 0.1 or less, and the thermal emissivity of the outer cover 9 is 0.8-0.95. By setting the thermal emissivity of the chassis 1 to 0.1 or less and the thermal emissivity of the outer cover 9 to 0.8 to 0.95, thermal radiation from the chassis 1 is suppressed and Since heat radiation is promoted, the amount of heat transferred to the ceiling can be reduced.

  In the present embodiment, the chassis 1 has a reflective coating on the surface. Thereby, the thermal emissivity of the chassis 1 can be made 0.1 or less, and the thermal radiation from the chassis 1 can be suppressed.

  In the present embodiment, the chassis 1 is made of metal (for example, aluminum, iron, etc.), and the surface is polished. Thereby, the thermal emissivity of the chassis 1 can be made 0.05 or less, and the thermal radiation from the chassis 1 can be further suppressed.

  In the present embodiment, the outer cover 9 is made of a synthetic resin (for example, polycarbonate, polyester, polystyrene, etc.). Thereby, the thermal emissivity of the outer cover 9 can be 0.8 or more, and the thermal radiation from the outer cover 9 can be promoted.

  In the present embodiment, the outer cover 9 has a radioactive coating on the surface. Thereby, the thermal emissivity of the outer cover 9 can be set to 0.9 or more, and the thermal radiation from the outer cover 9 can be further promoted.

  In the present embodiment, the outer cover 9 is anodized aluminum or aluminum alloy. Thereby, the thermal emissivity of the outer cover 9 can be set to about 0.95, and the thermal radiation from the outer cover 9 can be further promoted.

  Further, in the present embodiment, a metal power supply cover 60 that covers the internal components is provided in the opening at the center of the globe 8, and the outer cover 9 is detachably attached to the power supply cover 60 so as to be thermally connected. The power supply cover 60 is thermally connected to the light source holding unit 3. Thereby, even when the globe 8 is disposed on the lower surface of the lighting device 100, the outer cover 9 and the light source holding unit 3 are thermally connected via the power supply cover 60, and the LED module 2 or the power supply board 61 is connected. This heat can be conducted to the outer cover 9 and radiated from the outer cover 9.

  The light source holding unit 3 and the power source cover 60 are made of metal, and the outer cover 9 is connected to the LED 22 via the power source cover 60 and the light source holding unit 3. Since the heat transfer path from the LED 22 to the outer cover 9 is composed of a heat conductor, the resistance of heat conduction from the LED 22 to the outer cover 9 is small. For this reason, the influence of the resistance of radiation from the outer cover 9 to the outside air becomes large in the total of the thermal resistance from the LED 22 through the outer cover 9 to the outside air. For this reason, the effect of reducing the heat transfer to the ceiling by making the emissivity of the outer cover 9 larger than the emissivity of the chassis 1 becomes larger.

  Since the outer cover 9 is disposed inside the globe 8, the outer cover 9 may be a non-permeable member. For this reason, if a heat conductor such as iron or aluminum is used as the material of the outer cover 9, the effect of suppressing heat transfer to the ceiling can be further increased.

  As described above, in an illumination device using an LED as a light source, even when the heat generation is larger than when an incandescent bulb or a fluorescent lamp is used as the light source, and the gap between the upper surface of the illumination device and the ceiling is narrow. Moreover, according to this Embodiment, the heat transfer from the illuminating device 100 to a ceiling can be reduced, and the temperature of a ceiling can be made less than heat-resistant temperature.

(Embodiment 2)
FIG. 7 is a schematic cross-sectional view of the illumination device 200 according to the second embodiment. The second embodiment is different from the first embodiment in that it does not include the reflection sheet 4 and the top plate reflection sheet 5 provided in the illumination device 100 of the first embodiment.

  As shown in FIG. 7, the chassis 101 includes a disk-shaped base 111 having a circular hole in the center, a continuous portion 112 connected in a direction intersecting the outer edge of the base 111, and the continuous portion 112. A wide annular portion 113 that is connected to the outer edge portion and is parallel to the base 111, a peripheral wall portion 114 that is erected on the annular portion 113, and the like. Reflective coating is applied to the inner wall surface 111 a of the base 111. The chassis 101 is made of a metal such as iron or aluminum, and also has a function as a heat sink that dissipates heat from a heating element such as the LED module 102 serving as a light source unit.

  The light source holding portion 103 is a rectangular plate-like holding plate portion 132 to which the LED module 102 is attached, a standing portion 131 that is erected on one side of the long side of the holding plate portion 132 and is fixed to the base portion 111 of the chassis 101, On the other side of the long side of the holding plate portion 132 (on the opposite side of the fixing portion 131), a holding portion 133 that is provided in parallel to face the fixing portion 131 and holds the power supply cover 160 is provided.

  The LED module 102 is attached to the light source holding unit 103. A reflection coating for reflecting light from the LED module 102 toward the chassis 101 is applied to the inner surface 133 a of the holding portion 133 of the light source holding portion 103.

  The adapter 116 is electrically and mechanically connected to the hook sealing body by engaging the hook blade with the engagement hole of the hook sealing body. By attaching the chassis 101 to the adapter 116, the chassis 101 is attached to the ceiling as an attachment surface.

  The globe 108 includes a disk-shaped annular portion 181 having a circular hole in the center, a peripheral wall portion 182 standing on the outer peripheral edge of the annular portion 181, and the like. The globe 108 is attached to the peripheral wall portion 114 of the chassis 101 at the peripheral wall portion 182.

  A power supply unit 106 is disposed in a portion surrounded by the two light source holding units 103 in the base unit 111 of the chassis 101. The power board support part 163 is semicircular in plan view, and is attached to the peripheral part of the attachment hole of the base part 111 of the chassis 101. A rectangular control board 107 is provided via a control board support section 173 on the base 111 opposite to the power supply section 106 with the adapter 116 positioned at the center of the lighting device 200 interposed therebetween.

  A control unit 106 and a control board 107 are accommodated in a space formed by the base 111 and the light source holding unit 103 of the chassis 101. Internal parts such as the control unit 106 and the control board 107 are used as a metal inner cover. Covered with a power supply cover 160.

  A disk-shaped outer cover 109 is detachably attached to the power supply cover 160. The chassis 101 is the same as the chassis 1, and the outer cover 109 is the same as the outer cover 9. The power supply cover 160 is the same as the power supply cover 60.

  That is, the thermal emissivity of the chassis 101 is 0.1 or less, and the thermal emissivity of the outer cover 109 is 0.8 to 0.95. By setting the thermal emissivity of the chassis 101 to 0.1 or less and the thermal emissivity of the outer cover 109 to 0.8 to 0.95, the thermal radiation from the chassis 101 is suppressed and the thermal emissivity from the outer cover 109 is suppressed. Since heat radiation is promoted, the amount of heat transferred to the ceiling can be reduced.

  Also in the lighting apparatus 200 of the second embodiment, most of the heat generated in the LED module 102 is transmitted to the light source holding unit 103 and is transmitted through the light source holding unit 103 by heat conduction, and from the light source holding unit 103 to the chassis 101 and the power supply cover. 160. Further, the heat transferred to the power supply cover 160 is transferred to the outer cover 109.

  Similar to the first embodiment, the emissivity on the illumination upper surface side of the chassis 101 is 0.1 or less, which is smaller than the emissivity (about 0.8 to 0.95) on the illumination lower surface side of the outer cover 109. For this reason, compared with the case where the emissivities of the upper side surface and the lower side surface of the lighting device are equal, the radiation from the upper surface side of the lighting device 200 is suppressed and the radiation from the lower side surface of the lighting device 200 is promoted. The amount of heat transferred can be reduced.

  Also in the lighting apparatus 200 of the second embodiment, the light source holding unit 103 and the power source cover 160 are made of metal, and the outer cover 109 is connected to the LED 122 via the power source cover 160 and the light source holding unit 103. Since the heat transfer path from the LED 122 to the outer cover 109 is composed of a heat conductor, the resistance of heat conduction from the LED 122 to the outer cover 109 is small. For this reason, the influence of the radiation resistance from the outer cover 109 to the outside air becomes larger in the total thermal resistance from the LED 122 through the outer cover 109 to the outside air. For this reason, when the emissivity of the outer cover 109 is made larger than the emissivity of the chassis 101, the heat transfer to the ceiling can be reduced more effectively.

  Further, since the outer cover 109 is disposed inside the globe 108, the outer cover 109 may be a non-permeable member. For this reason, if a heat conductor such as iron or aluminum is used as the material of the outer cover 109, for example, the effect of suppressing heat transfer to the ceiling can be further increased.

  Also in the second embodiment, in a lighting device that uses LEDs as a light source, even when the heat generation is larger than when an incandescent bulb or a fluorescent lamp is used as the light source, or when the gap between the top surface of the lighting device and the ceiling is narrow Even so, according to the present embodiment, heat transfer from lighting device 200 to the ceiling can be reduced, and the temperature of the ceiling can be made lower than the heat-resistant temperature.

  In Embodiments 1 and 2 described above, the LED substrate is arranged in the chassis so as to have an octagonal shape, but is not limited thereto, and may be a polygonal shape other than an octagonal shape or a circular shape.

  In the first embodiment, both the reflection sheet 4 and the top plate reflection sheet 5 are used as the reflection member, but only the reflection sheet 4 may be used. In the second embodiment, the reflective coating is applied to the inner wall surface 111a of the chassis and the inner surface 133a of the holding portion 133, but only the inner wall surface 111a of the chassis may be used.

  The present invention can be implemented in variously modified forms within the scope of the matters described in the claims.

1, 101 Chassis 2, 102 LED module (light source)
3, 103 Light source holder (heat radiating member)
6, 106 Power supply unit 8, 108 Globe (translucent cover)
9, 109 Outer cover (cover cover)
21 LED board 22 LED
60, 160 Power supply cover (inner cover)
61 Power supply board 62 Power supply parts

Claims (9)

A chassis, a translucent cover attached to the chassis and having an opening, a cover cover covering the opening, and a light source unit provided in a space between the chassis and the translucent cover and the cover cover In the lighting device,
The light source unit is fixed, and includes a heat radiating member thermally connected to the chassis and the cover.
The lighting device according to claim 1, wherein a thermal emissivity of the cover cover is larger than a thermal emissivity of the chassis. A power supply board mounted with a power supply component for supplying power to the light source unit;
The lighting device according to claim 1, wherein the power supply board is thermally connected to the heat radiating member. The thermal emissivity of the chassis is 0.1 or less,
The lighting device according to claim 1, wherein the cover cover has a thermal emissivity of 0.8 to 0.95. The chassis is
The lighting device according to any one of claims 1 to 3, wherein the surface is coated with a reflective coating. The chassis is
The lighting device according to any one of claims 1 to 3, wherein the lighting device is made of metal and the surface thereof is polished. The covering cover is
The lighting device according to any one of claims 1 to 5, wherein the lighting device is made of a synthetic resin. The covering cover is
The lighting device according to any one of claims 1 to 6, wherein the surface is coated with radioactive coating. The covering cover is
The lighting device according to any one of claims 1 to 5, wherein the lighting device is anodized aluminum or an aluminum alloy. Provided with a metal inner cover covering the internal parts in the opening,
The cover cover is detachable and thermally connected to the inner cover,
The lighting device according to any one of claims 1 to 8, wherein the heat radiating member is thermally connected to the inner cover.

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