JP2008139024A - IC handler and shuttle for IC handler - Google Patents

Abstract

An IC handler and a shuttle for an IC handler that can reduce the installation space of the camera of the IC handler and reduce the time required for photographing by the camera.
A first camera 37 is provided at the center of the upper surface of the first shuttle 16 so as to be able to photograph the upper part. The four IC chips T before inspection placed on the supply-side change kit 31 are attracted and held by the measurement robot 22, and then the first shuttle 16 is moved to move the first camera 37 to the measurement robot 22. Place it directly under. The first camera 37 photographs the four IC chips T and the corresponding alignment marks from below. Image processing of the captured image data is performed, and the displacement of the suction position of each IC chip T is calculated using the alignment mark as a reference. The position of the IC chip T is adjusted based on the calculated result of the positional deviation, and then the IC chip T is mounted on the inspection socket 23 by the measuring robot 22 and subjected to electrical inspection.
[Selection] Figure 1

Description

  The present invention relates to an IC handler and a shuttle for the IC handler.

  In general, a test apparatus (IC handler) for an electronic component such as a semiconductor chip is provided with a plurality of transfer robots for transferring the electronic component. Then, the electronic component before inspection is transferred to the inspection socket for measurement by the transfer robot, and after the inspection is completed, the electronic component is collected from the inspection socket.

  Specifically, for example, the electronic component before the inspection is sucked and held by the supply robot and separated from the pocket of the supply shuttle, and then moved by the supply shuttle to the position where the measurement robot sucks and holds. The electronic parts before the inspection are separated from the supply shuttle to the inspection socket by the measurement robot, and after the inspection is completed, they are sucked and held by the measurement robot again and separated from the inspection socket into the recovery shuttle pocket. Then, the electronic component after the inspection is moved to the position of the collection robot by the collection shuttle, and is separated from the collection tray according to the test result by the collection robot.

  When the inspection sockets and the respective pockets are sequentially transported by the respective robots, the electronic components need to be arranged at predetermined positions of the inspection sockets and the respective pockets. In particular, when the electronic component is placed in the inspection socket, the measurement terminal of the inspection socket and the terminal of the electronic component need to be in suitable contact with each other, so the relative displacement between the electronic component and the inspection socket is very small. It is hoped that. In addition, it is desirable that the relative displacement between each pocket and the electronic component is small when it is disposed in each other pocket.

  In order to reduce the relative displacement between the electronic component and the inspection socket, etc., the image data obtained by photographing the electronic component and the inspection socket with the camera is image-processed to calculate the amount of relative displacement, and based on the calculation result There are various methods for correcting the position by the amount of relative deviation. In addition, a series of processes for correcting the relative deviation often requires time, and it is desired to shorten the time required for the process.

  Therefore, one method for correcting the relative displacement between the socket and the electronic component has been proposed (Patent Document 1). When the IC handler of Patent Document 1 transports an electronic component before inspection from the shuttle to the test device, the IC moves the transport head that sucks and holds the electronic component above the camera provided between the shuttle and the test device. Then, the electronic component is picked up with the camera. The control device of the IC handler performs image processing on the image data acquired by photographing, calculates a relative shift between the electronic component and the test device, operates an adjustment mechanism of the transport device based on the calculation result, and controls the electronic component for the test device. Correct the relative displacement.

  Further, when the IC handler transports the inspected electronic component from the shuttle to the tray, the IC handler moves the P & P robot holding the electronic component by suction to the upper side of the camera disposed in the movable range. Take a picture of the sucked state of the electronic parts. The control device performs image processing on the image data acquired by photographing, calculates a relative shift between the electronic component and the tray, operates a robot adjustment mechanism based on the calculation result, and corrects the relative shift of the electronic component with respect to the tray. .

However, in patent document 1, the place where a camera is arrange | positioned independently was required. Furthermore, a camera is required for photographing the electronic parts before and after the inspection. Further, since the transfer head and the P & P robot move to the upper side of the camera and photograph the electronic component, it takes time to transfer the electronic component.

In view of this, a method for shortening the shift correction processing time has been proposed (Patent Document 2). In the IC handler of Patent Document 2, when an electronic component before inspection held by the transport device is disposed above the test device and opposite to the test device, the IC handler is placed between the electronic component and the test device. A mirror image of the electronic component and the test apparatus is simultaneously photographed by a camera attached to the same support member as the mirror through the arranged mirror.
Republished Patent Publication WO2003 / 023430 Japanese Patent No. 3063899

  However, in Patent Document 2, since the mirror image of the mirror is taken, the arrangement and adjustment of the mirror and the like are complicated. In addition, a place for providing a support member with a mirror and a camera attached to the IC handler is required.

  An object of the present invention is to provide an IC handler that can reduce the installation space of the camera of the IC handler and reduce the time required for photographing by the camera, and a shuttle for the IC handler.

  The IC handler of the present invention grips and conveys an electronic component between a shuttle and a socket for inspection with a press-holding device, and performs image processing on image data obtained by photographing the electronic component. In the IC handler provided with the position adjusting device capable of correcting the position, the shuttle is provided with a camera capable of photographing the electronic component held by the pressing and holding device.

  According to the IC handler of the present invention, the shuttle is provided with a camera capable of photographing the electronic component held by the press holding device. Therefore, it is not necessary to secure a space for arranging the camera alone on the IC handler, and the interval between the shuttle and the inspection socket can be shortened. As a result, the IC handler can be made smaller, and further, the time required for the pressure holding device to carry the electronic component can be shortened.

In the IC handler of the present invention, it is preferable that the shuttle is provided with a change kit on both sides, and the camera is provided at an intermediate position between the two change kits.
According to the IC handler of the present invention, since the camera is provided at the center of the change kit on both sides of the shuttle, the camera can be quickly placed below the press holding device regardless of whether the shuttle is arranged on the left or right side of the press holding device. Can be arranged. As a result, it is possible to shorten the time required for photographing the electronic component with the camera.

In the IC handler of the present invention, it is preferable that the shuttle includes a strobe for illuminating the electronic component.
According to the IC handler of the present invention, since the strobe for illuminating the electronic component is provided on the shuttle, it is not necessary to secure a space for arranging the strobe alone on the IC handler. As a result, the IC handler can be made smaller. Also, the electronic part image data suitable for image recognition can be obtained by the strobe.

In the IC handler of the present invention, it is preferable that the press holding device includes an alignment mark.
According to the IC handler of the present invention, since the press holding device is provided with the alignment mark, it is not necessary to secure a space for arranging the alignment mark alone on the IC handler. As a result, the IC handler can be made smaller. Further, by photographing the alignment mark together with the electronic component by the camera, the number of photographing necessary for position correction can be reduced.

In the IC handler of the present invention, it is preferable that the pressing and holding device moves to a focal length of the camera.
According to the IC handler of the present invention, since the pressing and holding device moves to the focal length of the camera, the camera need not have a focal length adjustment function. As a result, the cost of the camera and IC handler can be reduced.

  The shuttle for an IC handler according to the present invention includes a change kit, and the change kit is moved to at least a position where an electronic component is gripped by the pressing and holding device and a position where the electronic component held by the pressing and holding device is accommodated. In the IC handler shuttle to be operated, a camera capable of photographing the electronic component gripped by the press holding device is provided.

  According to the shuttle for the IC handler of the present invention, the camera capable of photographing the electronic component held by the press holding device is provided. Therefore, the camera can be moved quickly by moving the shuttle. As a result, it is possible to shorten the time required for photographing the electronic component with the camera.

Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing the IC handler 10.
The IC handler 10 includes a base 11, a safety cover 12, a high temperature chamber 13, a supply robot 14, a collection robot 15, a first shuttle 16, a second shuttle 17, and a plurality of conveyors C1 to C6.

  The base 11 has the above elements mounted on the upper surface thereof. The safety cover 12 surrounds a large area of the base 11, and the supply robot 14, the recovery robot 15, the first shuttle 16, and the second shuttle 17 are accommodated therein.

  The plurality of conveyors C <b> 1 to C <b> 6 are provided on the base 11 such that one end thereof is located outside the safety cover 12 and the other end is located within the safety cover 12. Each of the conveyors C1 to C6 transports the tray 18 containing a plurality of IC chips T as semiconductor chips from the outside of the safety cover 12 into the safety cover 12, or conversely, moves the tray 18 into the safety cover 12. To the outside of the safety cover 12.

  The supply robot 14 includes an X-axis frame FX and a first Y-axis frame FY1. The collection robot 15 includes the X-axis frame FX and the second Y-axis frame FY2. The X-axis frame FX is disposed in the X direction. The first Y-axis frame FY1 and the second Y-axis frame FY2 are arranged to be parallel to each other along the Y direction, and are supported so as to be movable in the X direction with respect to the X-axis frame FX. . The first Y-axis frame FY1 and the second Y-axis frame FY2 are reciprocated in the X direction along the X-axis frame FX by respective motors (not shown) provided on the X-axis frame FX.

On the lower side of the first Y-axis frame FY1, the supply-side robot hand unit 20 is supported so as to be movable in the Y direction. The supply-side robot hand unit 20 reciprocates in the Y direction along the first Y-axis frame FY1 by respective motors (not shown) provided on the first Y-axis frame FY1. Then, the supply-side robot hand unit 20 uses, for example, the IC chip T before inspection accommodated in the tray 18 of the conveyor C1, for example, the first shuttle 1
6 is supplied.

  A collection-side robot hand unit 21 is supported below the second Y-axis frame FY2 so as to be movable in the Y direction. The collection-side robot hand unit 21 reciprocates in the Y direction along the second Y-axis frame FY2 by respective motors (not shown) provided on the second Y-axis frame FY2. Then, the collection-side robot hand unit 21 supplies, for example, the inspected IC chip T supplied to the first shuttle 16 to, for example, the tray 18 of the conveyor C6.

  On the upper surface of the base 11, between the supply robot 14 and the collection robot 15, two rails 30 are fixed in parallel to the X-axis direction. One rail 30 is provided with a first shuttle 16 that can reciprocate in the X-axis direction, and the other rail 30 is provided with a second shuttle 17 that can reciprocate in the X-axis direction.

  FIG. 2 is a plan view showing the first and second shuttles 16 and 17. Since the first and second shuttles 16 and 17 have the same structure, only the structure of the first shuttle 16 will be described for convenience of description, and the description of the second shuttle 17 will be omitted.

  The lower part of the first shuttle 16 is formed by a substantially plate-like base member 16a that is long in the X-axis direction. A rail receiver (not shown) is fixed to the bottom surface of the base member 16 a, and the rail receiver is in sliding contact with the rail 30. And it is reciprocated along the rail 30 by the 1st shuttle motor M1 (refer FIG. 7) provided in the 1st shuttle 16. FIG.

  A supply-side change kit 31 is fixed to the left side of the upper surface of the first shuttle 16 (on the supply robot 14 side) so as to be replaceable with screws or the like. On the upper surface of the supply-side change kit 31, four supply pockets 32 are recessed as shown in FIGS.

  The periphery of each supply pocket 32 is formed larger than the IC chip T, and the IC chip T is placed therein. A suction hole 33 is provided on the bottom surface of each supply pocket 32, and the suction hole 33 is connected to a suction device 41 (see FIG. 7) via a shuttle switching valve V1 (see FIG. 7). . When the suction hole 33 and the suction device 41 are connected by switching the shuttle switching valve V1, a negative pressure is supplied to the suction hole 33, and the IC chip T is attached to the bottom surface of the supply pocket 32 by the action of the negative pressure. Adsorb to. On the contrary, when the suction hole 33 is connected to the atmosphere from the suction device 41 by switching the shuttle switching valve V1, the suction hole 33 becomes atmospheric pressure, and the suction of the IC chip T to the bottom surface of the supply pocket 32 is released. To do. Accordingly, the IC chip T attracted to the supply pocket 32 is held at a predetermined position of the supply pocket 32 even when the first shuttle 16 is moved.

  A collection side change kit 34 is fixed to the right side of the upper surface of the first shuttle 16 (on the collection robot 15 side) so as to be replaceable with screws or the like. As shown in FIGS. 2 (a) and 4 (a), four collection pockets 35 are recessed on the upper surface of the collection side change kit 34. As shown in FIG.

  Each collection pocket 35 is formed so that the periphery thereof is larger than the IC chip T, and the IC chip T is placed therein. A dimple plate 36 is fitted on the bottom surface of the collection pocket 35 so as to be replaceable.

As shown in FIG. 4 (b), the dimple plate 36 is a plate-like member sized to be fitted into the collection pocket 35. The surface of the dimple plate 36 is as shown in FIG. 4 (c). In addition, a large number of dimples 36d for fitting the bumps (projection electrodes) B on the bottom surface of the IC chip T are provided in a range substantially the same as or wider than the IC chip T. Therefore, each IC chip T placed in each collection pocket 35 and having the bump B on the bottom surface fitted in the dimple 36d of the dimple plate 36 is also in the collection pocket 35 when the first shuttle 16 is moved. Is held at a predetermined position.

  First and second cameras 37 and 38 are provided at the center of the upper surfaces of the first and second shuttles 16 and 17, respectively, so as to be able to photograph the upper part. The first and second cameras 37 and 38 take an image of the IC chip T held by the measurement robot 22 to be described later, and output the image pickup data. All (four) IC chips T can be photographed at once. The image data captured by the first and second cameras 37 and 38 is subjected to image processing. In the present embodiment, the first and second cameras 37 and 38 are CCD cameras, but are not limited thereto.

  In FIG. 1, an inspection socket 23 is provided on the upper surface of the base 11 between the first and second shuttles 16 and 17 including the supply side and recovery side change kits 31 and 34. The inspection sockets 23 are provided in a number corresponding to the number (four) of supply pockets 32 of the supply side change kit 31. Each inspection socket 23 is mounted with an IC chip T accommodated in a corresponding supply pocket 32.

  More specifically, the IC chips T corresponding to the respective inspection sockets 23 are arranged at positions immediately above the corresponding inspection sockets 23 by the measuring robot 22 described later. Thereafter, each IC chip T moves downward, and each bump B of the IC chip T abuts against the contact portion of the corresponding inspection socket 23 from above and pushes the spring pin downward, whereby the inspection socket. 23.

  The IC chip T mounted in each inspection socket 23 is subjected to electrical inspection. When the inspection is completed, the IC chip T mounted in each inspection socket 23 is extracted from the corresponding inspection socket 23 by the measuring robot 22 described later, and placed at a position immediately above the collection-side change kit 34. Is done. Thereafter, each IC chip T moves downward and is accommodated in a collection pocket 35 of the corresponding collection-side change kit 34.

  In this embodiment, when the IC chip T is supplied to each supply pocket 32 of the supply side change kit 31 of the first and second shuttles 16 and 17 by the supply side robot hand unit 20, FIG. As shown to a), the 1st and 2nd shuttles 16 and 17 are moved to the most left side position (henceforth a supply position) of the rail 30. FIG.

  When the IC chip T is mounted from the supply pocket 32 of the supply side change kit 31 to the corresponding inspection socket 23, the first and second shuttles 16 and 17 are as shown in FIG. The supply-side change kit 31 is moved to a position opposite to the inspection socket 23 (hereinafter referred to as a pre-inspection transfer position).

  Further, when the IC chip T held by the measurement robot 22 is photographed by the first and second cameras 37 and 38, as shown in FIG. 6C, the first and second shuttles 16 and 17 are The first and second cameras 37 and 38 are moved to a position facing the inspection socket 23 (hereinafter referred to as a chip photographing position).

  Furthermore, when the IC chip T is accommodated in the collection pocket 35 of the corresponding collection-side change kit 34 from the inspection socket, as shown in FIG. 6 (d), the first and second shuttles 16 and 17 are The collection side change kit 34 is moved to a position opposite to the inspection socket 23 (hereinafter referred to as a post-inspection transfer position).

  When the IC chip is recovered from each recovery pocket 35 of the recovery side change kit 34 by the recovery side robot hand unit 21, the first and second shuttles 16 and 17 are as shown in FIG. , It is moved to the rightmost position of the rail 30 (hereinafter referred to as the collection position).

Next, the measuring robot 22 will be described with reference to FIG.
The high temperature chamber 13 is provided with a measurement frame (not shown) disposed in the Y direction so as to straddle the first and second shuttles 16 and 17 and the inspection socket 23.

  The measurement robot 22 is supported on the lower surface of the measurement frame so as to be reciprocally movable in the Y direction with respect to a rail (not shown). The measurement robot 22 is reciprocated in the Y direction by a Y-axis motor MY (see FIG. 7) provided in the measurement frame.

FIG. 5A is a side view of the measurement robot 22, and FIG. 5B is a bottom view of the measurement robot 22.
As shown in FIG. 5A, the measurement robot 22 includes a support portion 22a, a connecting portion 22b, and a press holding portion 22c as a press holding device. The upper portion of the support portion 22a is supported so as to be reciprocally movable in the Y direction with respect to a rail (not shown). The lower surface of the support portion 22a is connected and supported so that the connection portion 22b can reciprocate in the Z direction with respect to the support portion 22a. The connecting portion 22b is reciprocated in the Z direction by a Z-axis motor MZ (see FIG. 7) provided in the support portion 22a. A pressing holding portion 22c is fixed to the lower end of the connecting portion 22b. The press holding part 22c reciprocates in the Z direction together with the connecting part 22b. That is, the press holding part 22c of the measurement robot 22 is configured to be movable in the Y direction and the Z direction with respect to the measurement frame.

  The pressing holding portion 22c is arranged so as to be positioned immediately above the inspection socket 23 when the measuring robot 22 is moved in the Y direction and arranged between the first and second shuttles 16 and 17. .

  A third camera 24 for photographing the inspection socket 23 located below is provided on one side surface of the pressing holding portion 22c so that the lower part can be photographed. The third camera 24 is connected and fixed to the front end of a support column 24a bent in an L shape downward and connected to the side surface of the pressing holding portion 22c. Accordingly, the third camera 24 can take an image of the inspection socket 23 positioned below when the measurement robot 22 moves in the Y direction.

Note that the lower end of the third camera 24 on the lens side is configured to be higher than at least the lower end of the press holding portion 22c.
A total of four pressing devices 26, two in the X direction and two in the Y direction, are provided on the lower side of the pressing holding portion 22 c corresponding to the respective inspection sockets 23 and the respective pockets 32 and 35.

  A suction nozzle 27 extending downward is provided at the center of the lower portion of each pressing device 26. The four suction nozzles 27 are provided in correspondence with the supply pockets 32 of the supply-side change kit 31, the recovery pockets 35 of the recovery-side change kit 34, and the inspection sockets 23, respectively.

Each suction nozzle 27 has an open end at the lower end, and the open end communicates with the inside of the suction nozzle 27 and is connected to the suction device 41 via a nozzle switching valve V2 (see FIG. 7). That is, when the suction nozzle 27 and the suction device 41 are connected by switching the nozzle switching valve V2, the opening end of the suction nozzle 27 becomes negative pressure, and the negative pressure causes the IC chip T to move to the opening end of the suction nozzle 27. Adsorb. On the other hand, when the suction nozzle 27 is connected to the atmosphere from the suction device 41 by switching the nozzle switching valve V2, the opening end of the suction nozzle 27 becomes atmospheric pressure, and the suctioned IC chip T is removed from the suction nozzle 27. Open from the open end.

  Position adjusting devices 25 are provided in the pressing holding portion 22c corresponding to the pressing devices 26, respectively. Each position adjusting device 25 enables each pressing device 26 (suction nozzle 27) to move in the X direction and Y direction with respect to the press holding portion 22c, and rotates the central axis of the suction nozzle 27 with respect to the XY plane. It is designed to rotate around the center.

  Moreover, the support | pillar 28a is each fixed to the both sides | surfaces by the side of the Y direction of the press holding part 22c corresponding to each press apparatus 26. As shown in FIG. Each column 28a is formed in a U-shape, and its tip is disposed opposite to the corresponding pressing device 26. An alignment mark 28 is attached to the tip of each column 28a. Each alignment mark 28 has a cylindrical shape, and its circular lower surface is used as a mark portion 28b.

Next, the electrical configuration of the measurement robot 22 configured as described above will be described with reference to FIG.
In FIG. 7, the control device 40 includes a CPU (Central Processing Unit) 61, a ROM 62, a RAM 63, an image processor 64 and an image memory 65. The control device 40 (CPU 61) sucks and holds the IC chip T before inspection from the supply pocket 32 of the supply side change kit 31 according to various data and various control programs stored in the ROM 62, and puts it in the inspection socket 23. Execute the process to attach. In addition, the IC chip T after the inspection is sucked and grasped from the inspection socket 23 and is taken out and stored in the recovery pocket 35 of the recovery side change kit 34.

  The control device 40 is connected to an input / output device 70 having various switches and a display. The input / output device 70 outputs a command signal for starting execution of each process, initial value data for executing each process, and the like to the control device.

  The control device 40 is electrically connected to the Y axis motor drive circuit 71. The control device 40 drives and controls the Y-axis motor MY via the Y-axis motor drive circuit 71. Then, the control device 40 drives and controls the Y-axis motor MY, and arranges the press holding portion 22 c at the upper position of the inspection socket 23 and the upper position of the first or second shuttle 16, 17.

  The control device 40 is electrically connected to the Z-axis motor drive circuit 72. The control device 40 drives and controls the Z-axis motor MZ via the Z-axis motor drive circuit 72. And the control apparatus 40 drives and controls the Z-axis motor MZ, and arrange | positions the press holding | maintenance part 22c (adsorption nozzle 27) in the upper origin position and adsorption start position which are downward movement start positions via the connection part 22b.

  The control device 40 is electrically connected to the valve drive circuit 73. The control device 40 individually controls driving of the shuttle switching valve V1 and the nozzle switching valve V2 via the valve driving circuit. Then, the control device 40 drives and controls the shuttle switching valve V1 to switch the suction hole 33 of the supply pocket 32 to either the suction device 41 or the atmosphere. When the suction hole 33 is connected to the suction device 41, the IC chip T is sucked and held on the bottom surface of the supply pocket 32. Further, the control device 40 drives and controls the nozzle switching valve V2 to switch the opening end of the suction nozzle 27 to either the suction device 41 or the atmosphere. When the open end is connected to the suction device 41, the IC chip T is sucked and held by the open end of the suction nozzle 27.

The control device 40 is connected to an electropneumatic regulator circuit 74 provided corresponding to each pressing device 26. The control device 40 drives and controls each electropneumatic regulator circuit 74 and moves the corresponding pressing device 26 (suction nozzle 27) from the suction start position to the lower mounting position with respect to the press holding portion 22c by air pressure. Let

  The control device 40 is electrically connected to each position adjustment device 25 provided in the press holding portion 22c. The control device 40 drives and controls each position adjusting device 25, and each pressing device 26 (adsorption nozzle 27) can be moved in the X direction and the Y direction with respect to the pressing holding portion 22c via each position adjusting device 25. And the center axis of the suction nozzle 27 is rotated with respect to the XY plane.

  The control device 40 is electrically connected to the first motor drive circuit 75. The control device 40 drives and controls the first shuttle motor M <b> 1 via the first motor drive circuit 75. The control device 40 drives and controls the first shuttle motor M1 to place the first shuttle 16 at the supply position, the pre-inspection transfer position, the chip photographing position, the post-inspection transfer position, and the recovery position.

  The control device 40 is electrically connected to the second motor drive circuit 76. The control device 40 controls the driving of the second shuttle motor M <b> 2 via the second motor driving circuit 76. The control device 40 drives and controls the second shuttle motor M2, and arranges the second shuttle 17 at the supply position, the pre-inspection transfer position, the chip photographing position, the post-inspection transfer position, and the recovery position.

  The control device 40 is electrically connected to the first camera drive circuit 77. The control device 40 drives and controls the first camera 37 via the first camera drive circuit 77. Then, the control device 40 drives and controls the first camera 37 to acquire image data (image data) captured by the first camera 37. The control device 40 performs image processing of the IC chip T sucked on each suction nozzle 27 by using the image data acquired by the image processor 64. Then, the control device 40 calculates the suction position and the orientation of the IC chip T with respect to the suction nozzle 27 for each IC chip T. That is, the suction deviation of the IC chip T with respect to the suction nozzle 27 is calculated. Further, the control device 40 determines how much the center axis of the suction nozzle 27 is deviated in the X direction and the Y direction with respect to the center position of the upper surface of the IC chip T, and each side of the IC chip T is X It calculates how much it is rotating with respect to the direction and the Y direction.

  The control device 40 is electrically connected to the first strobe drive circuit 77s. The control device 40 drives and controls the first strobe 37s in accordance with the photographing of the first camera 37 via the first strobe driving circuit 77s. Then, the control device 40 drives the first strobe 37s to brighten the periphery so that the first camera 37 can capture an image more clearly.

  The control device 40 is electrically connected to the second camera drive circuit 78. The control device 40 drives and controls the second camera 38 via the second camera drive circuit 78. Then, the control device 40 drives and controls the second camera 38 to acquire image data (image data) captured by the second camera 38. The control device 40 performs image processing of the IC chip T sucked on each suction nozzle 27 by using the image data acquired by the image processor 64. Then, the control device 40 calculates the suction position and the orientation of the IC chip T with respect to the suction nozzle 27 for each IC chip T. That is, the suction deviation of the IC chip T with respect to the suction nozzle 27 is calculated. Further, the control device 40 determines how much the center axis of the suction nozzle 27 is deviated in the X direction and the Y direction with respect to the center position of the upper surface of the IC chip T, and each side of the IC chip T is X It calculates how much it is rotating with respect to the direction and the Y direction.

  The control device 40 is electrically connected to the second strobe drive circuit 78s. The control device 40 drives and controls the second strobe 38s in accordance with the shooting of the second camera 38 via the second strobe driving circuit 78s. Then, the control device 40 drives the second strobe 38s to brighten the periphery so that the second camera 38 can capture an image more clearly.

  The control device 40 is electrically connected to the third camera drive circuit 79. The control device 40 controls driving of the third camera 24 via the third camera driving circuit 79. Then, the control device 40 drives and controls the third camera 24 to acquire data (image data) of an image (inspection socket 23) taken by the third camera 24. The control device 40 uses the image processor 64 to perform image processing of the inspection socket 23 using the acquired image data. Then, the control device 40 calculates the position of the inspection socket 23. That is, the relative position of the measurement robot 22 with respect to the position of the inspection socket 23 is calculated.

  The control device 40 is electrically connected to the third strobe drive circuit 79s. The control device 40 drives and controls the third strobe 24s through the third strobe drive circuit 79s in accordance with the shooting by the third camera 24. Then, the control device 40 drives the third strobe 24s to brighten the periphery so that the third camera 24 can capture an image more clearly.

  Next, referring to FIG. 8, a procedure for photographing the inspection socket 23 by the third camera 24 and calculating the positional deviation of the relative position of the measuring robot 22 with respect to the inspection socket 23 will be described.

  The control device 40 moves the measurement robot 22 in the direction of the inspection socket 23 when the measurement robot 22 is disposed immediately above the rail 30 of the first shuttle 16 as shown in FIG.

  The control device 40 moves the measurement robot 22 to place the third camera 24 at the upper center of the four inspection sockets 23 (only two visible from the X direction are shown) as shown in FIG. 8B. . When the measuring robot 22 is arranged at the upper center of the inspection socket 23, the control device 40 reciprocates the connecting portion 22b in the Z direction, and sets the distance between the third camera 24 and the inspection socket to the third camera. Adjust to 24 focal lengths. When the control device 40 moves the third camera 24 to the focal length, the third camera 24 photographs all the four inspection sockets 23 illuminated on the third strobe 24s at a time.

  The control device 40 stores the captured image data in the image memory 65, performs image processing by the image processor 64, and calculates the position of each inspection socket 23. Based on the calculation result, the control device 40 calculates the positional deviation of the rotation angle in the X direction, the Y direction, and the XY plane of the suction nozzle 27 corresponding to each inspection socket 23 and stores it in each register of the RAM 63. To do. Then, when the control device 40 attaches each IC chip T to the corresponding inspection socket 23 based on each positional deviation stored in the RAM 63, the control device 40 passes through the position adjustment device 25 and sets the corresponding suction nozzle 27. Adjust the position.

  Next, referring to FIG. 9, a procedure for photographing the IC chip T before the inspection by the first camera 37 and calculating the suction displacement of the IC chip T with respect to the suction nozzle 27 will be described. For convenience of explanation, only the first shuttle 16 will be described below, but the same applies to the second shuttle 17.

  As shown in FIG. 9A, the control device 40 moves the first shuttle 16 to the pre-inspection transfer position and places the four IC chips T (Y) before inspection placed on the supply-side change kit 31. Only two visible from the direction are shown by suction and gripped by the measuring robot 22 and lifted.

When the IC chip T rises, the control device 40 moves the first shuttle 16 to the chip photographing position as shown in FIG. 9B. The control device 40 arranges the first camera 37 directly below the measuring robot 22 and then reciprocates the connecting portion 22b in the Z direction to connect the first camera 37 and the IC.
The distance of the chip T is adjusted to the focal length of the first camera 37. The control device 40 performs the operation of adjusting the focal length of the first camera 37 and the IC chip T by the measuring robot 22 only for the first time, stores the focal length in the register of the RAM 63, and immediately starts the measuring robot 22 from the next time. Move to that height.

  Then, after the measurement robot 22 has moved to the focal length, the control device 40 takes images of the four IC chips T illuminated on the first strobe 37s and the corresponding alignment marks 28 by the first camera 37 at a time. .

  The control device 40 stores the captured image data in the image memory 65, performs image processing by the image processor 64, and calculates the suction position and orientation of each IC chip T. Based on the calculation result, the control device 40 calculates the positional deviation of the rotation angle in the X direction, the Y direction, and the XY plane between the suction nozzle 27 corresponding to the position of the central portion of the upper surface of each IC chip T, Store in each register of the RAM 63. Then, the control device 40 adjusts the position of the corresponding suction nozzle 27 via the position adjustment device 25 when mounting each IC chip T to the corresponding inspection socket 23 based on each position shift. Thereafter, the control device 40 conveys the IC chip T to the inspection socket 23 by the measuring robot 22.

  That is, when the IC chip T is arranged in the inspection socket 23, the IC chip T is determined by the calculation result of both the positional deviation with respect to each inspection socket 23 and the positional deviation with the alignment mark 28. The position is adjusted by each suction nozzle 27 via the position adjusting device 25.

  Next, a procedure for photographing the inspected IC chip T by the first camera 37 and calculating the suction displacement of the IC chip T with respect to the suction nozzle 27 will be described with reference to FIG. For convenience of explanation, only the first shuttle 16 will be described below, but the same applies to the second shuttle 17.

  As shown in FIG. 10A, the control device 40 moves the measuring robot 22 that has attracted and gripped the inspected IC chip T to the focal length immediately above the first shuttle 16 at the chip photographing position. . Then, the control device 40 arranges the measurement robot 22 immediately above the first camera 37, and then the four IC chips T illuminated by the first camera 37 on the first strobe 37s and the alignment marks 28 corresponding thereto. Shoot at once.

  The control device 40 stores the captured image data in the image memory 65, performs image processing by the image processor 64, and calculates the suction position and orientation of each IC chip T. Based on the calculation result, the control device 40 calculates the positional deviation of the rotation angle in the X direction, the Y direction, and the XY plane between the suction nozzle 27 corresponding to the position of the central portion of the upper surface of each IC chip T, Store in each register of the RAM 63. Then, when the control device 40 accommodates each IC chip T in the corresponding recovery pocket 35 of the recovery side change kit 34 based on each positional shift, the corresponding suction nozzle is connected via the position adjusting device 25. 27 position adjustment is performed.

  Again, the control device 40 photographs the four IC chips T illuminated by the first strobe 37s at a time at the chip photographing position. The control device 40 stores the captured image data in the image memory 65, performs image processing by the image processor 64, and inspects the state of bumps on the bottom surface of each IC chip T. The control device 40 determines the quality of the bump on the bottom surface of the IC chip by image processing by the image processor 64, and stores the quality result in the register of the RAM 63.

Next, the measurement robot 22 takes out the IC chip T before inspection from the supply pocket 32 of the supply side change kit 31 and attaches it to the inspection socket 23, and then takes out the IC chip T after inspection from the inspection socket 23. The operation until the storage side change kit 34 is accommodated in the recovery pocket 35 will be described with reference to the flowchart shown in FIG.

  First, the control device 40 performs an initial setting operation when the IC handler 10 is turned on or when the IC chip T to be measured is changed. In the initial setting operation, as shown in FIG. 8B, the control device 40 performs image processing on the image data of each inspection socket 23 photographed by the third camera 24 by the image processor 64 and performs each inspection. The position of the socket 23 is calculated. Based on the calculated position of each inspection socket 23, the control device 40 calculates the positional deviation of the corresponding suction nozzle 27 in the X direction, the Y direction, and the rotation angle in the XY plane, and stores it in the register of the RAM 63. (Step S100).

  When the initial setting operation is completed, the controller 40 inserts the IC from the supply-side robot hand unit 20 into each supply pocket 32 of the supply-side change kit 31 of the first shuttle 16 at the supply position shown in FIG. Chip T is supplied.

  When the IC chip T is supplied to each supply pocket 32, the control device 40 switches the shuttle switching valve V1 to the suction device 41 side. When the IC chip T is attracted and fixed to the bottom surface of the supply pocket 32, the control device 40 moves the first shuttle 16 to the pre-inspection transfer position shown in FIG.

  When the first shuttle 16 moves to the pre-inspection transfer position, the control device 40 moves each suction nozzle 27 from the supply pocket 32 of the supply side change kit 31 to an upper position where the corresponding IC chip T can be sucked. Let When each suction nozzle 27 is located at the upper position, the control device 40 lowers each suction nozzle 27 to bring the open end of each suction nozzle 27 into contact with the upper surface of each IC chip T.

  When the opening end of the suction nozzle 27 comes into contact with the IC chip T, the control device 40 switches the nozzle switching valve V2 to the suction device 41 side and sucks and holds each IC chip T by each suction nozzle 27. At the same time, the control device 40 switches the shuttle switching valve V <b> 1 from the suction device 41 side to the atmosphere side to release the suction of the IC chip T to the supply pocket 32.

  Then, as shown in FIG. 6B, the IC chip T sucked by the suction nozzle 27 rises and is detached from the supply pocket 32. Then, the raised IC chip T stands by immediately above the first shuttle 16.

  Subsequently, as shown in FIG. 6C, the control device 40 moves the first shuttle 16 to the chip photographing position, and immediately below each IC chip T waiting immediately above the first shuttle 16. One camera 37 is moved. The control device 40 acquires image data of the four IC chips T sucked and held by the suction nozzles 27 from the first camera 37, executes image recognition (step S102), and shifts the position of each IC chip T ( An adsorption deviation) is obtained (step S104). The control device 40 determines whether or not position correction by the position adjusting device 25 is necessary based on each of the obtained positional deviations and the positional deviation with respect to the inspection socket 23 obtained in the initial setting (step S106).

  When position correction is necessary (YES in step S106), the control device 40 adjusts each IC chip T so that the position adjustment device 25 has a suitable orientation with respect to the inspection socket 23 (step S108). Conversely, if position correction is not necessary (NO in step S106), control device 40 proceeds to step S110 without performing position correction by position adjustment device 25.

Even when the photographing of the IC chip T by the camera 37 is finished, the control device 40 keeps the first shuttle 16 at the chip photographing position for photographing when the IC chip T is collected.
When the adjustment is completed, the control device 40 moves each suction nozzle 27 above the inspection socket 23, then lowers the press holding portion 22c to the suction start position, and further lowers the press device 26 to the mounting position. Each IC chip T is mounted in the corresponding inspection socket 23, and an electrical inspection is performed (step S110). When the electrical inspection is completed (step S112), the control device 40 sucks and holds the IC chip T by the suction nozzle 27 and removes it from the inspection socket 23, and reaches the upper side of the camera 37 of the first shuttle 16. Move.

  When moving to above the camera 37, the control device 40 acquires the image data of the IC chip T sucked and held by each suction nozzle 27 from the first camera 37, and executes image recognition (step S120). And the control apparatus 40 calculates | requires the position shift of each IC chip T (step S122). Subsequently, the control device 40 determines whether or not position correction is required by the position adjustment device 25 based on the obtained positional deviations (step S124).

  When position correction is necessary (YES in step S124), the control device 40 determines each IC so that the position adjustment device 25 has a suitable orientation with respect to the collection pocket 35 based on the obtained position shift. The chip T is adjusted (step S126). On the other hand, if position correction is not required (NO in step S124), control device 40 proceeds to step S128 without performing position correction by position adjustment device 25.

  The control device 40 again acquires the image data of the IC chip T sucked and held by each suction nozzle 27 from the camera 37, and detects the quality of the bump on the bottom surface of the IC chip T (step S128).

  When the photographing by the first camera 37 is completed, the control device 40 moves the first shuttle 16 to the post-inspection transfer position as shown in FIG. That is, each collection pocket 35 of the collection side change kit 34 of the first shuttle 16 is positioned directly below each corresponding IC chip T held by each suction nozzle 27.

  Thereafter, the control device 40 lowers the suction nozzle 27 and places the IC chip T in the collection pocket 35 (step S130). At that time, the bump B on the bottom surface of the IC chip T is fitted into the dimple 36d of the dimple plate 36 on the bottom surface of the collection pocket 35 (see FIG. 4C).

  Then, the control device 40 switches the nozzle switching valve V2 for the suction nozzle 27 from the suction device 41 side to the atmosphere side, and releases the suction nozzle 27 from the suction end of the IC chip T.

  Next, the control device 40 moves the first shuttle 16 to the collection position and carries the IC chip T in the collection pocket 35 to the collection-side robot hand unit 21. Thereafter, the control device 40 determines whether or not all the IC chips T have been inspected (step S132). If all the IC chips T have not been inspected, the process returns to step S102. On the other hand, when all the IC chips T have been inspected, the process ends.

According to this embodiment, the following effects can be obtained.
(1) According to the present embodiment, the first and second cameras 37 and 38 are provided on the upper surfaces of the first and second shuttles 16 and 17. Therefore, a place for installing the camera on the base 11 is not required. As a result, the distance between the first and second shuttles 16 and 17 and the inspection socket 23 can be shortened, so that the IC handler 10 can be made smaller.

  Further, since the IC chip T is photographed by the first and second cameras 37 and 38 on the upper surfaces of the first and second shuttles 16 and 17, the measurement robot 22 needs to move the IC chip T sucked and held to the position of the camera. There is no. As a result, since the measuring robot 22 can transport the IC chip T at the shortest distance between the shuttles 16 and 17 and the inspection socket 23, the transport time of the IC chip T is shortened and the time required for the inspection process of the IC chip T is reduced. Can be shortened.

  Furthermore, the first and second cameras 37 and 38 are quickly moved to the chip photographing position by the first and second shuttles 16 and 17 that move at a higher speed than the measurement robot 22. The time required for shooting can be shortened.

  (2) According to the present embodiment, the alignment mark 28 was photographed together with the IC chip T. Therefore, image processing is performed with reference to the alignment mark 28 photographed at the same time as the IC chip T, and the positional deviation (suction deviation) of the IC chip T can be calculated. As a result, since it is not necessary to separately photograph the alignment mark 28 and the like when calculating the positional deviation of the IC chip T, the time required for photographing can be shortened.

  Moreover, since the alignment mark 28 is provided in the measurement robot 22, it is not necessary to secure a space for arranging the alignment mark 28 and the like in the base 11, and the IC handler 10 can be made small.

  (3) According to the present embodiment, the first and second cameras 37 and 38 photograph the IC chip T sucked and held by the measurement robot 22 from below. Therefore, even if the first and second cameras 37 and 38 do not have a focal length adjustment function, the IC chip T and the first and second cameras 37 and 38 are moved by moving the pressing holding portion 22c of the measurement robot 22 in the Z direction. And the focal length can be adjusted. As a result, the first and second cameras 37 and 38 can have a simple structure.

  (4) According to the present embodiment, the first and second cameras 37 and 38 are used to calculate the positional deviation of the IC chip T before and after the inspection, and the bumps on the bottom surface of the inspected IC chip T. It was used to acquire image data for the inspection of the state. Therefore, since one camera can be used for many purposes, the high-function IC handler 10 can be provided at a low cost with a simple structure.

In addition, you may change the said embodiment as follows.
In the above embodiment, the third camera 24 can photograph all the inspection sockets 23 at once. However, the present invention is not limited to this, and the third camera 24 may shoot each inspection socket 23 in a plurality of times. In that case, the measurement robot 22 may be moved in the Y direction, and the third camera 24 may be sequentially photographed at a position facing each inspection socket 23 to be photographed. Then, the inspection socket 23 can be photographed one after another with one camera.

For example, a case where the third camera 24 photographs two inspection sockets 23 arranged in the X direction at a time will be described. At this time, the image processor 64 preferably changes the setting so that two inspection sockets 23 are extracted and image processing is possible. As shown in FIG. 12A, the measuring robot 22 is arranged on the first shuttle 16 and then moved in the direction of the inspection socket 23. As shown in FIG. 12B, when the third camera 24 is disposed immediately above the inspection socket 23 near the first shuttle 16, the inspection socket 23 is photographed. Further, the measuring robot 22 is moved in the direction of the inspection socket 23. As shown in FIG. 12C, when the third camera 24 is disposed immediately above the next inspection socket 23, the inspection socket 23 may be photographed.

  In the above embodiment, the first and second cameras 37 and 38 can photograph all the IC chips T held by the measurement robot 22 at a time. However, the present invention is not limited to this, and the first and second cameras 37 and 38 may shoot each IC chip T in a plurality of times. When photographing a plurality of IC chips T in the X direction, the first or second shuttle 16 or 17 is moved, and in the case of photographing in the Y direction, the measuring robot 22 is moved, The first and second cameras 37 and 38 may be photographed in accordance with the positions facing the respective IC chips T to be photographed. Then, the IC chips T can be photographed one after another with one camera.

  For example, a case will be described in which the first camera 37 photographs two pre-inspection IC chips T arranged in the Y direction at a time. At this time, the image processor 64 preferably changes the setting so that two IC chips T can be extracted and image processed. As shown in FIG. 13 (a), the measuring robot 22 that sucks and holds the IC chip T at the supply side position moves up at that position. The first shuttle 16 moves toward the collection position. As shown in FIG. 13B, when the first camera 37 is disposed immediately below the IC chip Tb on the collection side of the measurement robot 22 (hereinafter referred to as the first chip photographing position), the IC chip Tb is photographed. To do. Further, the first shuttle 16 moves toward the collection position. As shown in FIG. 13C, when the first camera 37 is placed directly below the IC chip Ta on the supply side of the measurement robot 22 (hereinafter referred to as a second chip photographing position), the IC chip Ta is photographed. Good.

  For example, a case where the first camera 37 can photograph two inspected IC chips T arranged in the Y direction at a time will be described. At this time, the image processor 64 preferably changes the setting so that two IC chips T can be extracted and image processed. As shown in FIG. 14 (a), when the first shuttle 16 is at the second chip photographing position, the measuring robot 22 sucks and holds the inspected IC chip T and moves directly above the first shuttle 16, The IC chip Ta is photographed. The first shuttle 16 moves to the first chip photographing position. As shown in FIG. 14B, the IC chip Tb is photographed when the first shuttle 16 is arranged at the first chip photographing position. Next, the IC chip Tb is photographed for bump inspection at the same position. The first shuttle 16 moves to the second chip photographing position. As shown in FIG. 14C, the IC chip Ta is photographed for bump inspection at the same position. Thereafter, as shown in FIG. 14D, the first shuttle 16 may be moved to the collection position.

  In the above embodiment, the first and second cameras 37 and 38 are arranged directly below the IC chip T when the IC chip T is photographed. However, the present invention is not limited to this, and the first and second cameras 37 and 38 are moved directly under the IC chip T while the first and second shuttles 16 and 17 are moved. When doing so, the IC chip T may be photographed. By doing so, the time required for shooting can be shortened.

  In addition, although the image | photographed image may flow through the image image | photographed while moving the 1st and 2nd shuttles 16 and 17, the 1st and 2nd strobe light 37s and 38s increase the light emission time. If it is shortened, the image flow can be reduced. Even in the case of a flowed image, the position of the IC chip T is suitably obtained from the flowed image by using the center of gravity measurement for the recognition algorithm of the bump on the bottom surface of the IC chip T and the alignment mark 28 in the image processor 64. The position shift of the IC chip T can be calculated by the control device 40.

  In the present embodiment, the first to third cameras 37, 38, and 24 did not have a focal length adjustment function. However, the present invention is not limited to this, and each of the cameras 37, 38, and 24 may have a focal length adjustment function.

In the above embodiment, the IC handler 10 includes the first and second shuttles 16 and 17. However, the present invention is not limited to this, and the number of shuttles may be one or more than two.
In the above embodiment, the shuttles 16 and 17 are provided with the supply side change kit 31 and the collection side change kit 34. However, the present invention is not limited to this, and any combination of the change kits disposed on the first and second shuttles 16 and 17 may be used as long as it is suitable for the IC handler 10. Also, there may be one change kit or more than two. In this case, a suitable change kit among the supply side change kit 31 or the collection side change kit 34 may be used as the change kit.

The top view of the IC handler of this embodiment. (A) is a top view of the shuttle of this embodiment, (b) The side view of the same shuttle. The perspective view of the supply side change kit of this embodiment. (A) is a perspective view of a collection side change kit fitted with a dimple plate of the present embodiment, (b) is a perspective view of the dimple plate, and (c) is a partial cross-sectional view in which a bump and a dimple are fitted. (A) is a side view of the measurement robot of this embodiment, (b) is a bottom view of the measurement robot. (A) Explanatory drawing explaining the supply position of the shuttle of this embodiment, (b) Explanatory drawing explaining the transfer position before an inspection similarly, (c) Explanatory drawing explaining a chip | tip imaging | photography position, (d) Same Explanatory drawing explaining the transfer position after an inspection, (e) Explanatory drawing explaining a collection position similarly. The electric block diagram of the measuring robot of this embodiment. (A) is explanatory drawing before test | inspection socket imaging | photography with the 3rd camera of this embodiment, (b) It is explanatory drawing of imaging | photography of a test | inspection socket similarly. (A) Explanatory drawing before imaging | photography of IC chip T before the test | inspection by the 1st camera of this embodiment, (b) Explanatory drawing of imaging | photography of IC chip T similarly. (A) Explanatory drawing of imaging | photography of the test | inspected IC chip T by the 1st camera of this embodiment, (b) Explanatory drawing after image | photographing IC chip T similarly. The flowchart figure explaining imaging | photography operation | movement of the measuring robot of this embodiment. (A) (b) (c) is explanatory drawing explaining another example which image | photographs the socket for a test | inspection by the 3rd camera of this embodiment. (A) (b) (c) is explanatory drawing of another example which image | photographs IC chip T before the test | inspection by the 1st camera of this embodiment. (A) (b) (c) (d) is explanatory drawing of another example which image | photographs IC chip T inspected by the 1st camera of this embodiment.

Explanation of symbols

T ... IC chip, 10 ... IC handler, 11 ... base, 12 ... safety cover, 13 ... high temperature chamber, 14 ... supply robot, 15 ... collection robot, 16 ... first shuttle, 17 ... second shuttle, 18 ... tray, DESCRIPTION OF SYMBOLS 20 ... Supply side robot hand unit, 21 ... Collection | recovery side robot hand unit, 22 ... Measuring robot, 23 ... Inspection socket, 24 ... 3rd camera, 27 ... Adsorption nozzle, 30 ... Rail, 31 ... Supply side change kit, 32 ... Supply pocket, 33 ... Suction hole, 34 ... Recovery side change kit, 35 ... Recovery pocket, 37 ... First camera, 38 ... Second camera.

Claims (6)

Position adjustment that enables electronic components to be gripped and transported between the shuttle and the inspection socket by a press holding device, and image data obtained by photographing the electronic components is processed to correct the position of the electronic components. In an IC handler equipped with a device,
An IC handler characterized in that the shuttle is provided with a camera capable of photographing an electronic component held by the pressing and holding device. In the IC handler according to claim 1,
The shuttle is provided with a change kit on both sides, and the camera is provided at an intermediate position between the two change kits. In the IC handler according to claim 1 or 2,
An IC handler, wherein the shuttle includes a strobe for illuminating the electronic component. In the IC handler according to any one of claims 1 to 3,
The IC handler, wherein the pressing and holding device includes an alignment mark. In the IC handler according to any one of claims 1 to 4,
The IC handler, wherein the pressing and holding device moves to a focal length of a camera. In a shuttle for an IC handler that includes a change kit, and moves the change kit to at least a position where an electronic component is gripped by the pressing and holding device and a position where the electronic component gripped by the pressing and holding device is accommodated.
A shuttle for an IC handler, comprising a camera capable of photographing an electronic component gripped by the pressing and holding device.

Images