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DE60320734D1 - Verfahren zum Beschichten von mikro-elektromechanischen Vorrichtungen - Google Patents

Verfahren zum Beschichten von mikro-elektromechanischen Vorrichtungen

Info

Publication number
DE60320734D1
DE60320734D1 DE60320734T DE60320734T DE60320734D1 DE 60320734 D1 DE60320734 D1 DE 60320734D1 DE 60320734 T DE60320734 T DE 60320734T DE 60320734 T DE60320734 T DE 60320734T DE 60320734 D1 DE60320734 D1 DE 60320734D1
Authority
DE
Germany
Prior art keywords
coating
microelectromechanical devices
microelectromechanical
devices
coating microelectromechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60320734T
Other languages
English (en)
Inventor
Zhihao Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Application granted granted Critical
Publication of DE60320734D1 publication Critical patent/DE60320734D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0096For avoiding stiction when the device is in use, i.e. after manufacture has been completed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/60Deposition of organic layers from vapour phase
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/0005Anti-stiction coatings
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/01Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0176Chemical vapour Deposition
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/11Treatments for avoiding stiction of elastic or moving parts of MEMS
    • B81C2201/112Depositing an anti-stiction or passivation coating, e.g. on the elastic or moving parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Micromachines (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE60320734T 2002-08-22 2003-08-11 Verfahren zum Beschichten von mikro-elektromechanischen Vorrichtungen Expired - Lifetime DE60320734D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/225,846 US6808745B2 (en) 2002-08-22 2002-08-22 Method of coating micro-electromechanical devices

Publications (1)

Publication Number Publication Date
DE60320734D1 true DE60320734D1 (de) 2008-06-19

Family

ID=31887092

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60320734T Expired - Lifetime DE60320734D1 (de) 2002-08-22 2003-08-11 Verfahren zum Beschichten von mikro-elektromechanischen Vorrichtungen

Country Status (4)

Country Link
US (1) US6808745B2 (de)
EP (1) EP1416064B1 (de)
JP (1) JP2004084073A (de)
DE (1) DE60320734D1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7201937B2 (en) * 2003-08-15 2007-04-10 Microsurfaces, Inc. Methods for forming composite coatings on MEMS devices
US7687269B2 (en) * 2003-12-10 2010-03-30 Northeastern University Method for efficient transport of small liquid volumes to, from or within microfluidic devices
US20060033793A1 (en) * 2004-08-10 2006-02-16 Webster Grant A Coupling agent patterning
US7446926B2 (en) * 2004-09-27 2008-11-04 Idc, Llc System and method of providing a regenerating protective coating in a MEMS device
US7692839B2 (en) * 2004-09-27 2010-04-06 Qualcomm Mems Technologies, Inc. System and method of providing MEMS device with anti-stiction coating
US7387362B2 (en) * 2005-03-18 2008-06-17 Hewlett-Packard Development Company, L.P. Methods and architecture for applying self-assembled monolayer(s)
US8846195B2 (en) * 2005-07-22 2014-09-30 Canon Nanotechnologies, Inc. Ultra-thin polymeric adhesion layer
US8557351B2 (en) 2005-07-22 2013-10-15 Molecular Imprints, Inc. Method for adhering materials together
US8808808B2 (en) * 2005-07-22 2014-08-19 Molecular Imprints, Inc. Method for imprint lithography utilizing an adhesion primer layer
US7880952B2 (en) * 2007-05-03 2011-02-01 Silicon Quest Kabushiki-Kaisha Mirror device with an anti-stiction layer
DE102008012895A1 (de) * 2008-03-06 2009-09-10 Robert Bosch Gmbh Korrosionsschutzgel und Korrosionsschutzbeschichtung für elektronische und/oder mikromechanische Bauteile
US8361546B2 (en) * 2008-10-30 2013-01-29 Molecular Imprints, Inc. Facilitating adhesion between substrate and patterned layer
US8136922B2 (en) * 2009-09-01 2012-03-20 Xerox Corporation Self-assembly monolayer modified printhead
US20110165412A1 (en) * 2009-11-24 2011-07-07 Molecular Imprints, Inc. Adhesion layers in nanoimprint lithograhy
KR101512579B1 (ko) 2010-10-05 2015-04-15 실코텍 코포레이션 내마모성 코팅, 물건 및 방법
WO2014186470A1 (en) * 2013-05-14 2014-11-20 Silcotek Corp. Vapor phase treatment of amorphous carbon films with (perfluoro 1,1,2,2 tetrahydroalkyl)trialkoxysilane
US10316408B2 (en) 2014-12-12 2019-06-11 Silcotek Corp. Delivery device, manufacturing system and process of manufacturing
WO2017040623A1 (en) 2015-09-01 2017-03-09 Silcotek Corp. Thermal chemical vapor deposition coating
US10487403B2 (en) 2016-12-13 2019-11-26 Silcotek Corp Fluoro-containing thermal chemical vapor deposition process and article
US11161324B2 (en) 2017-09-13 2021-11-02 Silcotek Corp. Corrosion-resistant coated article and thermal chemical vapor deposition coating process
WO2020252306A1 (en) 2019-06-14 2020-12-17 Silcotek Corp. Nano-wire growth
US12473635B2 (en) 2020-06-03 2025-11-18 Silcotek Corp. Dielectric article

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4643948A (en) * 1985-03-22 1987-02-17 International Business Machines Corporation Coatings for ink jet nozzles
CA1329341C (en) * 1988-10-19 1994-05-10 Rosemary Bridget Albinson Method of forming adherent fluorosilane layer on a substrate and ink jet recording head containing such a layer
US5598193A (en) * 1995-03-24 1997-01-28 Hewlett-Packard Company Treatment of an orifice plate with self-assembled monolayers
US6028189A (en) * 1997-03-20 2000-02-22 University Of Washington Solvent for oligonucleotide synthesis and methods of use
US6203898B1 (en) * 1997-08-29 2001-03-20 3M Innovatave Properties Company Article comprising a substrate having a silicone coating
US6345881B1 (en) * 1999-09-29 2002-02-12 Eastman Kodak Company Coating of printhead nozzle plate
JP4593049B2 (ja) * 2000-02-01 2010-12-08 アナログ デバイシーズ インコーポレイテッド 静止摩擦を低減し微細加工デバイス表面を不動態化するウェハレベル処理のための方法およびそれに使用するチップ
US6797463B2 (en) * 2000-02-16 2004-09-28 Wisconsin Alumni Research Foundation Method and apparatus for detection of microscopic pathogens
US6576489B2 (en) * 2001-05-07 2003-06-10 Applied Materials, Inc. Methods of forming microstructure devices

Also Published As

Publication number Publication date
JP2004084073A (ja) 2004-03-18
US6808745B2 (en) 2004-10-26
US20040037956A1 (en) 2004-02-26
EP1416064A3 (de) 2005-06-15
EP1416064A2 (de) 2004-05-06
EP1416064B1 (de) 2008-05-07

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Legal Events

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8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: WAGNER & GEYER PARTNERSCHAFT PATENT- UND RECHTSANW