CHASSIS

𝗠𝗼𝗿𝗲 𝗧𝗵𝗮𝗻 𝗮 𝗠𝗲𝗲𝘁𝗶𝗻𝗴: 𝗔𝗹𝗶𝗴𝗻𝗶𝗻𝗴 𝘁𝗵𝗲 𝗕𝗹𝘂𝗲𝗽𝗿𝗶𝗻𝘁 𝗳𝗼𝗿 𝘁𝗵𝗲 𝗙𝘂𝘁𝘂𝗿𝗲 𝗼𝗳 𝗔𝘂𝘁𝗼𝗺𝗼𝘁𝗶𝘃𝗲 𝗛𝗮𝗿𝗱𝘄𝗮𝗿𝗲.   The future of the Software-Defined Vehicle (SDV) isn't being built in silos—it's forged through collaboration. It was fantastic to bring the CHASSIS project partners together for a highly productive face-to-face meeting on 11.02.-12.02.26 in Vienna. Our mission is to pioneer the next generation of automotive hardware. By focusing primarily on chiplet-based architectures, we are creating the modular, flexible, and powerful systems needed to overcome the limitations of traditional monolithic SoCs. This work is essential for enabling a truly open and innovative automotive ecosystem. In complex, publicly funded projects like this, close alignment isn't just a goal; it's the engine of progress. Our sessions were dedicated to synchronizing the execution of all work packages and navigating the critical dependencies between them, ensuring we move forward as one cohesive team. The energy was incredible, with a clear, shared vision for the road ahead. A big thank you to all partners for their commitment and insightful contributions. And big thanks for TTTech Auto hosting us in the beautiful city of Vienna. We are energized and ready for the next phase of execution!  Ampere Axelera AI Arteris BMW Group Bosch Commissariat a l'Energie Atomique et aux Energies Alternatives Fondazione Chips-IT Fraunhofer-Gesellschaft imec Infineon Technologies Menta SAS NXP Semiconductors Renault Siemens Stellantis Tenstorrent TTTech Auto Valeo

𝗠𝗼𝗿𝗲 𝗧𝗵𝗮𝗻 𝗮 𝗠𝗲𝗲𝘁𝗶𝗻𝗴: 𝗔𝗹𝗶𝗴𝗻𝗶𝗻𝗴 𝘁𝗵𝗲 𝗕𝗹𝘂𝗲𝗽𝗿𝗶𝗻𝘁 𝗳𝗼𝗿 𝘁𝗵𝗲 𝗙𝘂𝘁𝘂𝗿𝗲 𝗼𝗳 𝗔𝘂𝘁𝗼𝗺𝗼𝘁𝗶𝘃𝗲 𝗛𝗮𝗿𝗱𝘄𝗮𝗿𝗲.   The future of the Software-Defined Vehicle (SDV) isn't being built in silos—it's forged through collaboration. It was fantastic to bring the CHASSIS project partners together for a highly productive face-to-face meeting on 11.02.-12.02.26 in Vienna. Our mission is to pioneer the next generation of automotive hardware. By focusing primarily on chiplet-based architectures, we are creating the modular, flexible, and powerful systems needed to overcome the limitations of traditional monolithic SoCs. This work is essential for enabling a truly open and innovative automotive ecosystem. In complex, publicly funded projects like this, close alignment isn't just a goal; it's the engine of progress. Our sessions were dedicated to synchronizing the execution of all work packages and navigating the critical dependencies between them, ensuring we move forward as one cohesive team. The energy was incredible, with a clear, shared vision for the road ahead. A big thank you to all partners for their commitment and insightful contributions. And big thanks for TTTech Auto hosting us in the beautiful city of Vienna. We are energized and ready for the next phase of execution!  Ampere Axelera AI Arteris BMW Group Bosch Commissariat a l'Energie Atomique et aux Energies Alternatives Fondazione Chips-IT Fraunhofer-Gesellschaft imec Infineon Technologies Menta SAS NXP Semiconductors Renault Siemens Stellantis Tenstorrent TTTech Auto Valeo

Press release by Tenstorrent announcing involvement in CHASSIS. The company is one of the founding members of the imec Automotive Chiplet Program ACP. Within the CHASSIS project, Tenstorrent will work with other program partners to develop chiplet-based hardware architectures for software-defined vehicles (SDVs). #CHASSIS #Automotive #Chiplets #SoftwareDefinedVehicles #Innovation #Semiconductors

CHASSIS is accelerating the shift to software-defined mobility with an open, interoperable chiplet ecosystem for automotive compute. As a founding member, Arteris brings decades of expertise in network-on-chip (NoC) and multi-die interconnect – both of which are critical technologies for modular, scalable, and safe vehicle architectures. 👉 In a recent blogpost, Arteris discussed how it is contributing its expertise to CHASSIS to shape the future of automotive compute. Read the full blog here:  https://lnkd.in/djZQcZz2   #CHASSIS #Automotive #Chiplets #SoftwareDefinedVehicles #Innovation #Semiconductors 

📢 𝐂𝐇𝐀𝐒𝐒𝐈𝐒 𝗸𝐢𝐜𝐤𝐬 𝗼𝐟𝐟: 𝐃𝐫𝐢𝐯𝐢𝐧𝐠 𝐚𝐮𝐭𝐨𝐦𝐨𝐭𝐢𝐯𝐞 𝐜𝐡𝐢𝐩𝐥𝐞𝐭 𝐭𝐞𝐜𝐡𝐧𝐨𝐥𝐨𝐠𝐲 𝐢𝐧 𝐄𝐮𝐫𝐨𝐩𝐞 CHASSIS – Europe's first coordinated initiative for an open automotive chiplet ecosystem has just gone live! Coordinated by Bosch and funded by the European Commission (CHIPS-JU), the three-year program unites a total of 18 members, among them three leading OEMs, one automotive supplier, seven semiconductor and two software players, one EDA technology provider, and four research institutions. When it comes to software-defined mobility, CHASSIS is a strategic enabler that will deliver key innovations: 𝗔𝘂𝘁𝗼𝗺𝗼𝘁𝗶𝘃𝗲 𝗕𝗮𝘀𝗲 𝗗𝗶𝗲 (𝗔𝗕𝗗): Simplifying integration and offering greater flexibility. 𝗩𝗶𝗿𝘁𝘂𝗮𝗹/𝗛𝘆𝗯𝗿𝗶𝗱 𝗥𝗲𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗣𝗹𝗮𝘁𝗳𝗼𝗿𝗺:  Accelerating development and reducing risk. 𝗠𝘂𝗹𝘁𝗶-𝗩𝗲𝗻𝗱𝗼𝗿 𝗖𝗵𝗶𝗽𝗹𝗲𝘁 𝗜𝗻𝘁𝗲𝗴𝗿𝗮𝘁𝗶𝗼𝗻 𝗙𝗿𝗮𝗺𝗲𝘄𝗼𝗿𝗸:  Ensuring true interoperability and eliminating vendor lock-in. 𝗧𝗲𝘀𝘁 𝗖𝗵𝗶𝗽 & 𝗥𝗲𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗕𝗼𝗮𝗿𝗱:  Demonstrating viability and building confidence in automotive chiplets 𝗔𝘂𝘁𝗼𝗺𝗼𝘁𝗶𝘃𝗲-𝗚𝗿𝗮𝗱𝗲 𝗦𝗼𝗳𝘁𝘄𝗮𝗿𝗲 𝗦𝘁𝗮𝗰𝗸: Ensuring compliance and reliability for safety-critical SDVs. 𝗜𝗻-𝗩𝗲𝗵𝗶𝗰𝗹𝗲 𝗗𝗲𝗺𝗼𝗻𝘀𝘁𝗿𝗮𝘁𝗼𝗿: Real-world validation for deployment in series vehicles. By enabling top European players to co-design advanced computing platforms, CHASSIS will make a significant contribution to strengthening the region’s technological sovereignty. With partners already contributing resources and covering costs, the project clearly demonstrates a shared vision for the future of automotive electronics. Join us in shaping this future. Find out more about CHASSIS on our website (link in the comments). And watch this space for CHASSIS news! Ampere Axelera AI Arteris BMW Group Bosch Commissariat a l'Energie Atomique et aux Energies Alternatives Fondazione Chips-IT Fraunhofer-Gesellschaft imec Infineon Technologies Menta SAS NXP Semiconductors Renault Siemens Stellantis Tenstorrent TTTech Auto Valeo