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GB2401481B - Heat sink - Google Patents

Heat sink

Info

Publication number
GB2401481B
GB2401481B GB0406233A GB0406233A GB2401481B GB 2401481 B GB2401481 B GB 2401481B GB 0406233 A GB0406233 A GB 0406233A GB 0406233 A GB0406233 A GB 0406233A GB 2401481 B GB2401481 B GB 2401481B
Authority
GB
United Kingdom
Prior art keywords
heat sink
sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0406233A
Other versions
GB2401481A (en
GB0406233D0 (en
Inventor
Marvin Glenn Wong
Arthur Fong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of GB0406233D0 publication Critical patent/GB0406233D0/en
Publication of GB2401481A publication Critical patent/GB2401481A/en
Application granted granted Critical
Publication of GB2401481B publication Critical patent/GB2401481B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H10W40/228—
    • H10W40/25—
    • H10W40/255—
    • H10W40/258—
    • H10W40/259—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H10W70/682—
    • H10W70/685—
    • H10W72/075—
    • H10W72/381—
    • H10W72/5449—
    • H10W72/551—
    • H10W72/884—
    • H10W72/951—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB0406233A 2003-04-30 2004-03-19 Heat sink Expired - Fee Related GB2401481B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/427,656 US20040216864A1 (en) 2003-04-30 2003-04-30 CTE matched application specific heat sink assembly

Publications (3)

Publication Number Publication Date
GB0406233D0 GB0406233D0 (en) 2004-04-21
GB2401481A GB2401481A (en) 2004-11-10
GB2401481B true GB2401481B (en) 2006-07-12

Family

ID=32176772

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0406233A Expired - Fee Related GB2401481B (en) 2003-04-30 2004-03-19 Heat sink

Country Status (5)

Country Link
US (1) US20040216864A1 (en)
JP (1) JP2004336047A (en)
CN (1) CN1542953A (en)
DE (1) DE10360966A1 (en)
GB (1) GB2401481B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9559047B2 (en) 2012-10-18 2017-01-31 Infineon Technologies Austria Ag Passive component as thermal capacitance and heat sink
CN114068333A (en) * 2020-07-30 2022-02-18 比亚迪半导体股份有限公司 Heat dissipation plate and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61240665A (en) * 1985-04-17 1986-10-25 Sanyo Electric Co Ltd Semiconductor device
JPS63296361A (en) * 1987-05-28 1988-12-02 Hitachi Cable Ltd Semiconductor device
JPH08111481A (en) * 1994-10-12 1996-04-30 Tokyo Tungsten Co Ltd Heat sink for semiconductor
JP2001085580A (en) * 1999-09-14 2001-03-30 Sumitomo Metal Electronics Devices Inc Semiconductor module substrate and method of manufacturing the same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069498A (en) * 1976-11-03 1978-01-17 International Business Machines Corporation Studded heat exchanger for integrated circuit package
US4415025A (en) * 1981-08-10 1983-11-15 International Business Machines Corporation Thermal conduction element for semiconductor devices
US4788627A (en) * 1986-06-06 1988-11-29 Tektronix, Inc. Heat sink device using composite metal alloy
US5886407A (en) * 1993-04-14 1999-03-23 Frank J. Polese Heat-dissipating package for microcircuit devices
US5972737A (en) * 1993-04-14 1999-10-26 Frank J. Polese Heat-dissipating package for microcircuit devices and process for manufacture
US5397921A (en) * 1993-09-03 1995-03-14 Advanced Semiconductor Assembly Technology Tab grid array
US5604978A (en) * 1994-12-05 1997-02-25 International Business Machines Corporation Method for cooling of chips using a plurality of materials
JPH08330507A (en) * 1995-05-30 1996-12-13 Motorola Inc Hybrid multi-chip module and manufacturing method thereof
US5587882A (en) * 1995-08-30 1996-12-24 Hewlett-Packard Company Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate
SE509570C2 (en) * 1996-10-21 1999-02-08 Ericsson Telefon Ab L M Temperature compensating means and procedure for mounting electronics on a circuit board
US6214647B1 (en) * 1998-09-23 2001-04-10 International Business Machines Corporation Method for bonding heatsink to multiple-height chip
TW399309B (en) * 1998-09-30 2000-07-21 World Wiser Electronics Inc Cavity-down package structure with thermal via
US6075700A (en) * 1999-02-02 2000-06-13 Compaq Computer Corporation Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures
AU1348901A (en) * 1999-10-28 2001-05-08 P1 Diamond, Inc. Improved diamond thermal management components
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
US6462410B1 (en) * 2000-08-17 2002-10-08 Sun Microsystems Inc Integrated circuit component temperature gradient reducer
US6333551B1 (en) * 2000-09-07 2001-12-25 International Business Machines Corporation Surface profiling in electronic packages for reducing thermally induced interfacial stresses
US20020185726A1 (en) * 2001-06-06 2002-12-12 North Mark T. Heat pipe thermal management of high potential electronic chip packages
US6734552B2 (en) * 2001-07-11 2004-05-11 Asat Limited Enhanced thermal dissipation integrated circuit package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61240665A (en) * 1985-04-17 1986-10-25 Sanyo Electric Co Ltd Semiconductor device
JPS63296361A (en) * 1987-05-28 1988-12-02 Hitachi Cable Ltd Semiconductor device
JPH08111481A (en) * 1994-10-12 1996-04-30 Tokyo Tungsten Co Ltd Heat sink for semiconductor
JP2001085580A (en) * 1999-09-14 2001-03-30 Sumitomo Metal Electronics Devices Inc Semiconductor module substrate and method of manufacturing the same

Also Published As

Publication number Publication date
DE10360966A1 (en) 2004-11-25
JP2004336047A (en) 2004-11-25
GB2401481A (en) 2004-11-10
US20040216864A1 (en) 2004-11-04
CN1542953A (en) 2004-11-03
GB0406233D0 (en) 2004-04-21

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20080319