JP2008130948A - Device for supporting substrate and device for processing substrate provided with same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for supporting a substrate adapted to obviate a processing-failure and an operation-failure of a substrate caused by particles created by friction between constituent members, and to provide a device for processing a substrate provided with the device for supporting a substrate. <P>SOLUTION: When a spin chuck 500 is to support a substrate W, a second linking member 702 and a first linking member 701 are operated and a force to provide lowering together with rotation (an arrow M3) acts on a supporting member 600a. Thereby, a tapered shaft surface 611 of the supporting member 600a abuts a tapered hole surface HT of a spin base 700, thereby causing an interspace between a lift shaft 605 and a member-inserting hole H to be closed by the tapered shaft surface 611. When a substrate W is to be released from the spin chuck 500, the second linking member 702 and the first linking member 701 are operated and a force to provide lifting together with rotation (an arrow N3) acts on the supporting member 600a. Thereby, the tapered shaft surface 611 of the supporting member 600a is lifted while rotated, entailing removal of the tapered shaft surface 611 of the supporting member 600a from the tapered hole surface HT of a spin base 700. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate holding device that holds a substrate and a substrate processing apparatus including the substrate holding device.

  Conventionally, in order to perform various processes on substrates such as semiconductor wafers, photomask glass substrates, liquid crystal display glass substrates, plasma display glass substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, etc. A substrate processing apparatus is used.

  When performing processing such as cleaning, application of a resist solution, or development on a substrate, a processing solution such as a cleaning solution, a resist solution, or a developer is supplied onto the rotating substrate while the substrate is rotated.

  Such a substrate processing apparatus includes a spin chuck for holding a single substrate horizontally in a processing chamber and rotating it around a vertical axis. The spin chuck includes a spin base that is rotated around a rotation axis along the vertical direction, and a plurality of holding members provided on the spin base. Each holding member has a holding pin for holding the substrate in contact with the outer peripheral end of the substrate (see, for example, Patent Document 1).

  The structure and operation of a conventional spin chuck and holding member will be described with reference to the drawings. FIG. 9A shows a plan view of a conventional spin chuck having a plurality of holding members, and FIG. 9B shows an enlarged cross-sectional view taken along the line KK of FIG. 9A.

  As shown in FIG. 9A, the spin chuck 900 includes a disk-shaped spin base 990, and a central portion of the spin chuck 900 is treated with a cleaning liquid or a rinsing liquid on the lower surface of the substrate W held by the spin chuck 900. A nozzle 910 for supplying liquid is provided.

  A plurality of holding members J <b> 1 to J <b> 3 (three in this example) are disposed on the peripheral edge of the upper surface of the spin base 990 at substantially equal angular intervals. Each of these holding members J1 to J3 has an elliptical flat plate portion 901. At one end and the other end on the flat plate portion 901, a horizontal support pin 902 and a holding pin 903 are formed so as to protrude upward.

  As shown in FIG. 9B, a through hole 990H is formed in the spin base 990. A rotation shaft 920 is rotatably inserted into the through hole 990H via a bearing 991 and a seal member 992. The rotation shaft 920 is rotated by a rotation mechanism 930 provided in the spin base 990.

  The flat plate portion 901 of the holding members J1 to J3 is fixed to the upper end of the rotation shaft 920 on the spin base 990. The axis of the rotation shaft 920 coincides with the axis of the horizontal support pin 902 formed on the flat plate portion 901.

  When the spin chuck 900 holds the substrate W, the substrate W is first placed on the horizontal support pins 902 of the plurality of holding members J1 to J3.

  In this state, when the rotation shaft 920 rotates in one direction (see arrow V1 in FIG. 9B), the holding pin 903 rotates around the horizontal holding pin 902 toward the outer peripheral end of the substrate W ( FIG. 9B (see arrow V2). As a result, the holding pin 903 comes into contact with the outer peripheral end of the substrate W, and the substrate W is held by the plurality of holding pins 903.

On the other hand, when the spin chuck 900 opens the substrate W, the rotation shaft 920 rotates in the reverse direction, so that the holding pin 903 rotates about the horizontal holding pin 902 away from the substrate W. As a result, the holding pins 903 are separated from the outer peripheral end of the substrate W, and the substrate W is released from the plurality of holding pins 903.
JP 2004-111903 A

  However, in the above-described conventional substrate processing apparatus, when the rotation shaft 920 rotates when the spin chuck 900 holds or releases the substrate W, the rotation shaft 920 and the bearing 991 rub against each other. Further, the flat plate portion 901 and the upper surface of the bearing 991 (the upper surface of the spin base 990) are rubbed.

  As a result, the holding members J1 to J3 and their peripheral members are worn to generate particles Pt. When the particles Pt are scattered inside the processing chamber, the particles Pt may adhere to the substrate W and cause a processing failure of the substrate W.

  Therefore, in order to reduce the wear of the holding members J1 to J3 and their peripheral members, it is sufficient between the rotating shaft 920 and the bearing 990H and between the flat plate portion 901 and the upper surface of the bearing 990H (the upper surface of the spin base 990). A structure in which a large gap (clearance) is provided is conceivable. By providing a sufficiently large gap between the holding members J1 to J3 and their peripheral members, wear of the holding members J1 to J3 and their peripheral members is reduced.

  However, even in the rotation mechanism provided inside the spin base 990, particles Pt are generated due to rubbing between the constituent members. Particles Pt generated from the rotation mechanism are likely to be scattered from the inside of the spin base 990 to the outside of the spin base 990 through the gap. Also in this case, there is a possibility that processing defects of the substrate W may occur.

  Further, the processing liquid supplied to the substrate W can easily enter the spin base 990 through the gap. In this case, the constituent member provided in the spin base 990 may be corroded by the processing liquid, resulting in malfunction.

  An object of the present invention is to provide a substrate holding device and a substrate processing apparatus including the substrate holding device in which a substrate processing failure and an operation failure due to particles generated by rubbing between constituent members are prevented.

  (1) A substrate holding device according to a first aspect of the present invention is a substrate holding device that holds a substrate substantially horizontally, having a top surface portion and a bottom surface portion, and having a through hole in the top surface portion, and a casing member A support shaft that is rotatably inserted into the through-hole and an upper surface of the support shaft, and the substrate is brought into contact with the outer peripheral end of the substrate on the casing member in accordance with the rotation of the support shaft. The holding portion is provided so as to be movable between a holding position held at the open position and an open position separated from the outer peripheral edge of the substrate, and is provided inside the casing member, and the support shaft moves in a substantially vertical direction while rotating. A drive mechanism for driving the support shaft, and an upper surface provided on the support shaft so as to close a gap between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole when the holding portion is in the holding position. The holding part is moved between the holding position and the open position. It is obtained by a closing portion away from the upper surface portion at the time of.

  In this substrate holding device, a through hole is provided in the upper surface portion of the casing member, and a support shaft is rotatably inserted into the through hole. When the drive mechanism provided inside the casing member drives the support shaft, the support shaft moves in a substantially vertical direction while rotating. Thereby, the holding | maintenance part provided above the upper surface part of the casing member moves between a holding position and an open position with rotation of a support shaft.

  In the holding position, the holding portion comes into contact with the outer peripheral end portion of the substrate on the casing member. Thereby, the substrate is held in a substantially horizontal direction.

  At this time, the closing portion provided on the support shaft comes into contact with the upper surface portion from above so as to close the gap between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole. Thereby, the internal space of a casing member and the space above an upper surface part are interrupted | blocked. As a result, particles generated by friction between the constituent members inside the casing member are scattered in the space above the upper surface portion through the gap between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole. Is prevented. As a result, substrate processing failures are prevented.

  Further, when the processing liquid is supplied to the held substrate, the processing liquid supplied to the substrate passes through the gap between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole, and the inside of the casing member. Intrusion is prevented. Thereby, it is prevented that the structural member inside a casing member corrodes with a process liquid, and generation | occurrence | production of a malfunction is prevented.

  On the other hand, when the holding portion moves between the holding position and the release position, the closing portion is separated from the upper surface portion. In this case, the closing portion does not rotate while being in contact with the upper surface portion. This prevents the closed portion and the upper surface portion of the casing member from rubbing against each other. Thereby, generation | occurrence | production of the particle | grains by the abrasion of a obstruction | occlusion part and an upper surface part is prevented. As a result, the particles are prevented from scattering in the space above the upper surface portion, and the processing failure of the substrate is prevented.

  In addition, since no frictional force is generated between the closed portion and the upper surface portion, the driving force required when the drive mechanism drives the support shaft inside the casing member is reduced. Thereby, the structural member inside a casing member can be reduced in size and weight.

  (2) The substrate holding device may further include a rotation driving unit that rotates around a substantially vertical axis while supporting the casing member substantially horizontally.

  In this case, the casing member is rotated by the rotation driving unit around the substantially vertical axis while being supported substantially horizontally. Due to the centrifugal force generated by the rotation of the casing member, airflow is likely to be generated in the internal space of the casing member and the space above the upper surface portion.

  Even in such a case, when the holding portion holds the substrate, the internal space of the casing member and the space above the upper surface portion are blocked. Thereby, particles generated inside the casing member are prevented from being scattered into the space above the upper surface portion through the gap between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole. As a result, substrate processing failures are prevented.

  (3) The support shaft is formed with a spiral groove extending in a substantially vertical direction, the drive mechanism is a rotation mechanism that rotates the support shaft, and the support shaft is moved in a substantially vertical direction as the support shaft rotates. And an engaging portion that engages with the spiral groove to move.

  In this case, since the engaging portion is engaged with the spiral groove, when the support shaft is rotated by the rotation mechanism, the support shaft moves in a substantially vertical direction while rotating with respect to the engaging portion.

  Thereby, it becomes possible to implement | achieve obstruction | occlusion and open | release of the clearance gap between the outer peripheral surface of the support shaft by the obstruction | occlusion part, and the internal peripheral surface of a through-hole with a simple structure. Therefore, the manufacturing cost of the substrate holding device is suppressed.

  (4) The support shaft is provided with an inclined portion having a lower surface that is inclined along the circumferential direction. The drive mechanism includes a rotation mechanism that rotates the support shaft, and a support shaft that rotates along with the rotation of the support shaft. And a contact portion that contacts the lower surface of the inclined portion so as to move in a substantially vertical direction.

  In this case, when the support shaft is rotated by the rotation mechanism, the inclined portion provided on the support shaft is also rotated. The lower surface of the inclined portion is in contact with the contact portion. As a result, the support shaft moves in a substantially vertical direction while rotating with respect to the contact portion.

  Thereby, it becomes possible to implement | achieve obstruction | occlusion and open | release of the clearance gap between the outer peripheral surface of the support shaft by the obstruction | occlusion part, and the internal peripheral surface of a through-hole with a simple structure. Therefore, the manufacturing cost of the substrate holding device is suppressed.

  (5) The drive mechanism may further include a biasing member that biases the support shaft in a direction in which the contact portion is pressed. In this case, the inclined portion is pressed by the urging member so as to contact the contact portion. As a result, the inclined portion reliably contacts the contact portion, and the holding portion can be reliably moved in the substantially vertical direction. This makes it possible to more reliably close and open the gap between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole due to the closing portion.

  (6) The closing portion is an annular protrusion having a diameter larger than that of the through hole and protruding from the outer peripheral surface of the support shaft in a flange shape, and the annular protrusion is in contact with the upper surface portion of the casing member. You may have the cyclic | annular lower surface which touches.

  In this case, the annular lower surface of the annular protrusion comes into contact with the upper surface portion of the casing member, so that the gap between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole is reliably closed.

  (7) An annular inclined surface may be formed at the edge of the through hole in the upper surface portion of the casing member, and the annular lower surface of the annular protrusion may be inclined corresponding to the annular inclined surface.

  In this case, the annular lower surface of the annular protrusion comes into contact with the annular inclined surface formed on the upper surface portion of the casing member, thereby closing the gap between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole. At this time, since the annular lower surface is inclined corresponding to the annular inclined surface, a sufficiently large contact area between the annular lower surface and the annular inclined surface is ensured. Thereby, the clearance gap between the outer peripheral surface of a support shaft and the inner peripheral surface of a through-hole is obstruct | occluded reliably.

  (8) The part which has a through-hole of the upper surface part of a casing member may be formed so that removal is possible. Thereby, when the part which has a through-hole of the upper surface part of a casing member deteriorates, the part can be replaced | exchanged easily.

  (9) The portion having the through hole in the upper surface portion of the casing member may be formed of resin. Thereby, the part which has a through-hole of the upper surface part of a casing member can be processed easily with high precision. Thereby, the clearance gap between the outer peripheral surface of a support shaft and the inner peripheral surface of a through-hole can be obstruct | occluded reliably.

  (10) The holding portion is provided so as to be further movable between the open position and a separated position that is farther from the outer peripheral end of the substrate than the open position, and the closing portion is supported when the holding portion is in the separated position. A gap between the outer peripheral surface of the shaft and the inner peripheral surface of the through hole may be closed.

  In this case, the holding unit moves from the open position to a separated position that is farther from the outer peripheral end of the substrate than the open position. The closing portion closes the gap between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole when the holding portion is in the separated position. Thereby, even when the processing liquid remains above the upper surface of the casing member when the holding unit does not hold the substrate, the processing liquid is between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole. Intrusion into the casing member through the gap is prevented.

  (11) A substrate processing apparatus according to a second aspect of the present invention is a substrate processing apparatus that performs predetermined processing on a substrate, wherein the substrate holding apparatus according to the first aspect of the invention and a substrate held by the substrate holding apparatus are processed. The processing part which performs is provided.

  In this substrate processing apparatus, processing is performed on the substrate held by the substrate holding apparatus described above by the processing unit.

  In the substrate holding device, a through hole is provided in the upper surface portion of the casing member, and a support shaft is rotatably inserted into the through hole. When the drive mechanism provided inside the casing member drives the support shaft, the support shaft moves in a substantially vertical direction while rotating. Thereby, the holding | maintenance part provided above the upper surface part of the casing member moves between a holding position and an open position with rotation of a support shaft.

  In the holding position, the holding portion comes into contact with the outer peripheral end portion of the substrate on the casing member. Thereby, the substrate is held in a substantially horizontal direction.

  At this time, the closing portion provided on the support shaft comes into contact with the upper surface portion from above so as to close the gap between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole. Thereby, the internal space of a casing member and the space above an upper surface part are interrupted | blocked. As a result, particles generated by friction between the constituent members inside the casing member are scattered in the space above the upper surface portion through the gap between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole. Is prevented. As a result, substrate processing failures are prevented.

  Further, when the processing liquid is supplied to the held substrate, the processing liquid supplied to the substrate passes through the gap between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole, and the inside of the casing member. Intrusion is prevented. Thereby, it is prevented that the structural member inside a casing member corrodes with a process liquid, and generation | occurrence | production of a malfunction is prevented.

  On the other hand, when the holding portion moves between the holding position and the release position, the closing portion is separated from the upper surface portion. In this case, the closing portion does not rotate while being in contact with the upper surface portion. This prevents the closed portion and the upper surface portion of the casing member from rubbing against each other. Thereby, generation | occurrence | production of the particle | grains by the abrasion of a obstruction | occlusion part and an upper surface part is prevented. As a result, the particles are prevented from scattering in the space above the upper surface portion, and the processing failure of the substrate is prevented.

  In addition, since no frictional force is generated between the closed portion and the upper surface portion, the driving force required when the drive mechanism drives the support shaft inside the casing member is reduced. Thereby, the structural member inside a casing member can be reduced in size and weight.

  According to the present invention, it is possible to sufficiently prevent substrate processing failures and operation failures caused by particles generated by rubbing between constituent members.

  A substrate holding device and a substrate processing apparatus including the same according to an embodiment of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, and the like.

(1) Configuration of Substrate Processing Apparatus FIG. 1 is a schematic cross-sectional view for explaining the configuration of a substrate processing apparatus according to an embodiment of the present invention.

  In the substrate processing apparatus 100, the cleaning process is performed by rotating the substrate W and supplying a processing liquid such as a cleaning liquid or a rinsing liquid to the rotating substrate W. Further, the drying process is performed by rotating the substrate W after the cleaning process.

  As the cleaning liquid for the cleaning process, for example, BHF (buffered hydrofluoric acid), DHF (dilute hydrofluoric acid), hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid, ammonia, or an aqueous solution thereof, or a mixed solution thereof Etc. are used. As the rinsing liquid, for example, pure water, carbonated water, ozone water, magnetic water, reduced water (hydrogen water) or ionic water, or an organic solvent such as IPA (isopropyl alcohol) is used.

  As shown in FIG. 1, the substrate processing apparatus 100 includes a spin chuck 500 for holding the substrate W horizontally and rotating the substrate W about a vertical axis passing through the center of the substrate W. The spin chuck 500 is fixed to the upper end of the rotation shaft 25 rotated by the chuck rotation drive mechanism 36. The substrate W rotates while being held horizontally by the spin chuck 500 during the cleaning process and the drying process.

  A motor 60 is provided outside the spin chuck 500. A rotation shaft 61 is connected to the motor 60. In addition, an arm 61A is connected to the rotation shaft 61 so as to extend in the horizontal direction, and a nozzle 50 is provided at the tip of the arm 61A.

  One end of a fluid supply pipe 63 is connected to the nozzle 50. The fluid supply pipe 63 is provided so as to pass through the inside of the arm 61A and the rotation shaft 61, and the other end is connected to a processing liquid supply source (not shown). The processing liquid supply source supplies the processing liquid to the nozzle 50 through the fluid supply pipe 63. Thereby, the processing liquid is discharged from the nozzle 50 toward the upper surface of the substrate W.

  The rotating shaft 25 to which the spin chuck 500 is fixed is a hollow shaft. A processing liquid supply pipe 82 is inserted into the rotary shaft 25. The processing liquid supply pipe 82 extends to a position close to the lower surface of the substrate W held by the spin chuck 500. A lower surface nozzle 81 is provided at one end of the processing liquid supply pipe 82.

  The other end of the processing liquid supply pipe 82 is connected to a processing liquid supply source (not shown). The processing liquid supply source supplies the processing liquid to the lower surface nozzle 81 through the processing liquid supply pipe 82. Thereby, the processing liquid is discharged from the lower surface nozzle 81 toward the lower surface center of the substrate W.

  As described above, the processing liquid is discharged onto the substrate W from one or both of the nozzle 50 and the lower surface nozzle 81. Thereby, the upper surface and the lower surface of the substrate W are cleaned.

  The spin chuck 500 is accommodated in the processing cup 23. A cylindrical partition wall 33 is provided inside the processing cup 23. Further, a waste space 31 for collecting and discarding the rinsing liquid used for the rinsing process of the substrate W is formed so as to surround the periphery of the spin chuck 500. The waste space 31 is formed in a ring shape and a groove shape along the outer periphery of the spin chuck 500, and one end of the waste pipe 34 is connected thereto. The other end of the waste pipe 34 is connected to a waste facility (not shown).

  Further, a recovery liquid space 32 for recovering and reusing the cleaning liquid used for the cleaning process of the substrate W is formed between the processing cup 23 and the partition wall 33 so as to surround the disposal space 31. The recovery liquid space 32 is formed in a ring shape and a groove shape along the outer periphery of the disposal space 31, and one end of the recovery pipe 35 is connected to the recovery liquid space 32. The other end of the recovery pipe 35 is connected to a recovery liquid circulation system (not shown).

  A splash guard 24 is provided above the processing cup 23 to prevent the processing liquid from the substrate W from splashing outward. The splash guard 24 has a rotationally symmetric shape with respect to the rotation shaft 25. On the inner surface of the upper end portion of the splash guard 24, a discard guide groove 41 having a square cross section is formed in an annular shape.

  Further, a recovery liquid guide portion 42 is formed on the inner surface of the lower end portion of the splash guard 24. The recovery liquid guide portion 42 has an inclined surface that is inclined outward and downward. A partition wall storage groove 43 for receiving the partition wall 33 of the processing cup 23 is formed in the vicinity of the upper end of the recovered liquid guide portion 42.

  The splash guard 24 is supported by a guard lifting / lowering drive mechanism (not shown) constituted by a ball screw mechanism or the like. The guard lifting / lowering drive mechanism holds the splash guard 24 in the carry-in / carry-out position where the upper end of the splash guard 24 is substantially the same as or lower than the upper end of the spin chuck 500 and the recovered liquid guide 42 is held in the spin chuck 500. The collection position facing the outer peripheral end of the substrate W and the disposal guide groove 41 are moved up and down between the disposal position facing the outer peripheral end of the substrate W held by the spin chuck 500.

  When the substrate W is loaded onto the spin chuck 500 and when the substrate W is unloaded from the spin chuck 500, the splash guard 24 is lowered to the loading / unloading position.

  When the splash guard 24 is in the recovery position, the cleaning liquid splashed outward from the substrate W is guided to the circulating liquid space 32 by the recovery liquid guide part 42 and sent to the recovery liquid circulation system (not shown) through the recovery pipe 35.

  On the other hand, when the splash guard 24 is at the disposal position, the rinse liquid splashed outward from the substrate W is guided to the disposal space 31 by the disposal guide groove 41 and sent to a disposal facility (not shown) through the disposal pipe 34.

  In the present embodiment, the spin chuck 500, the rotation shaft 25, and the chuck rotation drive mechanism 36 constitute a substrate holding device.

(2) Details of Structure and Operation of Spin Chuck Details of the structure and operation of the spin chuck 500 of FIG. 1 will be described. FIG. 2 is a top view of the spin chuck 500 of FIG. In FIG. 2, the substrate W held by the spin chuck 500 is indicated by a dotted line.

  As shown in FIG. 2, a plurality (three in this example) of holding members 600 a, 600 b, and 600 c are arranged at equiangular intervals on the peripheral edge of the upper surface of the spin chuck 500.

  Each of the plurality of holding members 600 a to 600 c includes a holding pin 601 and a horizontal support pin 603. A plurality of horizontal support pins 603 of the holding members 600 a to 600 c abut on the lower surface of the substrate W. Further, the holding pins 601 of the holding members 600 a to 600 c abut on the outer peripheral end of the substrate W. As a result, the substrate W is held horizontally on the spin base 700.

  A through hole WH is formed at the center of the spin base 700, and a discharge port of the lower surface nozzle 81 is disposed at the center of the through hole WH so as to face the lower surface of the substrate W held by the spin chuck 500. ing.

  3 and 4 are views for explaining the structure and operation of the spin chuck 500 of FIG.

  FIG. 3A shows a top view of the spin chuck 500 viewed through the spin base 700, and FIG. 3B shows a cross-sectional view of the spin chuck 500 taken along the line TT in FIG. 3A. It is shown. In FIG. 3A, the spin base 700 is indicated by a broken line.

  First, as shown in FIG. 3B, the spin base 700 has a hollow structure having an upper surface portion UP and a lower surface portion BP. A member insertion hole H is formed in the upper surface portion UP of the spin base 700. Further, a screw 609 is erected at a position of the lower surface portion BP facing the member insertion hole H inside the spin base 700.

  The holding member 600a has a lifting shaft 605 extending downward, and the lifting shaft 605 is inserted into the member insertion hole H. A screw hole 605n (see FIG. 5 described later) extending upward from the lower end portion is formed inside the elevating shaft 605. The screw hole 605n of the elevating shaft 605 is screwed with a screw 609 provided upright on the lower surface portion BP of the spin base 700. Thus, the lifting shaft 605 is supported so as to be rotatable and liftable with respect to the spin base 700.

  Here, the center axis of the elevating shaft 605 coincides with the center axis of the horizontal support pin 603. Accordingly, by rotating the lifting shaft 605, the holding member 600a rotates about the horizontal support pin 603 and moves in the vertical direction.

  The structure of the holding members 600b and 600c and the structure of their peripheral members are the same as the structure of the holding member 600a and its peripheral members.

  As shown in FIGS. 3A and 3B, the spin base 700 has a built-in interlocking link mechanism 710 corresponding to each of the holding members 600 a to 600 c.

  The interlocking link mechanism 710 includes a first connecting member 701, a second connecting member 702, a third connecting member 703, a fourth connecting member 704, and a spring member 705.

  As shown in FIG. 3A, the first connecting member 701 has a boomerang shape in the horizontal direction. A hole is formed in a substantially central portion of the first connecting member 701. The lifting shaft 605 (FIG. 3B) of the holding members 600a to 600c is inserted into the hole.

  The first connecting member 701 is fixed to the lifting shaft 605. Accordingly, the holding members 600a to 600c and the first connecting member 701 can be integrally rotated and raised / lowered around the raising / lowering shaft 605. One end portion of the first connecting member 701 is connected to one end portion of the second connecting member 702 so as to be rotatable and movable up and down.

  Specifically, a through hole extending in the vertical direction is formed at one end of the first connecting member 701, and a connecting shaft Q extending upward is provided at one end of the second connecting member 702. The connecting shaft Q of the second connecting member 702 is inserted into the through hole of the first connecting member 701.

  The other end of the second connecting member 702 is rotatably connected to one end of the third connecting member 703. The other end of the third connecting member 703 is connected to be fixed to one end of the fourth connecting member 704. Here, the rotation shaft P <b> 1 is provided so as to penetrate the connecting portion between the third connecting member 703 and the fourth connecting member 704.

  The rotation axis P <b> 1 is erected at a predetermined location in the spin base 700. Thereby, both the 3rd connection member 703 and the 4th connection member 704 can be rotated centering on the rotating shaft P1.

  The other end portion of the fourth connecting member 704 is rotatably connected to a predetermined portion of a ring 706 disposed so as to be concentric with the center of the spin base 700. The ring 706 is provided on the lower surface BP of the spin base 700 so as to be rotatable with respect to the spin base 700.

  A spring member 705 is stretched between a predetermined portion of the ring 706 and a predetermined portion in the spin base 700. 3A and 3B, one end of the spring member 705 is connected to the connection portion between the ring 706 and the fourth connection member 704, and the other end portion of the spring member 705 is in the spin base 700. Are connected to a shaft P2 erected at a predetermined position.

  A ring driving mechanism 790 that rotates the ring 706 by a predetermined angle with respect to the spin base 700 is provided inside or outside the spin base 700.

  When the ring drive mechanism 790 does not operate, the ring 706 is urged counterclockwise by the plurality of spring members 705 (see arrow M1).

  In this case, in the interlocking link mechanism 710, the third connecting member 703 and the fourth connecting member 704 are rotated clockwise around the rotation axis P1, and the second connecting member 702 is applied with the spin base 700. The force which moves toward the inside of this works (see arrow M2).

  As a result, the holding pin 601 of the holding members 600a to 600c is subjected to a downward force while rotating counterclockwise around the horizontal support pin 603 by the screw 609 and the first connecting member 701 (see arrow M3). .

  Accordingly, the holding pins 601 abut against the outer peripheral end of the substrate W placed on the plurality of horizontal support pins 603 and urge the substrate W toward the center. As a result, the substrate W is held and fixed on the spin base 700 by the plurality of holding pins 601.

  FIG. 4A shows a top view of the spin chuck 500 as seen through the spin base 700 when the ring driving mechanism 790 operates, and FIG. 4B shows a T− of FIG. 4A. A cross-sectional view of the spin chuck 500 at the T-line is shown.

  When the ring drive mechanism 790 operates, the ring 706 rotates clockwise by a predetermined angle against the biasing force of the spring member 705 (see arrow N1), and is fixed to the lower surface portion BP of the spin base 700.

  In this case, in the interlocking link mechanism 710, a force that rotates counterclockwise about the rotation axis P1 acts on the third connecting member 703 and the fourth connecting member 704, and the second connecting member 702 has a spin base. The force which moves to the outward of 700 acts (refer arrow N2).

  As a result, a force that rises while rotating clockwise around the horizontal support pin 603 by the screw 609 and the first connecting member 701 acts on the holding pins 601 of the holding members 600a to 600c (see arrow N3).

  Thereby, the plurality of holding pins 601 are separated from the outer peripheral end of the substrate W. As a result, the substrate W is released from the spin chuck 500.

  As described above, the holding state of the substrate W by the spin chuck 500 is switched according to the rotation state of the ring 706 by the operation of the ring driving mechanism 790.

  Note that the ring drive mechanism 790 may have a configuration in which the ring 706 is rotated without contact from the outside of the spin base 700 by using a magnet or the like, or a motor or the like is provided inside the spin base 700 to electrically The ring 706 may be rotated.

  Instead of providing the ring drive mechanism 790, a lever may be provided on any of the holding members 600a to 600c, and the holding state of the substrate W by the spin chuck 500 may be switched by operating the lever from the outside.

(3) Details of Structure of Holding Member and Peripheral Member FIG. 5 is an enlarged cross-sectional view for explaining details of the structure of the holding member 600a and its peripheral member in FIG. FIG. 5A shows a state when the spin chuck 500 holds the substrate W, and FIG. 5B shows a state when the substrate W is released from the spin chuck 500. The structures of the holding members 600b and 600c and their peripheral members are the same as the structure of FIG.

  As shown in FIG. 5A, a part of the upper surface portion UP of the spin base 700 is detachable. Hereinafter, the removable part of the upper surface part UP is referred to as a detachable part at.

  The detachable portion at has a substantially annular shape, and the inner hole forms the above-described member insertion hole H. An annular inclined surface is formed at the upper end portion of the member insertion hole H so as to gradually increase in diameter upward. Hereinafter, this inclined surface is referred to as a hole inclined surface HT.

  The desorption part at is formed of a fluororesin such as tetrafluoroethylene (PTFE) and tetrafluoroethylene / perfluoroalkoxyethylene copolymer (PFA). The desorption part at may be formed of a resin such as heat-resistant polyvinyl chloride (HTPVC), polypropylene (PP), and glass fiber reinforced polypropylene (FRPP).

On the other hand, the portion excluding the desorption portion at of the spin base 700 is a ceramic having excellent chemical resistance such as aluminum nitride (AlN), silicon nitride (SiN), silicon carbide (SiC), or aluminum oxide (Al ₂ O ₃ ). Form with material.

  As described above, the screw 609 is erected at the position of the lower surface portion BP facing the member insertion hole H formed in the upper surface portion UP inside the spin base 700. As the screw 609 and the screw hole 605n inside the lifting shaft 605 are screwed together, the lifting shaft 605 is supported so as to be rotatable and liftable with respect to the spin base 700.

  The elevating shaft 605 is formed with an annular inclined surface so as to gradually increase in diameter upward. Hereinafter, this inclined surface is referred to as an axial inclined surface 611. The inclination angle of the shaft inclined surface 611 is equal to the inclination angle of the hole inclined surface HT.

  A flat plate portion 610 having a substantially elliptical shape when viewed from above the spin chuck 500 is integrally formed on the upper portion of the shaft inclined surface 611. The holding pin 601 and the horizontal support pin 603 are integrally formed on the upper surface of the flat plate portion 610 so as to protrude further upward.

(4) Effects of the structure of the holding member and its peripheral members Here, the minimum outer diameter of the shaft inclined surface 611 is smaller than the minimum inner diameter of the hole inclined surface HT, and the maximum outer diameter of the shaft inclined surface 611 is equal to that of the hole inclined surface HT. Greater than maximum inner diameter. Therefore, when the spin chuck 500 holds the substrate W, a force that descends while rotating on the holding member 600a is acted by the interlocking link mechanism 710 of FIG. 3 (see arrow M3). Thereby, the shaft inclined surface 611 contacts the hole inclined surface HT.

  In this case, the gap between the elevating shaft 605 and the member insertion hole H is closed by the shaft inclined surface 611, and the internal space of the spin base 700 and the external space (the space above the spin base 700) are blocked.

  Accordingly, when the substrate W held by the spin chuck 500 rotates, particles generated by rubbing the constituent members inside the spin base 700 spin through the gap between the member insertion hole H and the lifting shaft 605. Scattering from the inside of the base 700 into the processing atmosphere of the substrate W is prevented. As a result, processing defects on the substrate W are prevented.

  Further, during the cleaning process of the substrate W, the internal space of the spin base 700 and the space above the spin base 700 are blocked, so that the processing liquid used for the cleaning process is prevented from entering the spin base 700. . As a result, the occurrence of malfunction due to corrosion of the constituent members inside the spin base 700 by the processing liquid is prevented.

  As shown in FIG. 5B, when the substrate W is released from the spin chuck 500, a force that rises while rotating to the holding member 600a by the interlocking link mechanism 710 of FIG. 3 is applied (see arrow N3). . As a result, the shaft inclined surface 611 moves away from the hole inclined surface HT and rises while rotating.

  In this case, the shaft inclined surface 611 does not rotate while being in contact with the hole inclined surface HT. This prevents the shaft inclined surface 611 and the hole inclined surface HT from rubbing against each other. Thereby, generation of particles due to wear of the shaft inclined surface 611 and the hole inclined surface HT is prevented. As a result, particles are prevented from scattering in the processing atmosphere of the substrate W, and processing defects of the substrate W are prevented.

  In addition, since no frictional force is generated between the shaft inclined surface 611 and the hole inclined surface HT, the driving force required when the interlocking link mechanism 710 and the ring drive mechanism 790 rotate the lifting shaft 605 is sufficiently reduced. The

  Thereby, the frictional force acting between the constituent members inside the spin base 700 can be sufficiently reduced. As a result, the link mechanism 710 and the ring drive mechanism 790 can be reduced in size and weight.

(5) Other Effects Furthermore, a desorption part at is provided on the upper surface part UP of the spin base 700. Thereby, even when the detachable portion at is deteriorated due to the rotation operation of the holding member 600a, the detachable portion at can be easily replaced, so that the maintenance performance is improved.

  Further, the detachable portion at of the upper surface portion UP is made of resin, and the portion other than the detachable portion at of the upper surface portion UP is formed of a ceramic material. Thereby, the removal | desorption part at is excellent in workability compared with another part. Thereby, the hole inclined surface HT of the detachable portion at can be easily processed with high accuracy. As a result, the gap between the lifting shaft 605 and the member insertion hole H can be reliably closed.

  In the above example, the portion other than the detachable portion at of the upper surface portion UP is formed of a ceramic material. However, the present invention is not limited thereto, and the portion other than the detachable portion at of the upper surface portion UP is similar to the detachable portion at. You may form with resin, such as PTFE, PFA, HTPVC, PP, or FRPP.

  In addition, as a contact portion between the holding member 600 a and the spin base 700, an axis inclined surface 611 is formed on the holding member 600 a and a hole inclined surface HT is formed on the spin base 700.

  This ensures a sufficiently large contact area between the shaft inclined surface 611 and the hole inclined surface HT. Thereby, the force per unit area acting on the contact portion between the shaft inclined surface 611 and the hole inclined surface HT is reduced. As a result, even when the shaft inclined surface 611 and the hole inclined surface HT rub against each other, the frictional force acting between them is reduced, and the generation of particles is sufficiently suppressed.

  Further, by ensuring a sufficiently large contact area between the shaft inclined surface 611 and the hole inclined surface HT, the gap between the elevating shaft 605 and the member insertion hole H can be reliably closed. Thereby, the internal space and the external space of the spin base 700 are surely cut off.

  In the present embodiment, the spin chuck 500 may stand by while holding the substrate W even when the substrate W is not held. In this case, even when the substrate W is not processed, the gap between the lifting shaft 605 and the member insertion hole H is closed, and the internal space of the spin base 700 and the external space (the space above the spin base 700) Is cut off.

  Thereby, the processing atmosphere of the substrate W remaining on the spin base 700 is prevented from entering the inside of the spin base 700, and malfunction of the spin chuck 500 is prevented.

(6) Other structures of holding member and its peripheral members In the substrate holding apparatus according to the present embodiment, the holding members 600a to 600c and their peripheral members may have the following structures.

  FIG. 6 is an enlarged cross-sectional view for explaining another structural example of the holding member 600a and its peripheral members. FIG. 6A shows a state when the spin chuck 500 holds the substrate W, and FIG. 6B shows a state when the substrate W is released from the spin chuck 500. 6 (a) and 6 (b), in order to clearly show the structure of the holding member 600a, the first connecting member 701 and the second connecting member constituting the interlocking link mechanism 710 of FIGS. 3 and 4 are used. The member 702 and the connecting shaft Q are indicated by dotted lines.

  The structure of the holding member 600a and its peripheral members in this example will be described with respect to differences from the example in FIG. Note that the structures of the holding members 600b and 600c and their peripheral members are the same as those shown in FIG.

  As shown in FIG. 6A, a fixed shaft 608 is erected at a position of the lower surface portion BP facing the member insertion hole H inside the spin base 700 of this example. Further, an annular inclined member 607 is fixed on the lower surface BP so as to surround the lower end portion of the fixed shaft 608 so as not to rotate. The upper end surface of the inclined member 607 is inclined with respect to the horizontal plane.

  The holding member 600a of this example has substantially the same structure as the holding member 600a of FIG. 5, but a shaft accommodating hole 605h extending upward from the lower end portion is formed inside the elevating shaft 605.

  An annular sliding member 606 is attached to the lower end portion of the lifting shaft 605 of the holding member 600a. On the lower end surface of the sliding member 606, both sides are inclined obliquely upward symmetrically with respect to a diametrical line passing through the center. Thereby, two points forming 180 degrees on the lower end surface of the sliding member 606 are at the lowermost position, and two points forming 90 degrees from these two points are at the uppermost position.

  The inner diameters of the shaft receiving hole 605h and the sliding member 606 are substantially the same. A fixed shaft 608 is inserted into the shaft housing hole 605 h and the sliding member 606. Accordingly, the holding member 600a is supported on the lower surface portion BP so as to be rotatable and movable up and down by the fixed shaft 608. At this time, the lower end surface of the sliding member 606 contacts the upper end surface of the inclined member 607 so as to be slidable.

  Thus, the spring SP is provided on the outer peripheral portion of the elevating shaft 605 while the holding member 600a is supported by the fixed shaft 608. The spring SP is located between the upper surface portion UP of the spin base 700 and the first connecting member 701 of the interlocking link mechanism 710. Thereby, the spring SP biases the first connecting member 701 downward. Thereby, a downward force is applied to the holding member 600a.

  When the spin chuck 500 holds the substrate W, a part of the lower end surface of the sliding member 606 and a part of the upper end surface of the inclined member 607 are in surface contact. In this state, the sliding member 606 presses the upper end surface of the inclined member 607 by the elastic force of the spring SP. As a result, the sliding member 606 and the inclined member 607 are in stable contact with each other, and the substrate W is securely held by the holding pins 601.

  As shown in FIG. 5B, when the substrate W is released from the spin chuck 500, the second connecting member 702 moves outward from the spin base 700 (see arrow N2 in FIG. 4). . Thereby, a part (lowermost position) of the lower end surface of the sliding member 606 slides in the circumferential direction with respect to the upper end surface of the inclined member 607.

  At this time, a part of the lower end surface of the sliding member 606 rises toward the top of the upper end surface while rotating along the inclined surface of the upper end surface of the inclined member 607 against the biasing force of the spring SP. . Thereby, a force that rises while rotating acts on the holding member 600a (see arrow N3).

  Accordingly, the holding pins 601 of the holding members 600 a to 600 c are rotated clockwise around the horizontal support pins 603, and the plurality of holding pins 601 are separated from the outer peripheral end portion of the substrate W. As a result, the substrate W is released from the spin chuck 500.

  On the other hand, as in the example of FIG. 5, when the substrate W is released from the spin chuck 500, a force that rises while rotating acts on the holding member 600a (see arrow N3), so that the shaft inclined surface 611 is formed. Ascending while rotating away from the hole inclined surface HT. As a result, the same effect as in the example of FIG. 5 can be obtained.

  Further, when the spin chuck 500 holds the substrate W, the second connecting member 702 moves inward of the spin base 700 (see arrow N2 in FIG. 4). Thereby, a part (lowermost position) of the lower end surface of the sliding member 606 slides in the circumferential direction with respect to the upper end surface of the inclined member 607.

  At this time, a part of the lower end surface of the sliding member 606 descends while rotating along the inclined surface of the upper end surface of the inclined member 607. Thereby, a force that descends while rotating acts on the holding member 600a. As a result, the shaft inclined surface 611 descends while rotating and comes into contact with the hole inclined surface HT. As a result, the same effect as in the example of FIG. 5 can be obtained.

  Here, in the holding member 600a of this example, after the substrate W is released from the spin chuck 500, the elevating shaft 605 may be further rotated in the same direction as when it is opened. FIG. 7 is an enlarged sectional view of the holding member 600a and its peripheral members when the holding member 600a of FIG.

  As shown in FIG. 7, after the substrate W is released from the spin chuck 500, when the second connecting member 702 further moves outward from the spin base 700, the elevating shaft 605 further rotates.

  In this case, similarly to the above, a part (lowermost position) of the lower end surface of the sliding member 606 slides in the circumferential direction with respect to the upper end surface of the inclined member 607. At this time, a part of the lower end surface of the sliding member 606 descends while rotating along the inclined surface of the upper end surface from the uppermost portion of the upper end surface of the inclined member 607 (see arrow N4).

  As a result, the holding pin 601 of the holding members 600a to 600c further rotates clockwise about the horizontal support pin 603, whereby the shaft inclined surface 611 descends while rotating and contacts the hole inclined surface HT. As a result, the processing atmosphere of the substrate W remaining on the spin base 700 is prevented from entering the inside of the spin base 700, and malfunction of the spin chuck 500 is prevented.

(7) Still Other Structures of Holding Member and Peripheral Member In the substrate holding apparatus according to the present embodiment, holding members 600a to 600c and their peripheral members may further have the following structure.

  FIG. 8 is an enlarged cross-sectional view for explaining still another structural example of the holding member 600a and its peripheral members.

  The structure of the holding member 600a and its peripheral members in this example will be described with respect to differences from the example in FIG. Note that the structures of the holding members 600b and 600c and their peripheral members are the same as those shown in FIG.

  In the holding member 600a of this example, the shaft inclined surface 611 is not formed on the lifting shaft 605, and a horizontal lower surface 611a is formed. Moreover, the hole inclined surface HT is not formed in the upper end part of the member insertion hole H of the removal | desorption part at.

  Thereby, the horizontal lower surface 611a of the flat plate part 610 contacts the horizontal upper surface of the detachable part at. In this case, the structure of the holding member 600a and the detachable part at is simple. Therefore, the holding member 600a and the detachable portion at can be easily manufactured with high accuracy.

(8) Others In the above, the three holding members 600a to 600c are provided in the spin chuck 500, but the number of holding members provided in the spin chuck 500 may be one, two, four or more. For example, six holding members may be provided. When the number of the holding members is one or two, the spin chuck 500 is provided with two or more fixed holding members.

  In the above description, the holding pins 601 and 602 are formed on each of the holding members 600a to 600c. However, a plurality of holding pins may be formed on each of the holding members 600a to 600c.

  In the substrate processing apparatus 100 according to the present embodiment, in addition to the above, a developing process for supplying a developing solution to the rotating substrate W may be performed, or a resist coating process for applying a resist solution to the rotating substrate W Etc. may be performed.

(9) Correspondence between each constituent element of claim and each element of the embodiment Hereinafter, an example of correspondence between each constituent element of the claim and each element of the embodiment will be described. It is not limited to.

  In the above embodiment, the spin chuck 500, the rotation shaft 25, and the chuck rotation drive mechanism 36 are examples of a substrate holding device, the member insertion hole H is an example of a through hole, and the spin base 700 is an example of a casing member. The elevating shaft 605 is an example of a support shaft, and the holding pins 601 of the holding members 600a to 600c are examples of holding portions.

  Further, the screw 609, the screw hole 605n, the fixed shaft 608, the sliding member 606, the inclined member 607, the interlocking link mechanism 710, the ring 706 and the ring driving mechanism 790 are examples of the driving mechanism, and the shaft inclination of the holding members 600a to 600c. The surface 611 and the lower surface 611a are examples of a closed portion, the rotary shaft 25 and the chuck rotation drive mechanism 36 are examples of a rotation drive portion, and the screw groove formed on the inner peripheral surface of the screw hole 605n is an example of a spiral groove. It is.

  Further, the interlocking link mechanism 710, the ring 706, and the ring drive mechanism 790 are examples of a rotating mechanism, the thread groove of the screw 609 is an example of an engaging portion, and the lower end surface of the sliding member 606 is an example of an inclined portion. Yes, the upper end surface of the inclined member 607 is an example of a contact portion, and the spring SP is an example of a biasing member.

  Further, the flat plate portion 610, the shaft inclined surface 611 and the lower surface 611a are examples of an annular protrusion, the shaft inclined surface 611 and the lower surface 611a are examples of an annular lower surface, and the shaft inclined surface 611 is an example of an annular inclined surface, The detachable portion at is an example of a portion having a through hole in the upper surface portion of the casing member, and the nozzle 50 and the fluid supply pipe 63 are examples of the processing apparatus.

  Furthermore, the position of the holding pin 601 when contacting the outer peripheral end of the substrate W is an example of the holding position, and the position of the holding pin 601 when separating from the outer peripheral end of the substrate W is an example of the open position. Further, the position of the holding pin 601 shown in FIG. 7 is an example of the separated position.

  As each constituent element in the claims, various other elements having configurations or functions described in the claims can be used.

  INDUSTRIAL APPLICABILITY The present invention can be effectively used for manufacturing substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal display devices, glass substrates for plasma displays, optical disk substrates, magnetic disk substrates, and magneto-optical disk substrates. .

It is typical sectional drawing for demonstrating the structure of the substrate processing apparatus which concerns on one embodiment of this invention. It is a top view of the spin chuck of FIG. It is a figure for demonstrating the structure and operation | movement of a spin chuck of FIG. It is a figure for demonstrating the structure and operation | movement of a spin chuck of FIG. It is an expanded sectional view for demonstrating the detail of the structure of the holding member of FIG. 3, and its peripheral member. It is an expanded sectional view for demonstrating the other structural example of a holding member and its peripheral member. FIG. 7 is an enlarged cross-sectional view of the holding member and its peripheral members when the holding member of FIG. 6 is further rotated after opening the substrate. It is an expanded sectional view for demonstrating other structural examples of a holding member and its peripheral member. It is the top view and sectional drawing of the conventional spin chuck.

Explanation of symbols

25 Rotating shaft 36 Chuck rotation driving mechanism 50 Nozzle 63 Fluid supply pipe 100 Substrate processing apparatus 500 Spin chuck 600a to 600c Holding member 601 Holding pin 605 Lifting shaft 605n Screw hole 606 Sliding member 607 Inclining member 608 Fixed shaft 609 Screw 610 Flat plate portion 611 Shaft inclined surface 611a Lower surface 700 Spin base 706 Ring 710 Interlocking link mechanism 790 Ring drive mechanism at Demounting part BP Lower surface part H Member insertion hole SP Spring UP Upper surface part W Substrate

Claims (11)

A substrate holding device for holding a substrate substantially horizontally,
A casing member having an upper surface portion and a lower surface portion, and having a through hole in the upper surface portion;
A support shaft rotatably inserted into the through hole of the casing member;
A holding position that is provided above the upper surface portion and contacts the outer peripheral end portion of the substrate on the casing member as the support shaft rotates to hold the substrate in a substantially horizontal direction, and an outer peripheral end portion of the substrate. A holding portion provided to be movable between an open position and a separated position;
A drive mechanism that is provided inside the casing member and drives the support shaft so that the support shaft moves in a substantially vertical direction while rotating;
Provided on the support shaft, when the holding portion is in the holding position, the upper surface is in contact with the upper surface so as to close a gap between the outer peripheral surface of the support shaft and the inner peripheral surface of the through hole. A substrate holding apparatus comprising: a closing portion that is separated from the upper surface portion when the holding portion moves between the holding position and the open position. The substrate holding apparatus according to claim 1, further comprising a rotation drive unit configured to rotate about a substantially vertical axis while supporting the casing member substantially horizontally. A spiral groove extending in a substantially vertical direction is formed on the support shaft,
The drive mechanism is
A rotation mechanism for rotating the support shaft;
The substrate holding apparatus according to claim 1, further comprising an engaging portion that engages with the spiral groove so that the support shaft moves in a substantially vertical direction as the support shaft rotates. . The support shaft is provided with an inclined portion having a lower surface inclined along the circumferential direction,
The drive mechanism is
A rotation mechanism for rotating the support shaft;
3. The substrate holding apparatus according to claim 1, further comprising a contact portion that contacts the lower surface of the inclined portion so that the support shaft moves in a substantially vertical direction as the support shaft rotates. . The drive mechanism is
The substrate holding apparatus according to claim 4, further comprising an urging member that urges the support shaft in a direction in which the contact portion is pressed. The closing portion is an annular protruding portion that has a larger diameter than the through hole and is formed to protrude in a flange shape from the outer peripheral surface of the support shaft,
The substrate holding apparatus according to claim 1, wherein the annular protrusion has an annular lower surface that abuts on an upper surface of the casing member. An annular inclined surface is formed at the edge of the through hole on the upper surface of the casing member,
The substrate holding apparatus according to claim 6, wherein the annular lower surface of the annular protrusion is inclined corresponding to the annular inclined surface. The substrate holding apparatus according to claim 1, wherein a portion having a through hole in the upper surface portion of the casing member is formed to be removable. 9. The substrate holding apparatus according to claim 8, wherein a portion having a through hole in the upper surface portion of the casing member is formed of a resin. The holding portion is provided so as to be further movable between the open position and a spaced position separated from the outer peripheral end of the substrate than the open position,
The said closing part closes the clearance gap between the outer peripheral surface of the said support shaft, and the inner peripheral surface of the said through-hole, when the said holding | maintenance part exists in the said separation position. A substrate holding apparatus according to claim 1. A substrate processing apparatus for performing predetermined processing on a substrate,
A substrate holding device according to any one of claims 1 to 10, which holds a substrate,
A substrate processing apparatus comprising: a processing unit configured to perform processing on a substrate held by the substrate holding apparatus.

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