JP2010278037A - Electronic component mounting device - Google Patents

Abstract

An object of the present invention is to improve the production efficiency of a printed circuit board by allowing a plurality of suction nozzles to be lowered at the same time for taking out the electronic parts from the component supply apparatus or mounting the electronic parts on the printed circuit board.
The voice coil motor corresponding to the suction nozzle 5 corresponding to the component type of the electronic component to be taken out is energized, and the magnet and the nozzle shaft 27 are moved against the biasing force of the coil spring 40 by the electromagnetic force generated in the coil 37. The cam follower 28 is pressed against the roller rest 23 from above, and the suction nozzle 5 is lowered as the nozzle suspension support 11 is lowered, and the electronic component is sucked and taken out from a predetermined component supply unit. At this time, since the voice coil motor corresponding to the suction nozzle 5 that does not take out the electronic component is not energized, the nozzle suspension support 11 is lowered, but the suction nozzle 5 that does not take out the electronic component is raised by the biasing force of the coil spring 40. It does not descend.
[Selection] Figure 2

Description

  The present invention relates to an electronic component mounting apparatus that takes out electronic components supplied from a component supply device by a plurality of suction nozzles provided on a mounting head and mounts the electronic components on a printed board.

  The electronic component mounting apparatus is disclosed in, for example, Patent Document 1, but generally includes a plurality of suction nozzles when taking out an electronic component from the electronic component supply apparatus or mounting the electronic component on a printed circuit board. Even so, only one suction nozzle can be lowered for taking out the electronic component or mounting the electronic component.

JP 2009-60132 A

  However, in this way, in the case where only one suction nozzle can be lowered for taking out an electronic component or mounting an electronic component, a plurality of suction nozzles cannot be used at the same time. This was a problem in improving the production efficiency of printed circuit boards.

  Therefore, the present invention aims to improve the production efficiency of the printed circuit board by allowing a plurality of suction nozzles to be lowered at the same time for taking out the electronic component from the component supply device or mounting the electronic component on the printed circuit board. With the goal.

For this reason, according to a first aspect of the present invention, there is provided an electronic component mounting apparatus that takes out electronic components supplied from a component supply device by a plurality of suction nozzles provided on the mounting head and mounts them on a printed circuit board.
Suspending and supporting the plurality of suction nozzles on the suspension support in a state of being constantly urged by each urging body,
Each suction nozzle can be moved up and down with respect to the mounting head by each nozzle lifting drive source.

According to a second aspect of the present invention, there is provided an electronic component mounting apparatus for taking out electronic components supplied from a component supply device by a plurality of suction nozzles provided on the mounting head and mounting the electronic components on a printed circuit board.
Suspending and supporting the plurality of suction nozzles on a suspension support in a state of being urged so as to be constantly raised with respect to the mounting head by each urging body,
Each suction nozzle can be raised and lowered with respect to the mounting head by each nozzle raising and lowering drive source,
When mounting electronic components on a printed circuit board, the lifting drive source of the suspension support is driven to lower the suspension support relative to the mounting head, and the corresponding nozzle lifting drive source is not driven. The nozzle is not lowered by the urging force of the urging body, and the suction nozzle driven by the corresponding nozzle lifting drive source is lowered against the urging force of the urging body.

  According to a third invention, in the first or second invention, the nozzle raising / lowering drive source is a voice coil motor.

  According to a fourth invention, in the first or second invention, the nozzle raising / lowering drive source is an air cylinder.

  According to the present invention, a plurality of suction nozzles can be lowered at the same time for taking out an electronic component from a component supply device or mounting an electronic component on a printed circuit board, thereby improving the production efficiency of the printed circuit board. be able to.

The top view of an electronic component mounting apparatus is shown. It is a front view of the mounting head body of a 1st embodiment. It is a top view of the mounting head of a 1st embodiment. It is a front view of the mounting head body of a 1st embodiment which cut a voice coil motor longitudinally. The front view of the mounting | wearing head body of 1st Embodiment of the state which one suction nozzle fell is shown. The front view of the mounting | wearing head body of 1st Embodiment of the state which two suction nozzles fell is shown. It is a front view of the mounting head body of a 2nd embodiment. It is a front view of the mounting head body of 2nd Embodiment which cut the air cylinder vertically. The front view of the mounting | wearing head body of 2nd Embodiment of the state in which one adsorption nozzle fell is shown. The front view of the mounting | wearing head body of 2nd Embodiment of the state which two suction nozzles fell is shown.

  An embodiment of an electronic component mounting apparatus 1 for mounting an electronic component on a printed circuit board P, which is a circuit board provided with a circuit on the substrate, will be described below with reference to FIG. The electronic component mounting device 1 includes a transport device 2 for transporting the printed circuit board P, a component supply device 3 for supplying electronic components disposed on the front side and the back side across the transport device 2, and a drive. A pair of beams 4A and 4B movable in one direction (Y direction) by a source and a plurality (for example, 14) of suction nozzles 5 are provided, and each drive source is provided in a direction along each of the beams 4A and 4B. A movable mounting head body 6 is provided.

  The transport device 2 is disposed in an intermediate part of the electronic component mounting device 1, and includes a substrate supply unit that inherits the printed circuit board P from the upstream device, and an electronic component that is sucked and held by the suction nozzle 5 of each mounting head body 6. A board positioning unit that positions and fixes the printed board P supplied from the board supply unit for mounting, and a board discharge unit that inherits the printed board P on which the electronic component is mounted and transfers the printed board P to the downstream device. Composed.

  The component supply device 3 includes a feeder base 3A attached to the main body of the electronic component mounting device 1, and a plurality of electronic components arranged in parallel on the feeder base 3A, one for each component take-out portion (component suction position). It is composed of a group of component supply units 3B that supply each one. The component supply unit 3B is equipped with a storage tape that covers a large number of electronic components with cover tapes that are stored at regular intervals in each storage section formed of a concave portion of the carrier tape. By peeling the cover tape, one electronic component is supplied to the component extraction unit of the component supply unit 3B one by one and is extracted from each storage unit by the suction nozzle 5 of the mounting head body 6.

  The pair of front and rear beams 4A and 4B that are long in the X direction are individually moved by sliding sliders fixed to the beams 4A and 4B along a pair of left and right front and rear guides driven by a Y direction linear motor. Move in the Y direction. The Y-direction linear motor includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 7A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. Consists of

  The beams 4A and 4B are respectively provided with the mounting head bodies 6 that move along the guides in the longitudinal direction (X direction) by an X-direction linear motor (not shown). The linear motor includes a pair of front and rear stators fixed to the beams 4A and 4B, and a mover provided on the mounting head body 6 and positioned between the stators.

  Accordingly, each mounting head body 6 is provided inside each beam 4A, 4B so as to face each other, and moves above the component pick-up position of the printed circuit board P and the component supply unit 3B on the positioning portion of the transport device 2.

  Next, the first embodiment of the mounting head body 6 will be described with reference to FIGS. 2 to 6. Reference numeral 11 denotes a nozzle suspension support body that suspends and supports the suction nozzle 5 via a nozzle shaft 27. A ball screw 16 rotated by a nozzle lifting / lowering motor 15 is fitted to a nut body 13 provided on the upper part of the nozzle suspension support 11, and the ball screw 16 is rotated by driving of the nozzle lifting / lowering motor 15, thereby guiding the guide. The nozzle suspension support body 11 moves up and down through the nut body 13 along the rail.

  In addition, 20 is a slip ring, 21 is a coupling, 22 is a rotary joint, and the inside of the roller rest body 24 provided with the roller rest 23 under the said nozzle suspension support body 11 has a vacuum suction pipe, a compression blowing pipe, and A pipe 25 in which the wiring cord is stored is rotatably arranged.

  A cam follower 28 is provided on the top of the mounting member 26 fixed to the nozzle shaft 27 connected to each suction nozzle 5. The cam follower 28 is engaged with the roller rest 23 from above, and the mounting head 12 has 14 suctions. The nozzles 5 are arranged on the circumference at predetermined intervals, and a rotor 30 of a θ drive motor 29 (direct drive motor) for rotating the mounting head 12 is built in. The rotor 30 is connected to the nozzle shaft. 27 penetrates so that raising and lowering is possible.

  Reference numeral 31 denotes a head rotation support body that rotatably supports the mounting head 12, and this rotation support body 31 is fixed to an attachment body (not shown) of the mounting head body 6 through a cable 32. A coil 33 is accommodated in the rotary support 31 and constitutes a θ drive motor 29 for rotating the mounting head 12 together with the rotor 30.

  Reference numeral 35 denotes a fixing member fixed to the upper portion of the mounting head 12, and a cylindrical coil 37 of the voice coil motor 36 is fixed to the upper portion of the fixing member 35. As shown in FIG. 4, the nozzle shaft 27 having a magnet 38 fixed to the outer periphery thereof is disposed in the cylindrical coil 37 so as to be movable up and down. A coil spring 40 as an urging member is disposed around the upper portion of the nozzle shaft 27. The upper end of the coil spring 40 is locked to the locking rod 41 and the lower end is locked to the upper end of the coil 37. The coil spring 40 urges the nozzle shaft 27 (suction nozzle 5) to always rise.

  That is, when the voice coil motor 36 is energized when taking out the electronic component from the component supply unit 3A or mounting the electronic component on the printed circuit board P, an electromagnetic force is generated in the coil 37, and the coil spring 40 The magnet 38 and the nozzle shaft 27 (the suction nozzle 5) are lowered by this electromagnetic force against the urging force.

  In addition, 8 is a component recognition camera that images the electronic component sucked and held by the suction nozzle 5, 9 is a substrate recognition camera for capturing a recognition mark for confirming the position of the printed circuit board P, and the substrate recognition camera 9 is It is mounted on each mounting head body 6.

  With the above configuration, when the electronic component mounting apparatus 1 is automatically operated, the first printed circuit board P is transported from the upstream apparatus to the board positioning unit by the transport apparatus 2, and is positioned and fixed by the positioning mechanism.

  Next, the mounting head body 6 moves according to the mounting data relating to the mounting coordinates of the electronic component stored in the storage device, and the electronic component to be mounted by the suction nozzle 5 corresponding to the component type of the electronic component to be mounted is predetermined. Are sucked out from the component supply unit 3B.

  More specifically, for example, an X-direction linear motor is placed in the X direction at a position above a component supply unit 3B that supplies an electronic component to be mounted by a predetermined suction nozzle 5 of the mounting head body 6 provided on the back beam 4A. The Y direction linear motor is driven and moved in the Y direction while being driven. And since the above-mentioned component supply unit 3B is already in a state where the feeding motor and the peeling motor are driven and the components can be taken out at the component suction position, the θ driving motor 29 is driven to rotate the mounting head 12, After the suction nozzle 5 corresponding to the electronic component to be extracted is moved above the component extraction portion of the component supply unit 3B that supplies the electronic component to be extracted, the nozzle lifting motor 15 is driven to rotate the ball screw 16 and the nut body 13 The nozzle suspension support body 11 is lowered via

  At this time, as shown in FIG. 5, the voice coil motor 36 corresponding to the suction nozzle 5 (the right suction nozzle 5) corresponding to the component type of the electronic component to be taken out is energized, and the coil spring is generated by the electromagnetic force generated in the coil 37. The magnet 38 and the nozzle shaft 27 are lowered against the urging force of 40, the cam follower 28 is pressed against the roller rest 23 from above, and the suction nozzle 5 is lowered as the nozzle suspension support body 11 is lowered. The electronic component D is sucked and taken out from the component supply unit 3B.

  At this time, since the voice coil motor 36 corresponding to the suction nozzle 5 that does not take out the electronic component is not energized, the nozzle suspension support 11 is lowered, but the suction nozzle 5 that does not take out the electronic component is attached to the coil spring 40. It remains elevated due to power and does not fall (see FIG. 5).

  Since a plurality of component supply units 3B are arranged side by side on the feeder base 3A, as shown in FIG. 6, among the plurality of suction nozzles 5 provided on the mounting head 12, for example, 2 located at 3 o'clock and 9 o'clock. By energizing the corresponding voice coil motor 36 to each of the two suction nozzles 5, the two suction nozzles 5 are lowered together with the lowering of the nozzle suspension support body 11, and the two component supply units 3 </ b> B simultaneously receive electrons. The part D can also be picked up and taken out.

  And after taking out this electronic component, the nozzle raising / lowering motor 15 drives and raises the nozzle suspension support body 11, and while the voice coil motor 36 corresponding to the suction nozzle 5 that sucks and holds the electronic component is energized, The suction nozzle 5 is raised. When the suction nozzle 5 finishes moving up, the power is turned off (non-energized). If the energization is turned off before the suction nozzle 5 finishes moving up, the electronic component may be greatly displaced or dropped from the suction nozzle 5 due to an impact or the like when the suction nozzle 5 suddenly rises and stops due to the biasing force of the coil spring 40. This can be prevented.

  When the next electronic component is taken out, the mounting head body 6 is moved above the component supply unit 3B that supplies the electronic component to be taken out, and the θ driving motor 29 is driven to rotate the mounting head 12 and take it out. The suction nozzle 5 corresponding to the electronic component to be taken out is moved above the component take-out portion of the component supply unit 3B for supplying the electronic component to be taken, and the suction nozzle 5 corresponding to the electronic component to be taken out is supported as described above. The electronic head is lowered together with the body 11 to pick up and take out the electronic component from the predetermined component supply unit 3B, and the mounting head 12 is raised.

  In this way, electronic components can be taken out from the component supply unit 3B one after another by the corresponding suction nozzles 5, and the electronic components are sucked and held by the 14 suction nozzles 5 of the mounting head 12 on the back side. Next, the mounting head 12 moves so as to mount the electronic component at a predetermined position on the printed circuit board P positioned by the substrate positioning unit by driving the Y direction linear motor and the X direction linear motor. In the middle of the movement of 12, the electronic component picked up and held by each suction nozzle 5 is picked up by the component recognition camera 8 when passing the upper position of the component recognition camera 8 while moving (fly recognition).

  At the time of this fly recognition, the suction head 5 is lowered or the nozzle suspension support 11 is lowered and all the voice coil motors 36 are energized to lower all the suction nozzles 5 and hold them in the respective suction nozzles 5. An electronic component that has been used may be imaged by the component recognition camera 8.

  Based on this imaging result, how much the electronic component is displaced and held with respect to the suction nozzle 5 is recognized by a recognition processing device (not shown) for the XY direction and the rotation angle, and Y The suction nozzle 5 that holds the electronic component by driving the direction linear motor and the X direction linear motor moves to the printed circuit board P.

  Then, the position recognition processing result of each electronic component captured by the above-described component recognition camera 8 and recognized by the recognition processing device is added to each mounting coordinate of the mounting data, and Y is controlled by a control device (not shown). The direction linear motor, the X direction linear motor, and the θ drive motor 29 are corrected and controlled, and the electronic nozzles are mounted at predetermined positions on the printed circuit board P while the suction nozzle 5 of the mounting head 12 on the back side corrects the positional deviation. The

  Also in this case, as described above, the θ drive motor 29 is corrected and driven to rotate the mounting head 12, and then the nozzle lifting / lowering motor 15 is driven to lower and mount the nozzle suspension support 11. The voice coil motor 36 corresponding to the suction nozzle 5 corresponding to the component type of the power electronic component is energized, and the suction nozzle 5 holding the electronic component by suction is lowered as the nozzle suspension support 11 is lowered. An electronic component is mounted on the substrate P.

  After the first electronic component is mounted, the nozzle lifting motor 15 is driven to raise the nozzle suspension support 11 and the voice coil motor 36 corresponding to the suction nozzle 5 that sucks and holds the electronic component is energized. The suction nozzle 5 is raised as it is. Then, when the suction nozzle 5 finishes moving up, the voice coil motor 36 is deenergized.

  When mounting the next electronic component, the mounting head body 6 is moved and the θ drive motor 29 is driven to rotate the mounting head 12 so that the electronic to be mounted above the position where the printed circuit board P is to be mounted. The suction nozzle 5 corresponding to the component is moved, and as described above, the voice coil motor 36 corresponding to the suction nozzle 5 that holds the electronic component to be mounted is energized, and the suction nozzle 5 together with the nozzle suspension support 11. Is lowered and electronic components are mounted on the printed circuit board P.

  Similarly, by mounting the electronic component on the printed circuit board P, the mounting operation on the first printed circuit board P is completed, the printed circuit board P is moved downstream, and the next printed circuit board P is moved to the substrate positioning unit. And is used for mounting electronic components.

  Next, a second embodiment of the mounting head body 6 will be described with reference to FIG. 7 to FIG. 10, but the points different from the first embodiment will be described, and the description of the common ones will be omitted.

  A coil spring 40, which is a biasing member, is disposed around the upper portion of the nozzle shaft 27 that penetrates the fixing member 35. The upper end of the coil spring 40 is locked to a locking rod 41, and the lower end is the mounting head. The coil spring 40 urges the nozzle shaft 27 (the suction nozzle 5) to be always lifted by engaging with the upper surface of the lower plate portion 35A of the fixing member 35 fixed to the upper portion.

  An air cylinder 45 corresponding to each nozzle shaft 27 is provided around the roller rest body 24 including the roller rest 23 below the nozzle suspension support body 11 that supports the suction nozzle 5 by suspension through the nozzle shaft 27. A cylinder mounting body 46 having a predetermined interval is provided. When air is supplied from the air supply source via the switching valve body 47 and the supply passage 48, the lift valve 49 is lowered, and the rod 45A of the air cylinder 45 is lowered. When air is not supplied, the nozzle shaft 27 (the suction nozzle 5) is pushed up by the biasing force of the coil spring 40.

  That is, when taking out an electronic component from the component supply unit 3A or mounting an electronic component on the printed circuit board P, the air cylinder 45 is activated and air is supplied through the switching valve body 47 and the supply passage 48. Then, the elevating valve 49 and the rod 45A are lowered, and the nozzle shaft 27 (the suction nozzle 5) is lowered against the urging force of the coil spring 40.

  Then, the printed circuit board P is transported to the substrate positioning section by the transport device 2, positioned and fixed by the positioning mechanism, and the mounting head body 6 provided on the back beam 4A is provided according to the mounting data stored in the storage device. The X-direction linear motor is driven in the X direction and the Y-direction linear motor is driven in the Y direction to move above the component supply unit 3B that supplies an electronic component to be mounted by a predetermined suction nozzle 5. Then, the θ drive motor 29 is driven to rotate the mounting head 12, and the suction nozzle 5 corresponding to the electronic component to be extracted is moved above the component extraction unit of the component supply unit 3B that supplies the electronic component to be extracted. Later, the nozzle lifting / lowering motor 15 is driven to rotate the ball screw 16, and the nozzle suspension support 11 is lowered via the nut body 13.

  At this time, as shown in FIG. 9, when the air cylinder 45 corresponding to the suction nozzle 5 (the right suction nozzle 5) corresponding to the component type of the electronic component to be taken out is actuated, the rod 45 </ b> A descending by the air supply is turned into the coil spring 40. The nozzle shaft 27 is pushed down against the urging force, the cam follower 28 is pressed against the roller rest 23 from above, and the suction nozzle 5 is lowered as the nozzle suspension support 11 is lowered, so that the predetermined component supply unit 3B The electronic component D is adsorbed and taken out from

  At this time, since the air cylinder 45 corresponding to the suction nozzle 5 that does not take out the electronic component does not operate, the nozzle suspension support 11 is lowered, but the suction nozzle 5 that does not take out the electronic component is biased by the coil spring 40. As a result, it remains elevated and does not descend (see FIG. 9).

  Since a plurality of component supply units 3B are arranged side by side on the feeder base 3A, as shown in FIG. 10, among the plurality of suction nozzles 5 provided on the mounting head 12, for example, 2 located at 3 o'clock and 9 o'clock. By operating the air cylinder 45 corresponding to each of the suction nozzles 5, the two suction nozzles 5 are lowered together with the lowering of the nozzle suspension support 11, and the electronic components are simultaneously supplied from the two component supply units 3 </ b> B. D can be adsorbed and taken out.

  And after taking out this electronic component, the nozzle raising / lowering motor 15 drives, the nozzle suspension support body 11 is raised, and air is supplied to the air cylinder 45 corresponding to the suction nozzle 5 holding the electronic component by suction. The rod 45A is raised, and the suction nozzle 5 is raised by the urging force of the coil spring 40. Then, the supply of air is stopped after the suction nozzle 5 finishes moving up. If the supply of air is cut off before the suction nozzle 5 finishes moving up, the electronic component may be greatly displaced or dropped from the suction nozzle 5 due to the impact when the suction nozzle 5 suddenly rises and stops due to the biasing force of the coil spring 40 This can be prevented.

  When the next electronic component is taken out, the mounting head body 6 is moved above the component supply unit 3B that supplies the electronic component to be taken out, and the θ driving motor 29 is driven to rotate the mounting head 12 and take it out. The suction nozzle 5 corresponding to the electronic component to be taken out is moved above the component take-out portion of the component supply unit 3B for supplying the electronic component to be taken, and the suction nozzle 5 corresponding to the electronic component to be taken out is supported as described above. The electronic head is lowered together with the body 11 to pick up and take out the electronic component from the predetermined component supply unit 3B, and the mounting head 12 is raised. Thus, electronic components can be taken out from the component supply unit 3B one after another, and the electronic components are sucked and held by the four suction nozzles 5 of the mounting head 12 on the back side.

  Next, the mounting head 12 moves so as to mount the electronic component at a predetermined position on the printed circuit board P positioned by the substrate positioning unit by driving the Y direction linear motor and the X direction linear motor. In the middle of the movement of 12, the electronic component picked up and held by each suction nozzle 5 is picked up by the component recognition camera 8 when passing the upper position of the component recognition camera 8 while moving (fly recognition).

  Based on this imaging result, how much the electronic component is displaced and held with respect to the suction nozzle 5 is recognized by a recognition processing device (not shown) for the XY direction and the rotation angle, and Y The suction nozzle 5 that holds the electronic component by driving the direction linear motor and the X direction linear motor moves to the printed circuit board P.

  Then, the position recognition processing result of each electronic component captured by the above-described component recognition camera 8 and recognized by the recognition processing device is added to each mounting coordinate of the mounting data, and Y is controlled by a control device (not shown). The direction linear motor, the X direction linear motor, and the θ drive motor 29 are corrected and controlled, and the electronic nozzles are mounted at predetermined positions on the printed circuit board P while the suction nozzle 5 of the mounting head 12 on the back side corrects the positional deviation. The

  Also in this case, as described above, the θ drive motor 29 is corrected and driven to rotate the mounting head 12, and then the nozzle lifting / lowering motor 15 is driven to lower and mount the nozzle suspension support 11. When the air cylinder 45 corresponding to the suction nozzle 5 corresponding to the component type of the electronic component to be operated is actuated, the rod 45A descending by the air supply pushes down the nozzle shaft 27 against the urging force of the coil spring 40, thereby supporting the nozzle suspension. As the body 11 is lowered, the suction nozzle 5 holding the electronic component is lowered, and the electronic component is mounted on the printed circuit board P.

  In addition, after the mounting of the first electronic component, the nozzle lifting / lowering motor 15 is driven to raise the nozzle suspension support 11 and supply air to the air cylinder 45 corresponding to the suction nozzle 5 that sucks and holds the electronic component. The rod 45 </ b> A is lifted and the suction nozzle 5 is lifted by the biasing force of the coil spring 40. Then, after the suction nozzle 5 finishes moving up, the supply of air is stopped.

  When mounting the next electronic component, the mounting head body 6 is moved and the θ drive motor 29 is driven to rotate the mounting head 12 so that the electronic to be mounted above the position where the printed circuit board P is to be mounted. When the suction nozzle 5 corresponding to the component is moved and the air cylinder 45 corresponding to the suction nozzle 5 holding the electronic component to be mounted is actuated as described above, the rod 45 </ b> A descending by the air supply causes the biasing force of the coil spring 40. The nozzle shaft 27 is pushed down against this, and the suction nozzle 5 holding the electronic component by suction is lowered as the nozzle suspension support 11 is lowered, and the electronic component is mounted on the printed circuit board P.

  Similarly, by mounting the electronic component on the printed circuit board P, the mounting operation on the first printed circuit board P is completed, the printed circuit board P is moved downstream, and the next printed circuit board P is moved to the substrate positioning unit. And is used for mounting electronic components.

  In the first and second embodiments, the arrangement position of any of the plurality of suction nozzles 5 out of 14 provided in the mounting head 12 and the mounting position of the electronic component on the printed circuit board P are the same. If it is in the position, as described above, the plurality of suction nozzles 5 can be lowered at the same time as the nozzle suspension support 11 is lowered, and electronic components can be mounted on the printed circuit board P at the same time.

  In the first and second embodiments, the component supply unit 3A is used as the component supply device 3. However, the present invention is not limited to this, and electronic components are regularly and horizontally arranged on the tray used in the tray feeder. Since it is placed, even in this tray feeder, electronic components can be sucked and taken out simultaneously by a plurality of suction nozzles.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Component supply apparatus 3B Component supply unit 5 Adsorption nozzle 11 Nozzle suspension support body 12 Mounting head 13 Nut body 15 Nozzle raising / lowering motor 23 Roller rest 27 Nozzle shaft 28 Cam follower 36 Voice coil motor 40 Coil spring 45 Air cylinder

Claims (4)

In an electronic component mounting apparatus that takes out electronic components supplied from a component supply device by a plurality of suction nozzles provided in the mounting head and mounts them on a printed circuit board.
Suspending and supporting the plurality of suction nozzles on the suspension support in a state of being constantly urged by each urging body,
Each suction nozzle can be moved up and down with respect to the mounting head by each nozzle lifting drive source. In an electronic component mounting apparatus that takes out electronic components supplied from a component supply device by a plurality of suction nozzles provided in the mounting head and mounts them on a printed circuit board.
Suspending and supporting the plurality of suction nozzles on a suspension support in a state of being urged so as to be constantly raised with respect to the mounting head by each urging body,
Each suction nozzle can be raised and lowered with respect to the mounting head by each nozzle raising and lowering drive source,
When mounting electronic components on a printed circuit board, the lifting drive source of the suspension support is driven to lower the suspension support relative to the mounting head, and the corresponding nozzle lifting drive source is not driven. An electronic component mounting apparatus, wherein the nozzle is not lowered by the urging force of the urging body, and the suction nozzle driven by the corresponding nozzle lifting drive source is lowered against the urging force of the urging body. .   The electronic component mounting apparatus according to claim 1, wherein the nozzle lifting drive source is a voice coil motor.   The electronic component mounting apparatus according to claim 1, wherein the nozzle lifting drive source is an air cylinder.

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