CN107404819A - Board unit and electronic equipment - Google Patents

Abstract

The invention discloses a substrate assembly and electronic equipment, wherein the substrate assembly includes a substrate, a middle frame and a buckle, the buckle is arranged on the middle frame, the substrate is fixed on the middle frame through the buckle, and the buckle elastically deforms to snap the substrate Fitted between the buckle and the middle frame. The buckle of the present invention undergoes elastic deformation so that the substrate can be snapped between the buckle and the middle frame, and the buckle can be directly snapped onto the surface of the substrate without opening holes on the substrate to realize snap-fitting of the substrate. The limit and fixation of the substrate will not cause damage to the components and wiring of the substrate, and reduce the damage of the substrate during the fixing process.

Description

Substrate components and electronics

technical field

The invention relates to the technical field of electronic equipment, in particular to a substrate assembly and electronic equipment.

Background technique

With the development of network technology and the improvement of the intelligence of electronic equipment, users can realize more and more functions through electronic equipment, such as making voice calls and video calls through instant messaging programs.

Among them, the printed circuit board of the electronic equipment is screwed to the housing of the electronic equipment through screws. In the actual production process, screw holes need to be drilled manually. Both the printed circuit board and the housing of the electronic equipment need to have screw holes. Secure the printed circuit board to the case. However, due to too many components on the printed circuit board, it is easy to deviate the screw holes during the process of manually drilling the screw holes, which may easily cause damage to the printed circuit board, open circuit, etc., resulting in defective printed circuit boards.

Contents of the invention

Embodiments of the present invention provide a substrate assembly and electronic equipment, which can reduce damage to the substrate.

In the first aspect, an embodiment of the present invention provides a substrate assembly for use in electronic equipment. The substrate assembly includes a substrate, a middle frame and buckles, the buckles are arranged on the middle frame, and the substrate passes through the The buckle is fixed on the middle frame, and the buckle elastically deforms to fit the substrate between the buckle and the middle frame.

In a second aspect, an embodiment of the present invention further provides an electronic device, the electronic device includes a casing and a substrate assembly disposed in the casing, and the substrate assembly is the above-mentioned substrate assembly.

In the substrate assembly provided by the embodiment of the present invention, the buckle can be elastically deformed to snap the substrate between the buckle and the middle frame, and the buckle can be directly snapped to the surface of the substrate, and the substrate can be aligned without opening a hole on the substrate. The clamping fit realizes the limit and fixation of the substrate without causing damage to the components and wiring of the substrate, and reduces the damage of the substrate during the fixing process.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention.

FIG. 2 is a schematic front view of the electronic device shown in FIG. 1 .

Fig. 3 is a schematic structural diagram of a casing provided by an embodiment of the present invention.

Fig. 4 is another structural schematic diagram of the casing provided by the embodiment of the present invention.

FIG. 5 is another schematic structural diagram of an electronic device provided by an embodiment of the present invention.

FIG. 6 is a schematic front view of the electronic device shown in FIG. 5 .

FIG. 7 is a schematic structural diagram of a substrate assembly provided by an embodiment of the present invention.

Fig. 8 is a schematic structural diagram of the buckle set provided by the embodiment of the present invention.

Fig. 9 is another structural schematic diagram of the buckle set provided by the embodiment of the present invention.

FIG. 10 is another schematic structural view of the substrate assembly provided by the embodiment of the present invention.

FIG. 11 is another schematic structural view of the substrate assembly provided by the embodiment of the present invention.

Fig. 12 is another structural schematic diagram of the buckle provided by the embodiment of the present invention.

Fig. 13 is another structural schematic diagram of the buckle provided by the embodiment of the present invention.

FIG. 14 is another schematic structural view of the substrate assembly provided by the embodiment of the present invention.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the invention. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

Embodiments of the present invention provide a substrate assembly and electronic equipment. The details will be described respectively below.

In this embodiment, description will be made from the perspective of the substrate assembly, which may be specifically provided in electronic devices, such as mobile phones, tablet computers, and PDAs (Personal Digital Assistant).

Please refer to FIG. 1 and FIG. 2. FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention, and FIG. 2 is a schematic front structural diagram of an electronic device provided by an embodiment of the present invention. The electronic device 1 includes a casing 10 , a printed circuit board 14 , and a display screen 15 . It should be noted that, although not shown in FIG. 1 and FIG. 2 , the electronic device 1 includes a battery.

Wherein, the battery is installed in the casing 10 and is electrically connected with the printed circuit board 14 to provide power to the electronic device 1 .

Wherein, the printed circuit board 14 is installed in the housing 10, the printed circuit board 14 can be the main board of the electronic device 1, and the printed circuit board 14 can be integrated with an antenna, a motor, a microphone, a camera, a light sensor, a receiver And functional components such as processors.

Wherein, the display screen 15 is installed in the housing 10 , and at the same time, the display screen 15 is electrically connected to the printed circuit board 14 to form a display surface of the electronic device 1 .

Please also refer to FIG. 3 . FIG. 3 is a schematic structural diagram of a casing provided by an embodiment of the present invention. The housing 10 may include a cover plate 11, a middle frame 12 and a rear cover 13, the cover plate 11, the middle frame 12 and the rear cover 13 are combined to form the housing 10, and the housing 10 has a structure through the cover plate 11, the middle frame 12 and the airtight space formed by the back cover 13 to accommodate devices such as the printed circuit board 14, the display screen 15, and the battery. In some embodiments, the cover plate 11 is set on the middle frame 12, and the back cover 13 is set on the middle frame 12. The cover plate 11 and the back cover 13 are located on the opposite sides of the middle frame 12. The cover plate 11 and the back cover 13 Relatively, the closed space of the casing 10 is located between the cover plate 11 and the rear cover 13 .

It should be noted that the structure of the housing in the embodiment of the present invention is not limited thereto. Please refer to FIG. 4 , which is another structural schematic diagram of the housing in the embodiment of the present invention. The difference between FIG. 4 and FIG. 3 is that the back cover and the middle frame are integrally formed to form a middle frame 12 structure. The housing 10 shown in FIG. 4 includes a cover plate 11 and a middle frame 12 . The cover plate 11 and the middle frame 12 are fixed to each other to form a closed space for accommodating printed circuit boards 14 , display screens 15 , batteries and other components.

Wherein, the cover plate 11 is installed on the display screen 15 to cover the display screen 15 . The cover plate 11 may be a transparent glass cover plate. In some embodiments, the cover plate 11 may be a glass cover plate made of materials such as sapphire. The cover plate 11 includes a display area 111 and a non-display area 112 . The display area 111 can be used to display the screen of the electronic device 1 or provide touch control for the user. The top area of the non-display area 112 is provided with openings for sound and light transmission, and the bottom of the non-display area 112 can be provided with functional components such as fingerprint modules and touch buttons.

It should be noted that the structure of the display screen is not limited thereto. Please refer to FIG. 5 and FIG. 6 together. FIG. Another schematic diagram of the front structure of the electronic device. The electronic device 2 includes a casing 20 , a printed circuit board 24 , and a display screen 25 . The display screen 25 includes a display area and a non-display area. The non-display area is directly formed on the display screen 25, for example, a transparent structure is set in the non-display area of the display screen 25, so that the light signal passes through, or an opening for light transmission is directly provided in the non-display area of the display screen 25, The front camera, photoelectric sensor, etc. can be set in the non-display area, so that the front camera can take pictures and the photoelectric sensor can detect.

The housing 20 includes a cover plate 21 , a middle frame 22 and a rear cover 23 . It should be noted that the mutual cooperation relationship among the cover plate 21 , the middle frame 22 and the rear cover 23 can refer to the cover plate 11 , the middle frame 12 and the rear cover 13 , and will not be repeated here. Wherein, the cover plate 21 includes a display area 211 and a non-display area 212 , the non-display area 212 corresponds to the non-display area of the display screen 25 , and the display area 211 corresponds to the display area of the display screen 25 .

For the printed circuit board 24 , reference may be made to the above printed circuit board 14 , which will not be repeated here.

In some embodiments, the printed circuit board 14 is arranged in the housing 10 , specifically on the middle frame 12 , and the printed circuit board 14 is arranged on the middle frame 12 to form a substrate assembly. Please refer to FIG. 7 . FIG. 7 is a schematic structural diagram of a substrate assembly provided by an embodiment of the present invention. The substrate assembly 16 includes a middle frame 12 , a substrate 14 and buckles 120 . The substrate 14 is fixed on the middle frame 12 through buckles 120 . Specifically, the substrate 14 is snapped between the buckle 120 and the middle frame 12 through elastic deformation of the buckle 120 . The buckle 120 can be directly snap-fitted to the surface of the substrate 14, and the snap-fitting of the substrate 14 can be realized without opening a hole on the substrate 14, and the position limitation and fixation of the substrate 14 can be realized without damaging the components and wiring of the substrate 14. etc. to reduce damage to the substrate 14 during the fixing process.

Wherein, the middle frame may be the middle frame 12 in the electronic device 1, or may be a middle frame on other devices. The embodiment of the present invention takes the middle frame 12 of the electronic device 1 as an example for illustration. The middle frame of the embodiment is not limited to the electronic device 1 .

Wherein, the substrate may be the printed circuit board 14 in the electronic device 1, or other circuit boards. The embodiment of the present invention takes the printed circuit board 14 of the electronic device 1 as an example for illustration. It should be noted that the present invention The substrate of the embodiment is not limited to the electronic device 1 . The substrate 14 is disposed on the middle frame 12 .

Wherein, there are at least two buckles 120 , and the buckles 120 are arranged on the inner sidewall of the middle frame 12 . The buckle 120 can be integrally formed with the middle frame 12 to form an integral structure. For example, the middle frame 12 and the buckle 120 are both made of metal or plastic. It should be noted that the connection relationship between the frame 12 and the buckle 120 in the embodiment of the present invention is not limited to this, for example: the material of the buckle 120 and the middle frame 12 are both metal, and the buckle 120 is fixed to the middle frame by welding 12 on the inner wall. Another example: a through hole or a groove is provided on the middle frame 12, and the root of the buckle is inserted into the through hole or groove to realize a fixed connection.

Please refer to FIG. 8 . FIG. 8 is a schematic structural diagram of a buckle provided by an embodiment of the present invention. In some embodiments, the buckle 120 includes a bearing portion 123 and at least two engaging portions 121 .

Wherein, there are at least two engaging parts 121 , which are spaced apart from each other on the carrying part 123 . In the embodiment of the present invention, there are three engaging parts 121 , and the three engaging parts 121 are evenly distributed on the carrying part 123 . It should be noted that the number of snap-fitting parts 121 in the embodiment of the present invention is not limited to three, such as 2, 4, etc. Please refer to FIG. 9, which is another buckle provided by the embodiment of the present invention. Schematic. The buckle shown in FIG. 9 only includes two engaging portions 121 . In some embodiments, the size of each engaging portion 121 is set to be the same, so that each engaging portion 121 is evenly stressed during the engaging process with the substrate 14 , preventing each engaging portion 121 from causing damage to the substrate 14 due to uneven force. damage. It should be noted that the size setting of each snapping part in the embodiment of the present invention is not limited to this, and the size setting of each snapping part can also be different. In some embodiments, the thickness of each engaging portion 121 gradually increases from its top to its root, forming an inclined surface 124. The inclined surface 124 on the engaging portion 121 not only facilitates the elastic deformation of the engaging portion 121, but also Moreover, the strength of the engagement portion 121 is ensured to prevent damage due to a small force.

In some embodiments, the engaging portion 121 has a trihedral structure.

In some embodiments, an opening 122 is formed between two adjacent engaging parts 121 , two openings 122 are formed by three engaging parts 121 , and the size and shape of the two buckles 122 are the same. Further, in the same direction, the width of the opening 122 is greater than the width of the engaging portion 121, and the width of the opening 122 is the width of two adjacent engaging portions, that is, one engaging portion 121 to its adjacent engaging portion 121 the distance between. In the embodiment of the present invention, the opposite surfaces of two adjacent snapping parts 121 are parallel to each other, and the distance between two snapping parts 121 or the width between two snapping parts 121 is the distance between two snapping parts 121. The minimum distance is the width of the opening 122 . It should be noted that the width setting of the opening 122 is not limited thereto, and the width of the opening 122 can also be set to be the same as the width of the engaging portion 121 , or set to be smaller than the width of the engaging portion 121 . In the embodiment of the present invention, the width of the opening 122 is larger than that of the fitting portion 121 to facilitate the elastic deformation of the fitting portion 121 and prevent the device on the substrate 14 from being affected by the width of the fitting portion 121 being too wide.

In some embodiments, the inclined surface 124 of the engaging portion 121 extends to the position of the opening 122 . It should be noted that the inclined surface 124 in this embodiment of the present invention can also pass through the opening 122 and extend to the position of the bearing part 123 ; or the inclined surface 124 in this embodiment of the present invention can also be arranged before the position of the opening 122 .

In some embodiments, the engaging portion 121 is disposed on one side of the carrying portion 123 .

Wherein, the bearing part 123 is fixed on the inner side of the middle frame 12, specifically, the other side of the bearing part 123 is fixed on the middle frame 12, and the middle frame 12 and the engaging part 120 are respectively located on two sides of the bearing part 123. opposite side. In some embodiments, the other side of the carrying portion 123 and the middle frame 12 are integrally formed to form an integral structure. It should be noted that the connection relationship between the bearing part 123 and the middle frame 12 in the embodiment of the present invention is not limited thereto. For example, both the bearing part 123 and the middle frame 12 are made of metal material, and the bearing part 123 can be welded to the inner side wall of the middle frame 12 superior.

In some embodiments, the bearing portion 123 gradually increases in thickness from one side to the other side, and extends to the middle frame 12. When the buckle 120 is subjected to a large force, the bearing portion 123 can also generate elasticity. deformation, the structure of the bearing part 123 not only facilitates elastic deformation, but also ensures the strength of its root, increases the ability to bear force, and prevents damage.

In some embodiments, the buckles 120 are disposed on three adjacent inner sidewalls of the middle frame 12 , and interact to realize the limitation and fixation of the substrate 14 . Although FIG. 7 only shows that one of the inner side walls of the middle frame 12 is provided with buckles, it does not limit this embodiment of the present invention. It should be noted that, the manner in which the buckle is arranged on the middle frame 12 in the embodiment of the present invention is not limited thereto, for example: the buckle 120 may only be arranged on two opposite inner walls of the middle frame 12 .

The above is the description of a specific structure of the buckle in the embodiment of the present invention, and the specific process of the snap-fitting substrate of the buckle will be described below. During the actual clamping process of the substrate 14 through the buckle 120 fixed on the inner side of the middle frame 12, the user can first place the edge of the substrate 14 on the inclined surface 124 of the clamping part 121, and the user can gently press the substrate with his hand 14. The substrate 14 receives a pressing force and acts on the inclined surface 124 of the engaging part 121, so that the engaging part 121 produces elastic deformation, so that the edge of the substrate 14 gradually moves along the inclined surface 124 until it is clamped Fit into the card fitting part 121. Therefore, the clamping portion 121 realizes position limitation and fixation of the substrate 14 to prevent the substrate 14 from shaking. In the actual clamping process, the clamping part 121 of the buckle 120 can be directly clamped to the surface of the substrate 14, and the clamping of the substrate 14 can be realized without opening a hole on the substrate 14, and the positioning of the substrate 14 can be realized. Fixing will not cause damage to the components, wiring, etc. of the substrate 14, reducing damage to the substrate 14 during the fixing process.

The above is a description of a specific structure of the buckle in the embodiment of the present invention, and a specific description of the snap-fitting substrate of the buckle. It should be noted that the structure of the buckle in the embodiment of the present invention is not limited thereto, please refer to the following content for details.

Please refer to FIG. 10 . FIG. 10 is another schematic structural diagram of a substrate assembly provided by an embodiment of the present invention. The substrate assembly 16a includes a middle frame 12a, a substrate 14a and buckles 120a.

Wherein, the substrate 14a can be applied to electronic devices such as mobile phones and pads, and can also be applied to other electronic devices. The substrate 14a may be a flat plate structure, and the substrate 14a may include four edges.

Wherein, the middle frame 12a can be applied to electronic devices such as mobile phones and pads, and can also be applied to other electronic devices. For the middle frame 12a, reference may be made to the above middle frame 12, which will not be repeated here.

Wherein, the buckle 120a is disposed on the middle frame 12a, and the connection relationship between the buckle 120a and the middle frame 12a can be referred to above content, and will not be repeated here. In some embodiments, there are multiple buckles 120a, which are evenly distributed on the middle frame 12a.

Specifically, there are four buckles 120a, and each buckle 120a is snapped onto an edge of the base plate 14a. Further, each buckle 120a is snapped to the middle of the edge of the base plate 14a. Therefore, the four buckles 120a are respectively engaged with the four edges of the substrate 14a, and the effect of engaging with the substrate 14a is better. It should be noted that the number of buckles in the embodiment of the present invention is not limited thereto, and may also be other numbers, such as 6, 8, 10 and so on. Please refer to FIG. 11 . FIG. 11 is another schematic structural diagram of a substrate assembly provided by an embodiment of the present invention. Figure 11 is an improvement on the basis of Figure 10. Figure 11 and Figure 10 use the same symbols. The difference between Figure 11 and Figure 10 is that there are eight buckles 120a in Figure 11, and every two adjacent buckles 120a forms a buckle group 17a, and the eight buckles 120a in FIG. In the embodiment of the present invention, two adjacent buckles form a buckle group to realize the position limitation of the substrate, so that the position limitation effect is better. It should be noted that in this embodiment of the present invention, a buckle group may also include three or even more adjacent buckles.

Please refer to FIG. 12 . FIG. 12 is another structural schematic diagram of the buckle provided by the embodiment of the present invention. The buckle 120a includes a fixing portion 123a, a connecting portion 122a and a fitting portion 121a, and the connecting portion 122a is connected between the fixing portion 123a and the fitting portion 121a.

Wherein, the fixing part 123a is fixed on the middle frame 12a. In some embodiments, the buckle 120a is made of metal material, and the buckle 120a is fixed on the middle frame 12a by welding the fixing part 123a and the middle frame 12a. It should be noted that the buckle 120a in this embodiment of the present invention can also be fixed on the middle frame 12a in other ways, please refer to the above content for details, and details will not be repeated here.

Wherein, the engaging portion 121a is used for engaging the substrate 14a, please refer to the above content for details, and will not be repeated here.

Wherein, the width of the connecting portion 122a gradually increases from the engaging portion 121a to the fixing portion 123a, and the thickness of the connecting portion 122a gradually increases from the engaging portion 121a to the fixing portion 123a, that is, along the engaging portion 121a toward the fixing portion The width of the connecting portion 122a gradually increases in the direction 123a, and the thickness of the connecting portion 122a gradually increases along the direction from the engaging portion 121a toward the fixing portion 123a. In some embodiments, a first angle 124a is formed between the connecting portion 122a and the fixing portion 123a, the first angle 124a is greater than 90 degrees, and the size of the first angle 124a in the embodiment of the present invention is preferably 100 degrees to 150 degrees . In some embodiments, a second included angle 125a is formed between the connecting portion and the engaging portion, and the second included angle 125a is greater than ninety degrees. In the embodiment of the present invention, the size of the second included angle 125a is preferably 100 degrees to 150 degrees. In some embodiments, the first included angle 124a and the second included angle 125a are set to be the same, the first included angle 124a is set to 120 degrees in the embodiment of the present invention, and the second included angle 125a is set to 120 degrees in the embodiment of the present invention. In some embodiments, the engaging portion 121a and the fixing portion 123a are arranged in parallel.

It should be noted that the setting of the first included angle and the second included angle is not limited thereto, for example, the first included angle is less than 90 degrees, and the second included angle is less than 90 degrees; or the first included angle is equal to 90 degrees, The second included angle is equal to ninety degrees; or the first included angle is greater than ninety degrees, and the second included angle is smaller than ninety degrees.

The above is the description of another specific structure of the buckle in the embodiment of the present invention, and the specific process of the snap-fitting substrate with the buckle will be described below. During the actual clamping process of the substrate 14a through the buckle 120a fixed on the middle frame 12a, the user can first place the edge of the substrate 14a on the clamping part 121a, and the user can gently press the substrate 14a with the hand, and the substrate 14a is pressed force, and the pressing force acts on the fitting part 121a, so that the fitting part 121a and the connecting part 122a produce elastic deformation, so that the edge of the substrate 14a is snapped between the fitting part 121a and the connecting part 122a. Therefore, the clamping portion 121a and the connecting portion 122a can limit and fix the base plate 14a to prevent the base plate 14a from shaking. In the actual clamping process, the clamping part 121a of the buckle 120a can be directly clamped to the surface of the substrate 14a, and the clamping of the substrate 14a can be realized without opening a hole in the substrate 14a, and the positioning of the substrate 14a can be realized. Fixing will not cause damage to the devices, wiring, etc. of the substrate 14a, reducing damage to the substrate 14a during the fixing process.

The above is the description of another specific structure of the buckle in the embodiment of the present invention, as well as the specific description of the snap-fitting substrate of the buckle. It should be noted that the structure of the buckle in the embodiment of the present invention is not limited thereto, please refer to the following content for details.

Please refer to FIG. 13 . FIG. 13 is another structural schematic diagram of the buckle provided by the embodiment of the present invention. The buckle 121b includes a fitting portion 121b and a carrying portion 122b, the fitting portion 121b and the carrying portion 122b are integrally formed, and the carrying portion 122b is disposed on the middle frame. It should be noted that the specific structure of the buckle 120b shown in FIG. 13 and the cooperation relationship with the middle frame and the base plate can be referred to above, and will not be repeated here.

The above is the description of another specific structure of the buckle according to the embodiment of the present invention, and the specific description of the snap-fitting substrate of the buckle. It should be noted that the structure of the substrate assembly in the embodiment of the present invention is not limited thereto, please refer to the following content for details.

Please refer to 14, FIG. 14 is another schematic structural diagram of the substrate assembly provided by the embodiment of the present invention. The substrate assembly 16c includes a middle frame 12c, a printed circuit board 14c, buckles 120c and a baffle 130c.

Wherein, the printed circuit board 14c is described by taking a printed circuit board in an electronic device as an example. It should be noted that the printed circuit board 14c is not limited thereto. Specifically, the printed circuit board 14c can be referred to above The substrate 14 will not be described in detail here.

Wherein, the middle frame 12c is described by taking the middle frame in an electronic device as an example. It should be noted that the middle frame 12c is not limited thereto. Specifically, the middle frame 12c can refer to the above middle frame 12, which will not be repeated here. repeat.

Wherein, the buckle 120c can be integrally formed directly with the middle frame 12c, or can be fixed on the inner wall of the middle frame 12c by welding or other methods. For details, please refer to the above content, and will not repeat them here. In some embodiments, there may be multiple buckles 120c, which are snapped onto the surface of the printed circuit board 120c. Specifically, the number of buckles 120c is six, of which two buckles 120c are located on an inner wall of the middle frame 12c, six buckles 120c are respectively located on three inner walls of the middle frame 12c, and six buckles 120c snap-fit to the three edges of the printed circuit board 14c respectively. The specific structure of the buckle 120c can refer to the above-mentioned engaging portion 121 , and will not be repeated here. It should be noted that the buckle 120c in the embodiment of the present invention may also adopt the structure of the buckle 120, the structure of 120a, the structure of 120b or other structures.

Wherein, the printed circuit board 14c has four edges, and three edges of the printed circuit board 14c are engaged and limited by the buckle 120c. Another edge of the printed circuit board 14c that is not engaged with the buckle 120c is limited by the baffle 130c. Specifically, the baffle 130c can be directly fixed on the middle frame 12c, the baffle 130c can be fixed to the middle frame 12c by screwing, or can be fixed to the middle frame 12c by glue, or can be fixed by using It is fixed to the middle frame 12c by welding, and can also be directly integrally formed with the middle frame 12c. Therefore, when the printed circuit board 14c is installed and fixed on the middle frame 12c, the four edges are engaged and limited by six buckles 120c and a baffle plate 130c respectively, and the effect of engaging and limiting the printed circuit board 14c is Even better, the printed circuit board 14c is prevented from moving.

It should be noted that in the embodiment of the present invention, buckles can also be provided on the baffle 130c, or grooves can be provided on the baffle 130c to accommodate the edge of the printed circuit board 14c, so that the printed circuit board can be further realized. The limit of 14c, fixing.

Specifically, in the process of snapping the printed circuit board 14c to the middle frame 12c, firstly, the user can press one edge of the printed circuit board 14c to the position of the baffle 130c, and at the same time place the three edges on the buckle 120c On the inclined surface (the inclined surface can refer to the above inclined surface 124), the user can gently press the printed circuit board 14c with his hand, the printed circuit board 14c is subjected to the pressing force, and the pressing force acts on the inclination of the buckle 120c On the surface, the buckle 120c is elastically deformed, and the other three edges of the printed circuit board 14c gradually move along the inclined surface of the buckle 120c until they are snapped into the buckle 120c. Therefore, the buckle 120c and the baffle 130c can limit and fix the printed circuit board 14c to prevent the printed circuit board 14c from shaking. In the actual clamping process, the buckle 120 can be directly clamped to the surface of the printed circuit board 14c, and the clamping of the printed circuit board 14c can be realized without opening a hole on the printed circuit board 14c, and the printed circuit board 14c can be realized. The position limiting and fixing of the circuit board 14c will not cause damage to the components and wiring of the printed circuit board 14c, and reduce the damage of the printed circuit board 14c during the fixing process.

It can be seen from the above that in the substrate assembly provided by the embodiment of the present invention, the buckle can be elastically deformed to fit the substrate between the buckle and the middle frame, and the buckle can be directly fitted to the surface of the substrate without opening a hole on the substrate. It can realize the clamping of the substrate, realize the limit and fixation of the substrate, will not cause damage to the components and wiring of the substrate, and reduce the damage of the substrate during the fixing process.

Those skilled in the art can understand that the structure of the electronic device 1 shown in FIG. 1 and FIG. 2 does not constitute a limitation to the electronic device 1 . The electronic device 1 may include more or fewer components than shown, or combine certain components, or have a different arrangement of components. The electronic device 1 may also include a processor, a memory, a Bluetooth module, a camera, etc., which will not be repeated here.

The substrate components and electronic devices provided by the embodiments of the present invention are described above in detail. In this paper, specific examples are used to illustrate the principle and implementation of the present invention. The descriptions of the above embodiments are only used to help understand the present invention. At the same time, for those skilled in the art, according to the idea of the present invention, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be construed as limiting the present invention.

Claims (19)

1. A substrate assembly used in electronic equipment, characterized in that the substrate assembly includes a substrate, a middle frame and a buckle, the buckle is arranged on the middle frame, and the substrate passes through the buckle Being fixed on the middle frame, the buckle elastically deforms to fit the substrate between the buckle and the middle frame. 2. The substrate assembly according to claim 1, wherein the buckle includes a bearing portion and at least two engaging portions, the bearing portion is arranged on the middle frame, and the engaging portions are used for The substrate is clamped, and at least two clamping parts are spaced apart from each other and arranged on the bearing part. 3 . The substrate assembly according to claim 2 , wherein the engaging portion gradually increases in thickness from its top to its root, forming an inclined surface. 4 . 4. The substrate assembly according to claim 2, wherein an opening is formed between two adjacent engaging portions, and in the same direction, the width of the opening is greater than the width of the engaging portions , the width of the opening is the distance between two adjacent engagement parts. 5 . The substrate assembly according to claim 4 , wherein the engaging portion gradually increases in thickness from its top to its root to form an inclined surface, and the inclined surface extends to the opening. 6. The substrate assembly according to claim 2, wherein at least two snap-fitting parts are arranged on one side of the carrying part, and the other side of the carrying part is arranged on the middle frame, The middle frame and the engaging portion are respectively located on two opposite surfaces of the carrying portion. 7 . The substrate assembly according to claim 6 , wherein the bearing portion gradually increases in thickness along a direction from one side to the other, and extends to the middle frame. 8 . 8. The substrate assembly according to claim 1, wherein the buckle comprises a fixing part, a connecting part and a fitting part, the fixing part is fixed on the middle frame, and the fitting part is used for The substrate is clamped, and the connection part is connected between the fixing part and the clamping part. 9. The substrate assembly according to claim 8, wherein a first included angle is formed between the connecting portion and the fixing portion, and a second included angle is formed between the connecting portion and the engaging portion , the first included angle is greater than ninety degrees, and the second included angle is greater than ninety degrees. 10 . The substrate assembly according to claim 8 , wherein a width of the connecting portion gradually increases along a direction from the engaging portion toward the fixing portion. 11 . 11 . The substrate assembly according to claim 8 , wherein a thickness of the connecting portion gradually increases along a direction from the engaging portion toward the connecting portion. 12 . The substrate assembly according to claim 1 , wherein two adjacent buckles form a buckle group, and the substrate is fixed on the middle frame by at least two buckle groups. 13 . 13. The substrate assembly according to claim 1, wherein the substrate comprises four edges, the buckles comprise four, and each of the buckles is snapped onto one edge of the substrate. 14. The substrate assembly according to any one of claims 1 to 12, wherein the substrate assembly further comprises a baffle adjacent to one edge of the substrate to limit the substrate. 15 . The substrate assembly according to claim 14 , wherein the substrate includes four edges, and the other three edges of the substrate are engaged by the buckle. 16 . 16. The substrate assembly according to any one of claims 1 to 13, wherein the buckle and the middle frame are integrally formed. 17. The substrate assembly according to any one of claims 1 to 13, wherein the buckle is made of metal material. 18. The substrate assembly according to claim 17, wherein the buckle is welded to the middle frame. 19. An electronic device, characterized in that the electronic device comprises a casing and a substrate assembly disposed in the casing, and the substrate assembly is the substrate assembly according to any one of claims 1 to 18.