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DE102004021258A1 - Hermetische Abdichtungen für elektronische Komponenten - Google Patents

Hermetische Abdichtungen für elektronische Komponenten Download PDF

Info

Publication number
DE102004021258A1
DE102004021258A1 DE102004021258A DE102004021258A DE102004021258A1 DE 102004021258 A1 DE102004021258 A1 DE 102004021258A1 DE 102004021258 A DE102004021258 A DE 102004021258A DE 102004021258 A DE102004021258 A DE 102004021258A DE 102004021258 A1 DE102004021258 A1 DE 102004021258A1
Authority
DE
Germany
Prior art keywords
electronic components
substrate
seals
hermetic seals
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102004021258A
Other languages
English (en)
Inventor
Marvin Glenn Wong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of DE102004021258A1 publication Critical patent/DE102004021258A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/02—Bases, casings, or covers
    • H10W76/12—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H29/00—Switches having at least one liquid contact
    • H01H2029/008—Switches having at least one liquid contact using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
    • H10W76/60—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Wire Bonding (AREA)
  • Pressure Sensors (AREA)
  • Manufacture Of Switches (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Micromachines (AREA)

Abstract

Bei einem Verfahren zum Herstellen einer Mehrzahl von hermetisch abgedichteten elektronischen Komponenten werden ein erstes und ein zweites Substrat wafergebondet, um eine Mehrzahl von elektronischen Komponenten zwischen denselben einzuschließen. Das erste Substrat wird anschließend geschnitten, um auf dem ersten Substrat erste Abdichtungen und auf dem zweiten Substrat zweite Abdichtungen freizulegen. Die ersten und die zweiten Abdichtungen definieren Begrenzungen um die Mehrzahl von elektronischen Komponenten. In die Schnitte in dem ersten Substrat wird Lötmittel abgegeben, und das Lötmittel wird anschließend aufgeschmolzen, um entsprechende Paare von ersten und zweiten Abdichtungen miteinander zu verbinden.
DE102004021258A 2003-09-24 2004-04-30 Hermetische Abdichtungen für elektronische Komponenten Withdrawn DE102004021258A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/671,188 US6774327B1 (en) 2003-09-24 2003-09-24 Hermetic seals for electronic components

Publications (1)

Publication Number Publication Date
DE102004021258A1 true DE102004021258A1 (de) 2005-05-04

Family

ID=32825692

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004021258A Withdrawn DE102004021258A1 (de) 2003-09-24 2004-04-30 Hermetische Abdichtungen für elektronische Komponenten

Country Status (5)

Country Link
US (1) US6774327B1 (de)
JP (1) JP2005100983A (de)
DE (1) DE102004021258A1 (de)
GB (1) GB2406438B (de)
TW (1) TWI245404B (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007035788A1 (de) 2007-07-31 2009-02-05 Robert Bosch Gmbh Waferfügeverfahren, Waferverbund sowie Chip
DE102007030284A1 (de) * 2007-06-29 2009-02-26 Schott Ag Verfahren zum Verpacken von Halbleiter-Bauelementen und verfahrensgemäß hergestellten Erzeugnis

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ATE448226T1 (de) * 2000-09-01 2009-11-15 Novartis Vaccines & Diagnostic Aza heterocyclische derivate und ihre therapeutische verwendung
AP1666A (en) * 2000-09-11 2006-09-29 Chiron Corp Quinolinone derivatives as tyrosine kinase inhibitors.
US20030028018A1 (en) * 2000-09-11 2003-02-06 Chiron Coporation Quinolinone derivatives
CA2496164C (en) * 2002-08-23 2010-11-09 Chiron Corporation Benzimidazole quinolinones and uses thereof
US20050256157A1 (en) * 2002-08-23 2005-11-17 Chiron Corporation Combination therapy with CHK1 inhibitors
US7825132B2 (en) * 2002-08-23 2010-11-02 Novartis Vaccines And Diagnostics, Inc. Inhibition of FGFR3 and treatment of multiple myeloma
MXPA05004754A (es) * 2002-11-13 2005-08-02 Chiron Corp Metodos para tratar cancer y metodos relacionados.
EP1682529A4 (de) * 2003-11-07 2010-06-30 Novartis Vaccines & Diagnostic Verfahren zur synthese von chinolinonverbindungen
CN1960731B (zh) * 2004-02-20 2011-12-07 诺华疫苗和诊断公司 调节炎性和转移过程的方法
ES2525670T3 (es) * 2005-01-27 2014-12-29 Novartis Ag Tratamiento de tumores metastatizados
EP1885187B1 (de) 2005-05-13 2013-09-25 Novartis AG Verfahren zur behandlung von arzneimittelresistentem krebs
EP1904480A2 (de) 2005-05-23 2008-04-02 Novartis Pharma AG Kristalline und andere formen von 4-amino-5-fluor-3-[6-(methylpiperazin-1-yl)-1h-benzimidazol-2-yl]-1h-chinolin-2-onmilchsäuresalz
US20080037931A1 (en) * 2006-07-31 2008-02-14 Steen Paul H Liquid switches and switching devices and systems and methods thereof
US7872204B2 (en) * 2006-10-05 2011-01-18 Zippy Technology Corp. Watertight switch
US8072056B2 (en) 2009-06-10 2011-12-06 Medtronic, Inc. Apparatus for restricting moisture ingress
US8172760B2 (en) 2009-06-18 2012-05-08 Medtronic, Inc. Medical device encapsulated within bonded dies
US8666505B2 (en) 2010-10-26 2014-03-04 Medtronic, Inc. Wafer-scale package including power source
US8424388B2 (en) 2011-01-28 2013-04-23 Medtronic, Inc. Implantable capacitive pressure sensor apparatus and methods regarding same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4769272A (en) * 1987-03-17 1988-09-06 National Semiconductor Corporation Ceramic lid hermetic seal package structure
JP3576727B2 (ja) * 1996-12-10 2004-10-13 株式会社デンソー 表面実装型パッケージ
FR2783354B1 (fr) * 1998-08-25 2002-07-12 Commissariat Energie Atomique Procede collectif de conditionnement d'une pluralite de composants formes initialement dans un meme substrat
FR2785449B1 (fr) * 1998-10-29 2002-11-29 Commissariat Energie Atomique Systeme d'assemblage de substrats a zones d'accrochage pourvues de cavites
US6323447B1 (en) 1998-12-30 2001-11-27 Agilent Technologies, Inc. Electrical contact breaker switch, integrated electrical contact breaker switch, and electrical contact switching method
AT3609U1 (de) * 1999-06-02 2000-05-25 Austria Mikrosysteme Int Mikrosensor
KR100413789B1 (ko) * 1999-11-01 2003-12-31 삼성전자주식회사 고진공 패키징 마이크로자이로스코프 및 그 제조방법
WO2001056921A2 (en) * 2000-02-02 2001-08-09 Raytheon Company Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
JP3556567B2 (ja) * 2000-04-27 2004-08-18 京セラ株式会社 電子部品収納用パッケージ
US6214644B1 (en) * 2000-06-30 2001-04-10 Amkor Technology, Inc. Flip-chip micromachine package fabrication method
KR100396551B1 (ko) * 2001-02-03 2003-09-03 삼성전자주식회사 웨이퍼 레벨 허메틱 실링 방법
US6673697B2 (en) * 2002-04-03 2004-01-06 Intel Corporation Packaging microelectromechanical structures
US6646527B1 (en) * 2002-04-30 2003-11-11 Agilent Technologies, Inc. High frequency attenuator using liquid metal micro switches

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007030284A1 (de) * 2007-06-29 2009-02-26 Schott Ag Verfahren zum Verpacken von Halbleiter-Bauelementen und verfahrensgemäß hergestellten Erzeugnis
DE102007030284B4 (de) * 2007-06-29 2009-12-31 Schott Ag Verfahren zum Verpacken von Halbleiter-Bauelementen und verfahrensgemäß hergestelltes Zwischenprodukt
DE102007035788A1 (de) 2007-07-31 2009-02-05 Robert Bosch Gmbh Waferfügeverfahren, Waferverbund sowie Chip

Also Published As

Publication number Publication date
GB0418637D0 (en) 2004-09-22
TWI245404B (en) 2005-12-11
TW200512920A (en) 2005-04-01
GB2406438A (en) 2005-03-30
JP2005100983A (ja) 2005-04-14
GB2406438B (en) 2006-06-21
US6774327B1 (en) 2004-08-10

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D. STAATES, US

8125 Change of the main classification

Ipc: H01L 23/04 AFI20051017BHDE

8139 Disposal/non-payment of the annual fee