CN105092925A - Conversion card for testing probe card - Google Patents

Abstract

A conversion card for testing a probe card comprises a plate body, a plurality of first transmission units, a plurality of second transmission units and a direct current/alternating current conversion circuit, wherein the first transmission units, the second transmission units and the direct current/alternating current conversion circuit are arranged on the plate body; the first transmission unit is used for transmitting an alternating current signal, the alternating current signal is connected to the direct current probe card through the direct current/alternating current conversion circuit, the second transmission unit and the probe card interface, and the alternating current circuit and transmission line principle is applied to match with alternating current signal testing instruments such as a logic analyzer, an oscilloscope, a time domain reflectometer, a frequency domain network analyzer, an error code generator, an eye diagram analyzer and the like.

Description

Transition Cards for Test Probe Cards

technical field

The invention relates to a conversion card, in particular to a conversion card for testing probe cards.

Background technique

For a long time, the semiconductor industry will first verify whether the DC probe card (ProbeCard) is available during the wafer reliability test (wafer acceptance test), because the DC probe card is responsible for the final stage of the test, before the IC is cut (WS: WaferSort ), the important role of whether the functional test is normal. When the IC test can work normally, the IC will be cut and packaged (FT: FinalTest; IChasbeenpackaged) and then followed by the classification (BIN) test. It can be seen that when the DC probe When the error rate of the card is high, it will directly affect the speed and quality of the subsequent shipments. However, as the IC function becomes stronger and stronger, the number of pins of the DC probe card increases, even as high as tens of thousands of pins. It costs tens of millions. If the DC probe card is judged to have a high error rate, it is necessary to clear the needle or even replace the card. These actions are very costly and time-consuming. Fabs and test factories often rush to deliver goods to customers. Often the card is replaced directly until the test is correct, and the cost of these replaced DC probe cards is directly absorbed by the fab and the test factory, so the inventory rate of DC probe cards often reaches several thousand Taiwan dollars Tens of thousands to hundreds of millions of levels, resulting in a substantial increase in costs.

Since the semiconductor industry has used this DC test method to test the DC probe card for a long time, the improvement method has reached a bottleneck. Therefore, the inventor is based on the concept of continuous improvement and innovation of products, based on years of experience in semiconductor and electronics-related industries. Practical experience in product design and development in the testing industry, as well as active research and development thinking, and the use of AC to analyze and improve the error of the DC probe card, through countless actual tests and experiments, led to the emergence of the present invention.

Contents of the invention

The purpose of the present invention is to provide an AC signal transmitted by the first transmission unit, and the AC signal is connected to the DC probe card through the DC/AC conversion circuit and the second transmission unit, and uses the principle of the AC circuit and the transmission line to cooperate with the AC The signal instrument uses the AC method to perform error analysis and testing on the DC probe card and an improved conversion card for testing the probe card.

For reaching above-mentioned purpose, solution of the present invention is:

A conversion card for testing probe cards, comprising:

a board;

At least one first transmission unit is arranged on the board, and the first transmission unit is used to electrically connect to the test instrument to transmit AC signals;

At least one second transmission unit is arranged on the board body, and the second transmission unit is used to electrically connect to the interface of the probe card;

A DC/AC conversion circuit is arranged on the board, and the DC/AC conversion circuit is electrically connected to the first transmission unit and the second transmission unit.

Further, the plate body has a perforation.

Further, the first transmission unit is a plurality of electrical connection holes arranged in a region.

Further, the second transmission unit is an electrical connection hole.

Further, the board body, the first transmission unit, the second transmission unit and the DC/AC conversion circuit are integrated into a printed circuit board (PCB, Printed circuit board).

Further, the board body, the first transmission unit, the second transmission unit and the DC/AC conversion circuit are pressed into one body.

The AC signal is transmitted by the first transmission unit, and the AC signal is connected to the DC probe card through the DC/AC conversion circuit, the second transmission unit, and the probe card interface, and the principle of the AC circuit and the transmission line is used to cooperate with the logic analyzer, Oscilloscopes, time domain reflectometers, frequency domain network analyzers, error code generators, eye diagram analyzers and other AC signal test instruments can use AC methods to analyze and improve DC probe cards to avoid misjudgment of probe cards The error rate can be reduced to reduce the card replacement rate and needle clearance rate, and reduce the inventory rate of DC probe cards.

Description of drawings

Fig. 1 is the top view of the present invention;

Fig. 2 is the upper view partial enlarged view of the present invention;

Fig. 3 is the three-dimensional exploded view of the test embodiment of the present invention;

Fig. 4 is the sectional view of the test embodiment of the present invention;

Fig. 5 is a structural block diagram of the present invention;

Fig. 6 is the test embodiment figure that the present invention cooperates logic analyzer, digital signal generator;

Fig. 7 is the test result diagram of Fig. 6;

Fig. 8 is a diagram of a test embodiment of the present invention cooperating with a logic analyzer, an oscilloscope, and a digital signal generator;

Fig. 9 is the test result diagram of Fig. 8;

Fig. 10 is a test embodiment diagram of the present invention with a time domain reflectometer;

Fig. 11 is the test result figure of Fig. 10;

Fig. 12 is a test embodiment diagram of the present invention cooperating with a frequency domain network analyzer;

Fig. 13 is the test result figure of Fig. 12;

Fig. 14 is a diagram of a test embodiment of the present invention in conjunction with an eye diagram analyzer and a bit error generator;

Fig. 15 is the test result figure of Fig. 14;

Fig. 16 is a diagram of a test embodiment of the present invention with an integrated model of an eye diagram analyzer and a bit error generator;

Fig. 17 is a flow chart of the test program of the present invention.

【Symbol Description】

Conversion card 10 board body 11 for testing probe card

Connecting line 121 of the first transmission unit 12

The second transmission unit 13 DC/AC conversion circuit 14

Perforated 15 Probe card interface 20

DC probe card 30 test equipment 31

Logic analyzer 40 Digital signal generator 41

Oscilloscope 50 Time Domain Reflectometer 60

Frequency Domain Network Analyzer 70 Bit Error Generator 80

An eye pattern analyzer 90 is an integrated model 91 of a bit error generator and an eye pattern analyzer.

Detailed ways

In order to further explain the technical solution of the present invention, the present invention will be described in detail below through specific examples.

Please refer to Figures 1 to 16, the structure of the conversion card 10 used to test the probe card (ProbeCard) of the present invention includes a board body 11, a first transmission unit 12, a second transmission unit 13 and a DC/AC conversion circuit 14, wherein:

In one embodiment, the plate body 11 has a perforation 15 for reducing weight, saving material, and further reducing manufacturing cost.

The first transmission unit 12 is arranged on the board body 11, and the first transmission unit 12 is used to electrically connect to a predetermined test instrument to transmit AC signals. In this embodiment, the first transmission unit 12 can be electrically connected to the connection line 121 of the test instrument. The first transmission unit 12 is evenly arranged on the board body 11 in eight shapes, so that several connection lines 121 can also be electrically connected to several first transmission units 12 at the same time. Accordingly, the test instrument can be connected by one The connecting wires 121 are connected to the first transmission units 12 in different positions to test the DC probe card 30 in different areas, or the test instrument can be connected to the first transmission units 12 in different positions through several connecting wires 121 to simultaneously test the DC probes in different areas. Card 30.

In one embodiment, the first transmission unit 12 is a plurality of electrical connection holes arranged in a region.

The second transmission unit 13 is disposed on the board body 11 , and the second transmission unit 13 is used to electrically connect to the probe card interface (POGOtower) 20 .

In one embodiment, the first transmission unit 12 is an electrical connection hole, and the digital probes on the upper side of the probe card interface 20 of this embodiment pass through the second transmission unit 13 .

The DC/AC conversion circuit 14 is disposed on the board body 11 , and the DC/AC conversion circuit 14 is electrically connected to the first transmission unit 12 and the second transmission unit 13 .

In a structural embodiment, the board body 11 , the first transmission unit 12 , the second transmission unit 13 and the DC/AC conversion circuit 14 are integrated into a printed circuit board (PCB, Printed circuit board); or the board body 11 , the second transmission unit 13 A transmission unit 12 , a second transmission unit 13 and a DC/AC conversion circuit 14 are compressed into one body.

The AC signal is transmitted by the first transmission unit 12, and the AC signal is connected to the DC probe card (ProbeCard) 30 through the DC/AC conversion circuit 14, the second transmission unit 13, and the probe card interface 20, using an AC circuit and a transmission line Principle, in order to cooperate with AC signal testing instruments such as logic analyzer 40, oscilloscope 50, time domain reflectometer 60, frequency domain network analyzer 70, error code generator 80, eye diagram analyzer 90, etc., the DC probe can be tested by using the AC method Card 30 conducts error analysis, testing and improvement to avoid misjudgment of the error rate of probe cards, reduce card replacement rate and needle cleaning rate, and reduce the inventory rate of DC probe cards. .

Please refer to Fig. 3 and shown in Fig. 4, the pattern during the test of the present invention is usually set on the probe card interface 20, and the probe card interface 20 is set on the DC probe card 30, and the DC probe card 30 is set on the on test equipment 31.

Please refer to FIG. 6 to FIG. 17, the test embodiment of the present invention, the first transmission unit 12 of the board 11 can be electrically connected to the logic analyzer 40, the oscilloscope 50, the time domain reflectometer 60, Frequency Domain Network Analyzer 70, Error Code Generator 80, Eye Diagram Analyzer 90, Error Code Generator and Eye Diagram Analyzer Integrated Model 91 and other AC signal testing instruments, in addition, Digital Signal Generator 41 cooperates with Logic Analyzer 40 Or cooperate with the logic analyzer 40 and the oscilloscope 50 to be electrically connected to the DC probe card 30 at the same time, so that the above-mentioned AC signal testing instrument can perform error analysis, testing and improvement on the DC probe card 30 according to a predetermined test procedure, and test and improve the results It can be displayed by the above-mentioned AC signal test instruments.

In addition, of course, the above part of AC signal testing instruments can also be selected according to actual needs to perform error analysis, testing and improvement on the DC probe card 30 .

Because the original DC method can only test the voltage and current values at a certain level, and the current is measured by the voltage, or the voltage is measured by the current, which will cause some problematic signals to be ignored when they are not at this level. , so it will also cause a misjudgment of the DC probe card 30. If the AC method is used, since the level will have periodicity, if the different level adjustment methods of the logic analyzer 40 are used, it will be possible to catch the hidden level in the DC. The key error signal under the standard level, and then determine which pin the error is caused by, and then make improvements for this pin, and the logic analyzer 40 can simultaneously identify more than 2,000 pins at a time, so it can be used as a DC probe card When the number of 30 pins exceeds 10,000, all pins can be tested in the fastest time through the partition test. The existing probe card analyzer takes an average of 2 seconds for each pin, and if 10,000 pins need 20,000 Second,

The table below shows the difference:

From the probe of the probe card to the carrier board, there are 4 to 5 layers of different carriers to form the entire test system. However, each carrier has its own different circuit characteristics and impedance matching problems. Therefore, in each pin Bits have different impedance characteristics (even under the same manufacturing process). If the time domain reflectometer 60 is used to analyze the problematic pins, because the output is a very high-frequency step wave, the rise time Within 7 ~ 12ps (picosecond), if the backward distance is the resolution of nm (narometer), since the existing IC design and application are at the GHz level (such as DDR3, HDMI, PCI-e, etc.) , plus the product must be light, thin and small, but also powerful, IC is getting smaller and more functions, the relative IC internal circuit is more complicated, the transmission line effect is more obvious, that is, different frequencies will be different due to some Small process defects will produce different induction or parasitic capacitance inductance and resistance (collectively referred to as induction circuit), causing the original characteristics to be affected by the induction circuit, which is completely unmeasurable in the DC world. The present invention utilizes The step wave of the time domain reflectometer 60 can not only analyze the place where these induction circuits occur, but also convert the characteristics of the induction circuit in this place, and then improve this part. Since the resolution is at the nm level, it is possible to understand Which layer of the carrier caused the error, not all the faults were attributed to the probe card.

When the digital signal flows inside the IC, how to output or input the digital signal at the right time is related to whether the IC can achieve the required function (Function) in the real product. As mentioned above, now Some applications are at the GHz level, so the accuracy of the frequency and the precise control of the signal input and output are very important, because at the GHz level, the frequency is often interfered by the jitter (Jitter) and the noise (noise) caused by the system and high-frequency frequencies, so It is necessary to use the bit error generator (BitErrorRateTester) 80 and the eye-diagram analyzer (eye-diagram analyzer) 90 to understand the signal transmission quality, and analyze the jitter (such as TJ (total jitter), PJ (periodic jitter), DCD (Duty- cyclejitter), etc.) or noise (such as RN (randomnoise), DN (deterministicnoise), DDN (datadependentnoise), etc.).

As mentioned earlier, the existing applications are all at the GHz level, which is the so-called radio frequency (RF) level, so we must use a radio frequency network analyzer to analyze the frequency domain behavior of the carrier system under the radio frequency, such as the input loss (Insertionloss ), reflection loss (ReturnLoss) and transmission loss (TransitionsLoss), etc. In this way, in combination with the aforementioned situation, it is possible to understand the behavior of each layer carrier in the time domain (Timedomain) and frequency domain (Frequency domain), so as to achieve different means and methods. improve.

As can be seen from the above, the present invention integrates the structure interface of the entire test DC probe card through the arrangement of the board body, the first transmission unit, the second transmission unit and the DC/AC conversion circuit, and uses the principles of the AC circuit and the transmission line. It can measure all very critical parameters and the factors that cause errors at one time, which can not only reduce the high inventory rate of probe cards, but also eliminate more errors for the subsequent functional test (functional test), speed up the speed of product launch, and overcome the The bottleneck of the DC test probe card is not only for the DC probe card, but also for the entire original test layer, such as the loadboard, the interface between the loadboard and the probe card (POGOtower), and the probe head (probehead) And the needle (needle), etc., can detect its characteristics and errors, so that the real problem can be solved, instead of clearing the needle and changing the card repeatedly.

The above is the embodiment cited in this case, which is only for the convenience of explanation, and should not limit the meaning of this case, that is, all kinds of transformation designs based on the scope of the patent application listed should be included in the scope of the patent of this case. .

Claims (6)

1. A conversion card for testing a probe card, characterized in that it comprises: a board; At least one first transmission unit is arranged on the board, and the first transmission unit is used to electrically connect to the test instrument to transmit AC signals; At least one second transmission unit is arranged on the board body, and the second transmission unit is used to electrically connect to the interface of the probe card; A DC/AC conversion circuit is arranged on the board, and the DC/AC conversion circuit is electrically connected to the first transmission unit and the second transmission unit. 2. The conversion card for testing probe cards as claimed in claim 1, wherein the board body has a through hole. 3. The conversion card for testing probe cards as claimed in claim 1, wherein the first transmission unit is a plurality of electrical connection holes arranged in a region. 4. The conversion card for testing probe cards as claimed in claim 1, wherein the second transmission unit is an electrical connection hole. 5. The conversion card for testing probe cards as claimed in claim 1, wherein: the board body, the first transmission unit, the second transmission unit and the DC/AC conversion circuit are integrated into a printed circuit board. 6 . The conversion card for testing probe cards as claimed in claim 1 , wherein the board body, the first transmission unit, the second transmission unit and the DC/AC conversion circuit are pressed into one body. 7 .