DE60119194D1 - Leiterplattenanordnung - Google Patents

Leiterplattenanordnung

Info

Publication number: DE60119194D1
Authority: DE; Germany
Prior art keywords: circuit board; printed circuit; board assembly; assembly; printed
Prior art date: 2000-02-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE60119194T

Other languages

English (en)

Other versions

DE60119194T2 (de

Inventor

Kah Phang Loh

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Lite On Technology Corp

Original Assignee

Agilent Technologies Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-02-22

Filing date

2001-02-09

Publication date

2006-06-08

2001-02-09 Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc

2006-06-08 Application granted granted Critical

2006-06-08 Publication of DE60119194D1 publication Critical patent/DE60119194D1/de

2006-08-31 Publication of DE60119194T2 publication Critical patent/DE60119194T2/de

2021-02-10 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Optical Couplings Of Light Guides (AREA)
Led Device Packages (AREA)
Light Receiving Elements (AREA)

DE60119194T 2000-02-22 2001-02-09 Leiterplattenanordnung Expired - Fee Related DE60119194T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
SG200000573A SG91855A1 (en)	2000-02-22	2000-02-22	Circuit board assembly
SG200000573		2000-02-22

Publications (2)

Publication Number	Publication Date
DE60119194D1 true DE60119194D1 (de)	2006-06-08
DE60119194T2 DE60119194T2 (de)	2006-08-31

Family

ID=20430523

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60119194T Expired - Fee Related DE60119194T2 (de)	2000-02-22	2001-02-09	Leiterplattenanordnung

Country Status (5)

Country	Link
US (1)	US6717820B1 (de)
EP (1)	EP1128714B9 (de)
JP (1)	JP2001298200A (de)
DE (1)	DE60119194T2 (de)
SG (1)	SG91855A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4193447B2 (ja)	2002-08-23	2008-12-10	日本電気株式会社	カード型光通信モジュール
JP4210240B2 (ja) *	2004-06-03	2009-01-14	ローム株式会社	光通信モジュール
JP4455301B2 (ja) *	2004-12-07	2010-04-21	日東電工株式会社	配線回路基板およびその接続構造
JP4646618B2 (ja) *	2004-12-20	2011-03-09	イビデン株式会社	光路変換部材、多層プリント配線板および光通信用デバイス
JP2006228895A (ja) *	2005-02-16	2006-08-31	Alps Electric Co Ltd	立体回路モジュール及びその製造方法
KR101017975B1 (ko)	2010-06-22	2011-03-02	주식회사 로스윈	휴대단말기용 안테나 및 그 제조 방법
US8737080B2 (en)	2011-01-14	2014-05-27	Qualcomm Incorporated	Modular surface mount package for a system on a chip
DE102013211640A1 (de) *	2013-06-20	2014-12-24	Osram Opto Semiconductors Gmbh	Optoelektronische Anordnung
US9967984B1 (en) *	2015-01-14	2018-05-08	Vlt, Inc.	Power adapter packaging
US9936580B1 (en)	2015-01-14	2018-04-03	Vlt, Inc.	Method of forming an electrical connection to an electronic module
US10264664B1 (en)	2015-06-04	2019-04-16	Vlt, Inc.	Method of electrically interconnecting circuit assemblies
EP3313156B1 (de) *	2015-06-19	2020-04-29	Nippon Telegraph and Telephone Corporation	Lötverbindungsstruktur für flexible leiterplatte
US9493083B1 (en)	2015-06-22	2016-11-15	Delphi Technologies, Inc.	Electrical plug adapter
US9693459B2 (en)	2015-07-16	2017-06-27	Delphi Technologies, Inc.	Circuit board assembly and method of manufacturing same
CN105228345A (zh) *	2015-11-05	2016-01-06	福建众益太阳能科技股份公司	太阳能灯、用于太阳能灯的pcb线路板及其制作方法
TWI733074B (zh) *	2019-01-09	2021-07-11	榮晶生物科技股份有限公司	微型電子裝置及其電路基板
DE202019106231U1 (de) *	2019-11-08	2019-12-20	Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.	Rotationsfähiger optischer Kurzstrecken-Transceiver

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE4119427A1 (de) *	1991-06-13	1992-12-17	H Albert Tu	Kompaktschaltplatte eines computers
JPH06334298A (ja) *	1993-05-27	1994-12-02	Fujitsu Ltd	表面実装部品の搭載構造
US5506445A (en) *	1994-06-24	1996-04-09	Hewlett-Packard Company	Optical transceiver module
DE69603744T2 (de) *	1995-11-08	1999-12-09	Siemens Microelectronics, Inc.	Flache optische vorrichtung mit mehreren montagekonfigurationen
JP3393013B2 (ja) *	1996-07-22	2003-04-07	株式会社シチズン電子	赤外線送受信モジュールの構造
JP3786227B2 (ja) *	1997-02-19	2006-06-14	シチズン電子株式会社	赤外線データ通信モジュール及びその製造方法
TW346687B (en) *	1997-09-15	1998-12-01	Ind Tech Res Inst	Package of semiconductor laser diode and compact disk with two-wavelength read/write head
JP3198332B2 (ja) *	1997-12-16	2001-08-13	ローム株式会社	表示装置のマザーボードへの実装方法、および表示装置の実装構造
US5977567A (en) *	1998-01-06	1999-11-02	Lightlogic, Inc.	Optoelectronic assembly and method of making the same
JPH11214795A (ja) *	1998-01-21	1999-08-06	Oki Electric Ind Co Ltd	光半導体モジュール
DE19808004A1 (de) *	1998-02-26	1999-09-09	Vishay Semiconductor Gmbh	Bauteil zur optischen Datenübertragung
US6252252B1 (en) *	1998-04-16	2001-06-26	Sanyo Electric Co., Ltd.	Optical semiconductor device and optical semiconductor module equipped with the same
DE19816794A1 (de) *	1998-04-16	1999-10-21	Bosch Gmbh Robert	Leiterplattenverbund

2000
- 2000-02-22 SG SG200000573A patent/SG91855A1/en unknown
- 2000-06-02 US US09/585,261 patent/US6717820B1/en not_active Expired - Fee Related
2001
- 2001-02-09 DE DE60119194T patent/DE60119194T2/de not_active Expired - Fee Related
- 2001-02-09 EP EP01301160A patent/EP1128714B9/de not_active Expired - Lifetime
- 2001-02-14 JP JP2001037118A patent/JP2001298200A/ja active Pending

Also Published As

Publication number	Publication date
EP1128714A1 (de)	2001-08-29
EP1128714B9 (de)	2006-07-26
DE60119194T2 (de)	2006-08-31
SG91855A1 (en)	2002-10-15
EP1128714B1 (de)	2006-05-03
US6717820B1 (en)	2004-04-06
JP2001298200A (ja)	2001-10-26

Publication	Publication Date	Title
DE69943290D1 (de)	2011-04-28	Gedruckte Leiterplatte
FI20022140A0 (fi)	2002-12-04	Joustava painettu piirilevy
DE60232473D1 (de)	2009-07-09	Mehrschichtige Leiterplatte
DE60045566D1 (de)	2011-03-03	Mehrschicht-Leiterplatte
DE69812221D1 (de)	2003-04-24	Gedruckte Leiterplatte
DE69942711D1 (de)	2010-10-07	Mehrschichtige gedruckte Leiterplatte
FR2828587B1 (fr)	2004-12-31	Connecteur de carte de circuit imprime
DE60039569D1 (de)	2008-09-04	Gedruckte Leiterplatte
GB2375655B (en)	2004-03-10	Circuit board assembly
GB2363257B (en)	2002-05-22	Printed circuit board
DE60131485D1 (de)	2008-01-03	Leiterplatte
IL151278A0 (en)	2003-04-10	Printed circuit board assembly
DE60119194D1 (de)	2006-06-08	Leiterplattenanordnung
DE60143235D1 (de)	2010-11-25	Mehrschichtige Leiterplatte
DE69837520D1 (de)	2007-05-24	Gedruckte Leiterplatte
DE10291003D2 (de)	2004-04-15	Mehrschichtige Leiterplatte
DE60137310D1 (de)	2009-02-26	Leiterplatte
DE69939157D1 (de)	2008-09-04	Gedruckte Leiterplatte
DE69827754D1 (de)	2004-12-30	Gedruckte Schaltungsplatte
DE60100889D1 (de)	2003-11-06	Gedruckte leiterplatte und steckverbinderanordnung
FI19992062L (fi)	1999-09-27	Painettu piirilevy
DE60020193D1 (de)	2005-06-23	Mehrschichtige Leiterplatte
DE69938982D1 (de)	2008-08-07	Mehrlagen Gedruckteschaltungsplatte
IL148041A0 (en)	2002-09-12	Printed circuit board arrangement
GB0010730D0 (en)	2000-06-28	Printed circuit boards

Legal Events

Date	Code	Title	Description
2007-05-24	8364	No opposition during term of opposition
2007-10-04	8327	Change in the person/name/address of the patent owner	Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D. STAATES, US
2008-07-03	8328	Change in the person/name/address of the agent	Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELLSCHA
2009-10-29	8327	Change in the person/name/address of the patent owner	Owner name: LITE-ON TECHNOLOGY CORP., NEIHU, TAIPEI, TW
2009-10-29	8328	Change in the person/name/address of the agent	Representative=s name: HOEFER & PARTNER, 81543 MUENCHEN
2010-12-16	8339	Ceased/non-payment of the annual fee